• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 한국소성가공학회 2009년도 춘계학술대회 논문집
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• pp.168-171
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• 2009

High-frequency induction is an efficient way to heat mold surface by electromagnetic induction in a non-contact procedure. Though the induction heating has an advantage in terms of its rapid-heating capacity on the mold surface, it still has a restriction on mold temperature control due to geometric restriction of an induction coil according to the mold shape. It has been recently applied to the injection molding of thin-walled parts or micro/nano structures. For localized induction heating, an injection mold composed of ferromagnetic material and paramagnetic material is used. The electromagnetic induction concentrates on the ferromagnetic material, from which we can selectively heat for the local mold elements. The present study proposed a localized induction heating method by means of selective use of mold material. The feasibility of the proposed heating method is investigated through the comparison of experimental observations according to the mold material.

• Journal of the Korean Society for Nondestructive Testing
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• 제27권3호
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• pp.268-279
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• 2007

The reliability of cold-bonding repair technique of carbon-fiber reinforced plastics (CFRP) laminates, often used as a temporary repair for the airplane maintenance, has been evaluated during cyclic loading and localized heating by nondestructive methods. Major concern was given to the evolution of damage after repair in the form of delaminations due to localized heating and cyclic loading combined. An area of interest both on the specimen repaired by cold-bonding and the specimen without repair where delaminations were induced by localized heating and cyclic loading was monitored by acoustic emission (AE) testing and further examined by pitch-catch low-frequency bond testing, and pulse-echo high-frequency ultrasonic testing. The results showed that the reliability of cold-bonding repair would be significantly reduced by the localized heating and cyclic loading combined rather than by the cyclic loading only. AE monitoring appeared to be an effective and reliable tool to monitor the integrity of temporarily repaired CFRP laminates in terms of the structural health monitoring (SHM) philosophy.

• Proceedings of the KSME Conference
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• 대한기계학회 2008년도 추계학술대회A
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• pp.1119-1123
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• 2008

High-frequency induction is an efficient way to heat mold surface by electromagnetic induction in a noncontact procedure. It has been recently applied to the injection molding of thin-walled parts or micro/nano structures. Though the induction heating has an advantage in terms of its rapid-heating capacity on the mold surface, it still has difficulty in efficient mold temperature control due to the restriction of an induction coil design suitable for the given mold shape. The present study proposed a localized mold heating method by means of selective use of mold material. For localized induction heating, an injection mold composed of ferromagnetic material and paramagnetic material is used. The electromagnetic induction concentrates on the ferromagnetic material, from which we can selectively heat for the local mold elements. The feasibility of the proposed heating method is investigated through an experimental measurement in terms of the heating efficiency on the localized mold surface.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 한국정밀공학회 2002년도 추계학술대회 논문집
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• pp.1033-1036
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• 2002

Wafer bonding methods such as fusion and anodic bonding suffer from high temperature treatment, long processing time, and possible damage to the micro-scale sensor or actuators. In the localized bonding process, beating was conducted locally while the whole wafer is maintained at a relatively low temperature. But previous research of localized heating has some problems, such as non-uniform soldering due to non-uniform heating and micro crack formation on the glass capsule by thermal stress effect. To address this non-uniformity problem, a new heater configuration is being proposed. By keeping several points on the heater strip at calculated and constant potential, more uniform heating, hence more reliable wafer bonding could be achieved. The proposed scheme has been successfully demonstrated, and the result shows that it will be very useful in hermetic packaging. Less than 0.2 ㎫ contact Pressure were used for bonding with 150 ㎃ current input for 50${\mu}{\textrm}{m}$ width, 2${\mu}{\textrm}{m}$ height and 8mm $\times$ 8mm, 5mm$\times$5mm, 3mm $\times$ 3mm sized phosphorus-doped poly-silicon micro heater. The temperature can be raised at the bonding region to 80$0^{\circ}C$, and it was enough to achieve a strong and reliable bonding in 3minutes. The IR camera test results show improved uniformity in heat distribution compared with conventional micro heaters. For gross leak check, IPA (Isopropanol Alcohol) was used. Since IPA has better wetability than water, it can easily penetrate small openings, and is more suitable for gross leak check. The pass ratio of bonded dies was 70%, for conventional localized heating, and 85% for newly developed FP scheme. The bonding strength was more than 30㎫ for FP scheme packaging, which shows that FP scheme can be a good candidate for micro scale hermetic packaging.

• Proceedings of the KSME Conference
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• 대한기계학회 2000년도 춘계학술대회논문집A
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• pp.803-808
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• 2000

This thesis studied whether friction welding of SPSS, localized torsion bar material could be accomplished or not. And then optimum welding conditions were examined and leaded through tensile, impact, torsion and hardness test after postweld heat treatment of the actual field condition. Obtained results were as follows; Linear relationship was existed between heating time and total upset, and a quadratic equation model could be made between tensile strength and heating time. Optimum welding conditions with fine structure were as follows in case total upset(U)=8.5mm; the number of rotations(n)=2,000 rpm, heating pressure($p_1$)=80MPa, upset pressure($p_2$)=200MPa, heating time($t_1$)=4sec, upset time($t_2$)=3 sec.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 한국윤활학회 1987년도 제5회 학술강연회초록집
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• pp.50-56
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• 1987

A mechanical face seal is most commonly used to seal liquids and gases at various speeds, pressures and temperatures. The primary seal ring is in sliding contact with the seal seat and as a result heat in the vicinity of the interface is generated. Local temperatures at points along the circumferential direction will fluctuate as asperities on the surfaces pass. This kind of fluctuation of temperature has been investigated to take place. This may lead to the hot spots phenomenon between the contacting asperities. Sibley and Allen showed photographic evidence of systemically moving hot spots in the contact zone. The appearance of such a temperature disturbance has been attributed to a kind of thermoelastic instabilities between two surfaces: This involves a feedback loop which comprises localized elevation of frictional heating, resultant localized thermal bulding, localized pressure increase as the result of the bulging and futher elevation of frictional heating as the result of the pressure increase. The heating of hot spots will be continued until the expanded material due to the frictional heating is worn off. Therefore to predict the speed of temperature propagation into the body is essential to the analysis of heat transfer on the edge of the seal.

• The Magazine of the Society of Air-Conditioning and Refrigerating Engineers of Korea
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• 제13권3호
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• pp.148-156
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• 1984

The effect of inclination on the steady, two-dimensional, laminar natural convection in rectangular enclosures with localized heating from below has been investigated numerically. The enclosure was uniformly heated with a partial heat source at the center of the bottom wall and cooled from the upper wall while the other walls were insulated. The governing equations were solved numerically by using the ADI finite difference method with the SOR method. The computations were carrid out with air, Pr =0.733, in the Grashof number range, $1\times10^4\~3\times10^4$, for the inclination of the enclosures was varied from $0^{\circ}\;to\;90^{\circ}$. The effects of Grashof number and aspect ratio on the inclination for the transition of the flow pattern in enclosures were determined. From the results, it was found that the transition angles of the flow in the enclosures were greater in localized heating than in uniform heating from below, and that the inclination was to strongly effect on the heat transfer and the flow pattern within the enclosure.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 한국정밀공학회 2002년도 추계학술대회 논문집
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• pp.137-140
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• 2002

The main objectives in the first year include selection of the MEMS bonding methods and feasibility study of selected methods. The ultrasonic bonding method is chosen for MEMS packaging, and the processes to provide localized heating are proposed. The ultrasonic bonding process is analyzed using a lumped model. Preliminary experiments using the eutectic solder and copper pin were performed to verify possibility to MEMS packaging. The preliminary results show possibility of the ultrasonic bonding method for MEMS packaging.

• Transactions of Materials Processing
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• 제11권7호
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• pp.596-600
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• 2002

The ultrasonic bonding method and its feasibility are investigated in this work for joining the micro components and MEMS packaging. The ultrasonic bonding process is analyzed using a lumped mode, and preliminary experiments using the eutectic solder and copper pin were carried out to verify possibility to MEMS packaging. The ultrasonic bonding process appears to be adequate for MEMS packaging by providing localized heating at the selected area. Microscopic behavior of the bond joint through ultrasonic vibration needs further investigation.

• Journal of Welding and Joining
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• 제22권1호
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• pp.65-70
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• 2004

A soldering process with longitudinal ultrasonic is conducted in this work using the Au bump and substrate. Localized heating of the solder is achieved and the stirring action due to the ultrasonic is found to influence the bond strength and microstructure of the eutectic solder The acceptable bonding condition is determined from the tensile strength. Since the multiple bonds can be formed simultaneously with localized heating, the proposed ultrasonic soldering method appears to be applicable to the high-density electronic package.