• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2009년도 9th International Meeting on Information Display
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• pp.1305-1307
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• 2009

We have investigated the new modification of poly (vinyl phenol) (PVP) for low hysteresis organic thin film transistors (OTFTs). In order to suppression of hysteresis phenomenon, synthesized various backbone structure polymeric gate dielectric. The modified polymeric dielectric was synthesized by inducing ringshape phenol backbone structure instead of conventional chain. We could be observed that relieved hysteresis and excellent air stability from ring-shape phenol backbone structure.

• 한국세라믹학회지
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• 제41권1호
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• pp.9-12
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• 2004

The effect of x wt% CuO-y wt% $V_2O_5$ content on the microwave properties of $(Pb_{0.45}Ca_{0.55})[(Fe_{0.5}Nb_{0.5})_{0.9}Sn_{0.1}]O_3$ (PCFNS) ceramics was investigated. In order to decrease the sintering temperature and use as a Low Temperature co-firing Ceramics (LTCC), CuO-$V_2O_5$ are added in the PCFNS. The bulk density, dielectric constant (${\varepsilon}_r$) and quality factor(Q${\cdot}f_0$) increased with increase in CuO content within a limited value. The microwave properties were degraded with increases in $V_2O_5$ content. The temperature coefficient of the resonant frequency (${\tau}_f$) of PCFNS was shifted to positive value abruptly with increasing the $V_2O_5$ content, while the ${\tau}_f$ was slightly shifted to positive value with increasing the CuO content. The optimized microwave properties, ${\varepsilon}_r$ = 88, Q${\cdot}f_0$ = 6100 (GHz), and ${\tau}_f$ = 18 ppm/$^{\circ}C$, were obtained in $(Pb_{0.45}Ca_{0.55})[(Fe_{0.5}Nb_{0.5})_{0.9}Sn_{0.1}]O_3$ with 0.2wt% CuO 0.05 wt% $V_2O_5$ and sintered at $1000^{\circ}C$ for 3 h. The relationship between the microstructure and microwave dielectric properties of ceramics was studied by X-Ray Diffraction (XRD) and Scanning Electron Microscopy (SEM)

• 한국전기전자재료학회논문지
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• 제22권2호
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• pp.132-136
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• 2009

SiOC thin film of hybrid-type that is the limelight as low dielectric material of next generation were deposited by plasma enhanced chemical vapor deposition (PECVD) method with bistrimethylsilylmethane (BTMSM) precursor increased by 2 sccms from 24 sccms to 32 sccm. Manufactured samples are analyzed components by measuring FT/IR absorption lines. It is a tendency that seems to be growing of Si-O-Si(C) bonding group and narrowing of Si-O-$CH_3$ bonding group relative to the increasing flow-rate BTMSM. The chemical shift in the XPS analysis was shown in the specimens between the BTMSM=26 sccm and BTMSM = 28 sccm. The binding energy of Si 2p, C 1s and O 1s electron orbit spectra was the low-est at the specimen of the BTMSM=26 sccm. From the results of electrical Properties using the 1 MHz C - V measurements, the dielectric constant was 2.32 at the specimen with the BTMSM = 26 sccm.

• 한국진공학회지
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• 제19권5호
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• pp.347-352
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• 2010

SiOC 박막의 유전상수를 서로 다른 2가지 방법을 사용하여 계산하고 그 차이점에 대하여 비교분석하였다. SiOC 박막의 유전장수는 전형적인 유전상수 측정법으로써 MIS 구조를 이용하여 C-V 측정법에 의하여 얻을 수 있으며, 또한 엘립소미터를 이용한 굴절률로부터 $n^2$을 구하는 방법이 있다. SiOC 박막의 유전상수는 쌍극자, 이온, 전자의 성분으로 이루어지며, 댁개 쌍극자 성분은 무시된다. 박막을 증착하는 동안 플라즈마에 의한 프리커서의 해리로부터 이온결합이 생성되면서 증착된다. 증착한 박막의 유전상수는 주로 이온결합 효과가 주를 이루었다. 열처리를 하면서 OH 수산기의 기화에 의해 유전상수는 감소되는데 이때 이온의 효과도 더불어 감소하게 된다. 상대적으로 무시되었던 전자에 의한 분극의 효과가 나타나면서 유전상수는 더욱 감소하였다. 하지만 물리 화학적 그리고 전기적으로 안정된 SiOC 박막은 이온과 전자에 의한 분극의 효과가 없어지는 무 분극성의 박막으로서 유전상수는 열처리한 박막에서 2.0 정도인 것으로 측정되었다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2007년도 제32회 학술대회 초록집
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• pp.108-108
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• 2007

• KIEE International Transactions on Electrophysics and Applications
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• 제4C권2호
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• pp.73-76
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• 2004

0-3 PbTiO$_3$/P(VDF/TrFE) nanocomposite thin films for passive pyroelectric infrared sensors were fabricated by a two-step spin coating technique. 65wt% VDF and 35 wt% TrFE was formed into a P(VDF/TrFE) powder. Nano size PbTiO$_3$ powder was used. 0-3 connectivity of PbTiO$_3$/P(VDF/TrFE) composite film was successfully achieved and observed using SEM photography. The dielectric constant and pyroelectric coefficient were measured and compared with P(VDF/TrFE). A very low dielectric constant (13.48 at 1KHz and sufficiently high pyroelectric coefficient (3.101 nC/$\textrm{cm}^2$ㆍk at 5$0^{\circ}C$) were measured. This nanocomposite can be used for a new pyroelectric infrared sensor to achieve better performance.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1996년도 추계학술대회 논문집
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• pp.164-168
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• 1996

The relation between crystallinity and thermal history in low density polyethylene thin films and their effect on electric conduction phenomena and dielectric breakdown was studied. The low density polythylene thin films obtained by the solution growth method heat-treated at 140[$^{\circ}C$] for 2 h and subsequently cooling to various ways. The degree of crystallinity was estimated by the X-ray diffraction measurement for the specimen of slowly cooling, ICE quenching and liquid nitrogen quenching. The result shows that the crystallinity decreases become faster as the cooling speed increased, and that conduction phenomenon is governed by the space charge limited current in high field. It was found that the dielectric breakdown field increases with an increase in cooling speed and test number in self-healing breakdown method.

• KIEE International Transactions on Electrophysics and Applications
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• 제2C권6호
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• pp.281-286
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• 2002

The temperature accelerated dielectric breakdown strength of on-wafer low-k dielectric polymer films with thicknesses ranging from 94 nm to 1141 nm is investigated by using the current-voltage characteristic measurements with MIS structures. The temperature dependence of dielectric strength is demonstrated to be Arrhenious for all thicknesses. However, the activation energy is found to be strongly thickness dependent. It follows an exponential relationship rather than being a single value, i.e., the activation energy increase significantly as film thickness increases for the thickness below 500 nm, but it is almost constant for the thickness above 500 nm. This relationship suggests that the change of the activation energy corresponding to different film thickness is closely related to the temperature dependence of the electron trapping/detrapping process in polymer thin films, and is determined by both the trapping rate and the detrapping rate. Thinner films need less energy to form a conduction path compared to thicker films. Hence, it leads to smaller activation energy in thinner films, and the activation energy increases with the increase in film thickness. However, a nearly constant value of the activation energy is achieved above a certain range of film thickness, indicating that the trapping rate and detrapping rate is almost equal and eventually the activation energy approaches the value of bulk material.

• 한국표면공학회지
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• 제34권5호
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• pp.481-485
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• 2001

We investigated the structural and electrical properties of the Ba ($Zr_{x}$ $T_{il-x}$ )$O_3$ (BZT thin films with a mole fraction of x=0.2 and thickness 150 nm for the application in MLCC (Multilayer Ceramic Capacitor). BZT films were prepared on $Pt/SiO_2$/Si substrate at various substrate temperatures by the RF-magnetron sputtering system. When the substrate temperature was above $500^{\circ}C$, we could obtain multi-crystalline BZT films oriented at (110), (111), and (200) directions. The crystallization of the film and high dielectric constant were observed with the increase of substrate temperature. Capacitance of the film deposited at high temperature is more sensitive to the applied voltage than that of the film deposited at low temperature. This paper reports surface morphology, dielectric constant, dissipation factor, and C-V characteristics for BZT films deposited at three different temperatures. The BZT film deposited at 40$0^{\circ}C$ shows stable electrical properties but a little small dielectric constant for MLCC application.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2004년도 Asia Display / IMID 04
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• pp.305-308
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• 2004

We present a novel process for the ultra low temperature (<150$^{\circ}C$) polycrystalline silicon (ULTPS) TFT for the flexible display applications on the plastic substrate. The sequential lateral solidification (SLS) was used for the crystallization of the amorphous silicon film deposited by rf magnetron sputtering, resulting in high mobility polycrystalline silicon (poly-Si) film. The gate dielectric was composed of thin $SiO_2$ formed by plasma oxidation and $Al_2O_3$ deposited by plasma enhanced atomic layer deposition. The breakdown field of gate dielectric on poly-Si film showed above 6.3 MV/cm. Laser activation reduced the source/drain resistance below 200 ${\Omega}$/ㅁ for n layer and 400 ${\Omega}$/ㅁ for p layer. The fabricated ULTPS TFT shows excellent performance with mobilities of 114 $cm^2$/Vs (nMOS) and 42 $cm^2$/Vs (pMOS), on/off current ratios of 4.20${\times}10^6$ (nMOS) and 5.7${\times}10^5$ (PMOS).