• Bulletin of the Korean Chemical Society
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• v.35 no.6
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• pp.1832-1836
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• 2014

A deep understanding of the metallic silver catalysts formation process on oxide support and the formation mechanism is of great scientific and practical meaning for exploring better catalyst preparing procedures. Herein the thermal decomposition process of supported silver catalyst with silver oxalate as the silver precursor in the presence of ethylenediamine and ethanolamine is carefully investigated by employing a variety of characterization techniques including thermal analysis, in situ diffuse reflectance infrared Fourier transform spectroscopy, scanning electron microscopy, and X-ray diffraction. The formation mechanism of supported silver particles was revealed. Results showed that formation of metallic silver begins at about $100^{\circ}C$ and activation process is essentially complete below $145^{\circ}C$. Formation of silver was accompanied by decomposition of oxalate group and removal of organic amines. Catalytic performance tests using the epoxidation of ethylene as a probe reaction showed that rapid activation (for 5 minutes) at a relatively low temperature ($170^{\circ}C$) afforded materials with optimum catalytic performance, since higher activation temperatures and/or longer activation times resulted in sintering of the silver particles.

• Proceedings of the KIEE Conference
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• 1998.07d
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• pp.1303-1305
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• 1998

In order to reduce or avoid oxidation problem at operation the interconnects in SOFCs have so far mostly been made of ceramic material. It has high chemical stability both under cathode and anode condition, relatively thermal expansion coefficient that matchs that of electrolyte material YSZ. But this material shown rather weak in the low oxygen atmosphere and thermal shock, and it has lower mechanical strength than alloys. To avoid these problems one may consider to use metals or alloys as materials for interconnects. Metallic interconnects are advantageous because of their high thermal and electronic conductivities. But it has some problems, Those are high thermal expansion and oxidation at high temperature in air. To solve these problems in the interconnection material in this study, $LaCrO_3$-dispersed Cr alloys for metallic interconnector of SOFC have been investigated as a fuction of $LaCrO_3$ content in the range of 5 to 25 vol.%. The Cr alloy were prepared by mixing Cr and $LaCrO_3$ powders in high-energy ball mill for 48h and by sintering under Ar atmosphere with 5vol.% $H_2$ for 10h at $1500^{\circ}C$. The alloys had a relative density of 95% and above. The Cr alloys in composed of two kind of small $LaCrO_3$ and large Cr particles. As the $LaCrO_3$ content increased, the Cr particle size decreased but the $LaCrO_3$ particle size remained contant. Also the oxidation tests show that the $LaCrO_3$-dispersed Cr is very resistant to oxidation in air. These results means that $LaCrO_3$-dispersed Cr is a useful material for metallic interconnect of planar SOFC.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.195-195
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• 2008

CAS계 유리에 $CaCO_3-Al_2O_3$ 혼합물 및 화합물을 10, 30 wt% 첨가하여 저온 소걸 및 마이크로파 유전 특성을 고찰하였다. CAS계 유리의 연화온도는 $841^{\circ}C$ 이며, CAS계 유리에 $CaCO_3$ 와 30 wt%의 $CaCO_3-Al_2O_3$ 혼합물을 melting되며, 10 wt%의 $CaCO_3$, $Al_2O_3$, $1CaCO_3-1Al_2O_3$ 혼합물 및 $CaAl_2O_4$ 화합물를 10 wt% 첨가하였을 때 $900^{\circ}C$ 이하에서 소걸이 가능하였다. 복합체의 XRD 상 분석 결과, CaCO3를 첨가하였을 때에는 모든 조성이 비정질을 나타내었고, $Al_2O_3$와 $1CaCO_3-1Al_2O_3$ 혼합물은 $Al_2O_3$ 결정상이 생성되었고, $CaAl_2O_4$ 화합물은 $CaAl_2Si_2O_8$의 hexagonal와 anorthite 결정상이 생성되었다. 따라서 CAS-10 (A, C-A, CA) 복합체는 $900^{\circ}C$에서 각각 유전율 ($\varepsilon_r$) 6.4, 6.9, 5.15 와 품질계수 ($Q^*f$) 2,400, 1,500, 3,000의 마이크로파 유전 특성을 나타내어 LTCC 기판 재료로 사용이 가능하며, 특히 $CaAl_2O_4$ 화합물을 사용하였을 때 가장 우수한 유전 특성을 나타내는 것을 확인하였다.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.14 no.4
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• pp.62-72
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• 2015

Interest in three-dimensional (3D) printing processes has grown significantly, and several types have been developed. These 3D printing processes are classified as Selective Laser Sintering (SLS), Stereo-Lithography Apparatus (SLA), and Fused Deposition Modeling (FDM). SLS can be applied to many materials, but because it uses a laser-based material removal process, it is expensive. SLA enables fast and precise manufacturing, but available materials are limited. FDM printing's benefits are its reasonable price and easy accessibility. However, metal printing using FDM can involve technical problems, such as suitable component supply or the thermal expansion of the heating part. Thus, FDM printing primarily uses materials with low melting points, such as acrylonitrile butadiene styrene (ABS) or polylactic acid (PLA) resin. In this study, an FDM process for enabling metal printing is suggested. Particularly, the nozzle and heatsink for this process are focused for stable printing. To design the nozzle and heatsink, multi-physical phenomena, including thermal expansion and heat transfer, had to be considered. Therefore, COMSOL Multiphysics, an FEM analysis program, was used to analyze the maximum temperature, thermal expansion, and principal stress. Finally, its performance was confirmed through an experiment.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.396-400
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• 2003

A new synthesis process for nano laminating Ti$_3$SiC$_2$ has been developed using TiCx (x=0.67) and Si powder as starting materials by a reaction hot pressing. Bulk Ti$_3$SiC$_2$ was fabricated using a green body consisting of TiCx and Si by a hot pressing under the pressures of 25 MPa at 1420-1550 $^{\circ}C$ for 90 min. The synthesized Ti$_3$SiC$_2$ was consisting of only TiCx and Ti$_3$SiC$_2$. The relative density of sintered bulk Ti$_3$SiC$_2$ was increased as the hot pressing temperature was increased, which was mainly due to the increase in TiCx contents in synthesized Ti$_3$SiC$_2$. The synthesized Ti$_3$SiC$_2$ bulk was consisted of nano sized lamella structure of 20-100 nm in thickness. It was found that TiCx particles in Ti$_3$SiC$_2$ would increase the 3-point bending strength of synthesized Ti$_3$SiC$_2$ bulk. The maximum 3-P. bending strength of synthesized Ti$_3$SiC$_2$ bulk was more than 800 MPa. The Vickers hardness of synthesized Ti$_3$SiC$_2$bulk was as low as 5 Gpa, which was decreased with the indentation load. The quasi-plastic deformation behaviors were observed around indentation mark on Ti$_3$SiC$_2$.

• Journal of the Korean Ceramic Society
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• v.45 no.3
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• pp.157-160
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• 2008

A series of $La_2O_3$-added zincborosilicate glasses was fabricated by systematically varying $La_2O_3$ addition up to 15mol% under the constraint of a ZnO:$B_2O_3$ ratio of 1:2. The degree of water leaching after ball milling of the prepared glasses in water medium was relatively quantified by the change in zinc peak intensity in energy dispersive spectroscopy. 8mol% of $La_2O_3$ was the most efficient addition in inhibiting the glass leaching by water. The role of $La_2O_3$ in inhibiting the leaching was explained in terms of change of structural units in the glass network. When the optimum 8mol% $La_2O_3$-added ZnO-$B_2O_3$ glass was used as sintering aid for $Al_2O_3$, the fabricated alumina-glass composite at $875^{\circ}C$ demonstrated dielectric constant of 6.11 and quality factor of 15470 GHz, indicating the potential of leaching-minimized $La_2O_3-ZnO-B_2O_3$ glass for application to low temperature co-firing ceramic technology.

• Journal of Electrochemical Science and Technology
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• v.11 no.1
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• pp.60-67
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• 2020

In this study, copper (II) oxide powder for electroplating was prepared by recovering CuCl₂ from NaClO₃ type etching wastes via recovered non-sintering two step chemical reaction. In case of alkali copper carbonate [mCuCo₃·nCu(OH)₂], first reaction product, CuCo₃ is produced more than Cu(OH)₂ when the reaction molar ratio of sodium carbonate is low, since m is larger than n. As the reaction molar ratio of sodium carbonate increased, m is larger than n and Cu(OH)₂ was produced more than CuCO₃. In the case of m has same values as n, the optimum reaction mole ratio was 1.44 at the reaction temperature of 80℃ based on the theoretical copper content of 57.5 wt. %. The optimum amount of sodium hydroxide was 120 g at 80℃ for production of copper (II) oxide prepared by using basic copper carbonate product of first reaction. At this time, the yield of copper (II) oxide was 96.6 wt.%. Also, the chloride ion concentration was 9.7 mg/L. The properties of produced copper (II) oxide such as mean particle size, dissolution time for sulfuric acid, and repose angle were 19.5 mm, 64 second, and 34.8°, respectively. As a result of the hole filling test, it was found that the copper oxide (II) prepared with 120 g of sodium hydroxide, the optimum amount of basic hydroxide for copper carbonate, has a hole filling of 11.0 mm, which satisfies the general hole filling management range of 15 mm or less.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.11a
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• pp.185-186
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• 2005

저온소결 Glass/Ceramic계 기판재료 조성으로 $Al_2O_3$, $SiO_2$, Cordierite, $Al_2O_3{\cdot}3SiO_2$의 4가지 filler에 zinc-borosilicate(ZBS) glass를 첨가하여 기판재료로의 사용가능성을 조사하였다. 4가지 filer에 ZBS glass를 30$\sim$50vol%첨가하여 $700\sim950^{\circ}C$에서 2시간 소결한 결과 40, 50vol%첨가 했을 때 900$^{\circ}C$에서 치밀한 소결체를 얻을 수 있었다. LSI칩 신호라인의 빠른 신호전달에 직접적인 영향을 주는 유전율은 기존의 $Al_2O_3$기관($\fallingdotseq$9.7)보다 저유전율 ($900^{\circ}C$에서 $Al_2O_3$-50vol%ZBS 5.7, $SiO_2$-50vol%ZBS 5.9, Cordierite-40vo1%ZBS 5.9, $Al_2O_3${\cdot}3SiO_2$-50vol%ZBS 4.9)을 나타내어 저온소결 기판재료로 사용이 가능함을 확인하였다.

• Journal of Powder Materials
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• v.21 no.6
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• pp.467-472
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• 2014

RBSC (reaction-bonded silicon carbide) represents a family of composite ceramics processed by infiltrating with molten silicon into a skeleton of SiC particles and carbon in order to fabricate a fully dense body of silicon carbide. RBSC has been commercially used and widely studied for many years, because of its advantages, such as relatively low temperature for fabrication and easier to form components with near-net-shape and high relative density, compared with other sintering methods. In this study, RBSC was fabricated with different size of SiC in the raw material. Microstructure, thermal and mechanical properties were characterized with the reaction-sintered samples in order to examine the effect of SiC size on the thermal and mechanical properties of RBSC ceramics. Especially, phase volume fraction of each component phase, such as Si, SiC, and C, was evaluated by using an image analyzer. The relationship between microstructures and physical properties was also discussed.

• Journal of Powder Materials
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• v.24 no.6
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• pp.450-456
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• 2017

Reaction-bonded silicon carbide (RBSC) is a SiC-based composite ceramic fabricated by the infiltration of molten silicon into a skeleton of SiC particles and carbon, in order to manufacture a ceramic body with full density. RBSC has been widely used and studied for many years in the SiC field, because of its relatively low processing temperature for fabrication, easy use in forming components with a near-net shape, and high density, compared with other sintering methods for SiC. A radiant tube is one of the most commonly employed ceramics components when using RBSC materials in industrial fields. In this study, the mechanical strengths of commercial RBSC tubes with different sizes are evaluated using 3-point flexural and C-ring tests. The size scaling law is applied to the obtained mechanical strength values for specimens with different sizes. The discrepancy between the flexural and C-ring strengths is also discussed.