• 산업기술연구
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• 제31권A호
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• pp.109-112
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• 2011

In this paper, we proposed a planar reversed triangle monopole antenna for UWB(Ultra Wideband) communication. RF-60A substrate of 0.64 mm thickness and 6.15 relative permitivity and 0.035 mm conductor of thickness and loss tangent 0.0025 is used for implementation. We have used Ansoft $HFSS^{TM}$(High Frequency Structure Simulator) to simulate the proposed antenna. The proposed antenna showed return losses about -10 dB, nearly omni-directional radiation patterns and maximum gains are over -5 dBi at the frequency band from 3.1 GHz to 10.6 GHz for ultra wide band communication.

• 유변학
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• 제10권1호
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• pp.7-13
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• 1998

중량 평균 분자량이 1.22$\times$106이고 다분산도가 8.90이며 수분과 아밀로오스 함량이 각각 9.35%, 27%인 도토리 전분에 sucrose를 첨가하여 동적 유변학적 특성에 대한 온도와 농도의존성을 고찰하였다. AS(acorn starch)-sucrose 계의 점도는 전단속도가 증가하면 감 소하는 전단담화 현상을 나타내며 sucrose 농도가 증가할수록 점도가 증가하였고, Casson 식에 의해 얻어진 항복치는 sucrose 농도가 증가하면 증가하였다. 저장영률과 손실영률은 sucrose 농도가 증가하면 단일하게 증가하였고 손실 탄성률은 온도가 증가하면 감소하였다. DSC 측정자료를 zipper model에 적용시켜 본 결과 sucrose 농도가 증가할수록 zipper의 수 와 junc-tion zone의 수는 증가했으며 크기는 감소하였다. Sucrose는 전분과 수소결합을 형 성하여 용액내에서 가소제처럼 거동함을 알수있었다.

• 대한화학회지
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• 제53권1호
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• pp.42-50
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• 2009

유전율-분광법과 교류 전도도 측정 연구를 망간이 혼입된 층상구조의 $Na_{1.9}Li_{0.1}Ti_3O_7$에 시도하였다. 373-723K 온도와 100Hz-1MHz 주파수 영역에서 loss 탄젠트 (Tan$\delta$), 상대적 유전율 ($\varepsilon_{r}$) 그리고 교류 전도 도 ($\sigma_{ac}$)의 의존성을 혼입 유도체들에 대하여 조사하였다. 다양한 전도도 메커니즘이 존재하는데 MSLT-1과 MSLT-2의 경우에는 낮은 온도영역에서 전자에 의한 전도도를 보인다. MSLT-3의 경우에는 금지된 층간 이온 전 도도가 전자 전도도와 함께 존재한다. 이러한 층간 이온 전도도는 모든 혼입 유도체들에 대하여 중간 온도 영역에 존재한다. 가장 높은 온도 영역에서는 MSLT-1과 MSLT-2의 경우에는 이온 전도도와 polaron에 의한 전도도가 존재하고 MSLT-3에 대하여는 이온 전도도 만이 존재한다. 망간이 혼입된 층상구조의 $Na_{1.9}Li_{0.1}Ti_3O_7$에서 Loss 탄젠트 (Tan$\delta$)는 전자 전도도와 쌍극자의 위치, 그리고 공간 전하 분극화에 기인한다. 상대적 유전율의 증가는 층간 에 쌍극자 수의 증가에 기인하고 반면 상대적 유전율의 감소는 높은 혼입율에 따른 누전 전류의 증가에 기인한다.

• Restorative Dentistry and Endodontics
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• 제25권3호
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• pp.359-370
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• 2000

The purpose of this investigation was to observe the viscoelastic properties of five commercial flowable(Aeliteflo, Flow it, Revolution, Tetric flow, Compoglass flow), three conventional hybrid(Z-100, Z-250, P-60) and two condensable(Synergy compact, SureFil) resin composites. A dynamic oscillatory shear test was done to evaluate the storage shear modulus (G'), loss shear modulus(G"), loss tangent(tan ${\delta}$) and complex viscosity(${\eta}^*$) of the resin composites as a function of frequency - dynamic frequency sweep test from 0.01 to 100 rad/s at $25^{\circ}C$ - by using Advanced Rheometric Expansion System(ARES). To investigate the effect on the viscosity of resin composites of filler volume fraction, the filler weight % and volume % were measured by means of Archimedes' principle using a pyknometer. The results were as follows 1. The complex viscosity ${\eta}^*$ of flowable resins was lower than that of hybrid resins and significant differences were observed between brands. The complex viscosity ${\eta}^*$ of condensable resins was higher than that of hybrid resins. The order of complex viscosity ${\eta}^*$ at ${\omega}$=10 rad/s was as follows, Surefil, Synergy compact, P-60, Z-250, Z-100, Aeliteflo, Tetric flow, Compoglass flow, Flow it, Revolution. The relative complex viscosity of flowable resins compared to Z-100 was 0.04~0.56 but Surefil was 30.4 times higher than that of Z-100. 2. The storage shear modulus G' and the loss shear modulus G" of flowable resins were lower than those of hybrid resins but those of condensable resins were higher. The patterns of the change of loss tangent, tan ${\delta}$, of resin composites with increasing frequency were significantly different between brands. The phase angles, ${\delta}$, ranged from $30.2{\sim}78.1^{\circ}$ at ${\omega}$=10 rad/s. 3. All composite resins represent pseudoplastic nature with increasing shear rate. 4. The complex shear modulus $G^*$ and the phase angle ${\delta}$ was represented by the frequency domain phasor form, $G^*({\omega})=G^*e^{i{\delta}}=G^*{\angle}{\delta}$. The locus of frequency domain phasor plots in a complex plane was a valuable method that represent the viscoelastic properties of composite resins. 5. There was no direct linear correlationship but a weak positive relation was observed between filler volume % or weight % and the viscosity of the resin composites.

• 비파괴검사학회지
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• 제20권5호
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• pp.402-411
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• 2000

이 연구에서는 점탄성 재료중의 하나인 아스팔트 세멘트의 점탄성 특성을 초음파를 이용하여 측정하는 방법에 대하여 고찰하였다. 2.25MHz의 주파수에서 $-20^{\circ}C$부터 $60^{\circ}C$까지의 온도변화에 따른 파속도와 감쇠를 측정한 후, 선형 점탄성 이론에 근거하여 저장 및 손실 종탄성율, 손실 탄젠트, 저장 및 손실 종컴플라이언스와 같은 물성변화를 구하였다. Maxwell과 Voigt-Kelvin 점탄성 모델을 이용하여 응력완화 및 크리프 거동과 점도의 변화도 예측하였다. 또한 중첩원리와 이동인자의 타당성을 문헌에 보고된 결과와 비교함으로써 입증할 수 있었다.

• 한국전기전자재료학회논문지
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• 제26권11호
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• pp.810-815
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• 2013

In this study, the capacitance and dielectric loss tangent of the silicone rubber which is combined with filler (30 phr~50 phr) have been measured on the range of 100 Hz~100 kHz and $30{\sim}170^{\circ}C$. It was found that when the frequency is 0.1 kHz~100 kHz and the silicone rubber is combined with 30 phr to 50 phr of filler, the capacitance of silicone rubber has increased by about 28.6 pF to 33 pF in 30 phr of filler, about 20 pF to 46.1 pF in 40 phr of filler and about 36.4 pF to 44 pF in 50 phr of filler. It seems that the volume of dielectric loss has gradually increased due to the temperature rise and the rotating of dipole in electric field through the electric dipole generated by the Si-O group which is induced by adding of filler, or the carbonyl group which is caused by oxidation. It seems that the dielectric dispersion in 0.1 kHz is caused by molecular motion of Siloxane group in main chain, and the dielectric dispersion in 10 kHz is caused by molecular motion of Methyl group in side chain.

• 한국재료학회지
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• 제21권7호
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• pp.377-383
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• 2011

Thermoelectric power, dc conductivity, and the dielectric relaxation properties of $La_2NiO_{4.03}$ are reported in the temperature range of 77 K - 300 K and in a frequency range of 20 Hz - 1 MHz. Thermoelectric power was positive below 300K. The measured thermoelectric power of $La_2NiO_{4.03}$ decreased linearly with temperature. The dc conductivity showed a temperature variation consistent with the variable range hopping mechanism at low temperatures and the adiabatic polaron hopping mechanism at high temperatures. The low temperature dc conductivity mechanism in $La_2NiO_{4.03}$ was analyzed using Mott's approach. The temperature dependence of thermoelectric power and dc conductivity suggests that the charge carriers responsible for conduction are strongly localized. The relaxation mechanism has been discussed in the frame of the electric modulus and loss spectra. The scaling behavior of the modulus and loss tangent suggests that the relaxation describes the same mechanism at various temperatures. The logarithmic angular frequency dependence of the loss peak is found to obey the Arrhenius law with activation energy of ~ 0.106eV. At low temperature, variable range hopping and large dielectric relaxation behavior for $La_2NiO_{4.03}$ are consistent with the polaronic nature of the charge carriers.

• ETRI Journal
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• 제42권4호
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• pp.575-584
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• 2020

Electromagnetic (EM) waves used to send signals under seawater are normally restricted to low frequencies (f) because of sudden exponential increases of attenuation (𝛼) at higher f. The mathematics of EM wave propagation in seawater demonstrate dependence on relative permeability (𝜇_r), relative permittivity (𝜀_r), conductivity (𝜎), and f of transmission. Estimation of 𝜀_r and 𝜎 based on the W. Ellison interpolation model was performed for averaged real-time data of temperature (T) and salinity (S) from 1955 to 2012 for all oceans with 41 088 latitude/longitude points and 101 depth points up to 5500 m. Estimation of parameters such as real and imaginary parts of 𝜀_r, 𝜀_r', 𝜀_r", 𝜎, loss tangent (tan 𝛿), propagation velocity (V_p), phase constant (𝛽), and α contributes to absorption loss (L_a) for seawater channels carried out by using normal distribution fit in the 3 GHz-40 GHz f range. We also estimated total path loss (L_PL) in seawater for given transmission power P_t and antenna (dipole) gain. MATLAB is the simulation tool used for analysis.

• 한국전자파학회논문지
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• 제25권11호
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• pp.1128-1134
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• 2014

본 논문에서는 자계 집속을 위해 메타 물질 slab을 포함하는 무선 전력 전송 성능을 공진기의 유효 Q-factor와 결합계수 예측식을 사용하여 요소적으로 분석하였다. 구체적으로, 메타 물질이 갖는 손실을 고려한 등가회로를 제안하고, 이를 이용하여 무선 전력 전송 시스템을 분석하였다. 손실이 없는 이상적 또는 저손실 메타 물질이 시스템에 삽입될 경우, 음의 투자율로 인한 자계 집속으로 인해 전송 효율이 대폭적으로 개선될 수 있다. 하지만 음의 투자율을 구현하기 위해 RR (Ring Resonator) 또는 SRR(Split Ring Resonator)로 메타 물질을 설계할 경우, 구조에 의한 손실로 효율 증가에 악영향을 끼치게 된다. 점 자하 소스가 아닌 실제의 루프 공진기에 손실이 있는 메타 물질을 사용하여 전송 효율을 향상시키기 위해서는, 메타 물질의 폭을 송수신 공진기 간 거리의 반 이하에서 최적화하여야 한다. 손실 탄제트가 0.001인 메타 물질이 두 공진체 사이에 삽입되었을 때는 그 폭과 두 공진기 사이의 거리의 비가 약 0.35일 때 전송 효율이 93%(메타물질 사용하지 않은 경우는 53 %)로 최대가 되었으며, 손실 탄젠트가 0.2(실제 손실과 유사)를 갖는 메타 물질이 삽입될 경우, 그 비가 약 0.25에서 약 61 %의 최대 전송효율을 나타내었다.

• 한국재료학회:학술대회논문집
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• 한국재료학회 1994년도 추계 학술발표 강연 및 논문 개요집
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• pp.125-126
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• 1994

The chemorheological changes and kinetics during curing reaction of an silica filled epoxy system (DGEBA with curing agent Polyxoypropylenediamine) were investigated. This study concentrates on the influence of silica on the reaction kinetics and rheological behavior of the eopxy system. The concentration of the filler was varied 0~200phr. Curing behavior of the silica filled epoxy system was measured at various heating rates with DSC. Conversion was also measured by integrating the obtained DSC curve and Kinetic parameters measured by using the nonlinear regression method. DSC experiments showed that the presence of silica was found to accelerate the progress of the curing reaction and of reduce the heat of reaction compared with that of unfilled epoxy systems . Rheological experiments were conducted on a Physica by using a disposable parallel plate fixture. Material properites were measured such as the elastic modulus(G′), the loss modulus(G"), the loss tangent(tan $\delta$), and the viscosity was at the initial stahe, and the more the silica filler was added, and the lower the gel temperature was in the epoxy system. In this study it is concluded that the curing of the silica filled epoxy system was found to be accelerated, as silica was added to the epoxy compound.