• Laser Solutions
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• v.2 no.3
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• pp.52-61
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• 1999

The laser induced forward transfer(LIFT) technique employs a pulsed laser to transfer parts of a thin metal film from an optically transparent target onto an arbitrary substrate in close proximity to the metal film on the target. In this work, a two-step method, the combination of LIFT process, in which a Au film deposited on the $Al_2$O$_3$ substrate by Nd:YAG laser and subsequent Au electroless metal plating on the by LIFT process generated Au seed, was presented. The influence of laser parameters, wavelength, laser power, film thickness and overlap ratio of pulse tracks, on the shapes of deposit and conductor line after electroless plating is experimentally studied. As a results, the threshold power densities for ablation, deposition and metallization were determined and comparison of threshold value between the wave length 1064nm and the second harmonic generated 532nm. In odor to determine a possible application in the electronic industry, a smallest conduct spot size, line width and isolated line space were generated.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 1999.03b
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• pp.49-52
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• 1999

Tailored-welded blanks are used for forming of automobile structural and skin components. Its main objective is to achieve weight and production cost reduction in manufacturing of the components. For successful application of tailored-welded blanks design of initial welded blanks and prediction of welding line movement are critical. Here the utilization of the backward tracing scheme of the finite element method shows to be desirable in design of initial welded blanks for net-shape production and in prediction of the welding line movement. First the design of initial blank in forming of welded thick sheet with isotropy is tried and it appears successful in obtaining a net-shape stamping product. Based in the first approach the backward tracing scheme is applied to anisotropic tailored blank. The welding line movement is also discussed.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.24 no.1
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• pp.31-37
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• 2015

A laser line welder using a solid-state laser (Yb:YAG) has been manufactured for joining ultra-thin cold-rolled steel coils in steelworks. The coils to be welded primarily range from 0.15 to 0.3 mm in thickness and 800 to 1,100 mm in width. Because the steel plate is extremely thin, it is very important to control the stop positions of the clamp at cutting and welding points. In this study, both hydraulic proportional control valves and LVDT sensor embedded cylinders were used to precisely control and monitor the positions of clamps with complementary stoppers. As a result, the positions could be controlled within an error of ${\pm}30{\mu}m$. Erichsen cupping tests on the welded joints show that the Erichsen index ranges from 4.4 to 4.6 mm. Furthermore, the tensile strength of welding points is comparable to that of the base metal.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.142-144
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• 2009

We demonstrated narrow and good aspect-ratio inkjet-printed silver lines with multi-time over-printing methods. By using this strategy, narrow silver lines were obtained with 200 nm thickness and their width and gap between printed lines of uniform narrow silver lines were 30 ${\mu}m$ and 17 ${\mu}m$, respectively. It also had good conductivity, sheet resistacne of 0.36 ${\Omega}/{\square}$ and specific resistance of $8{\mu}{\Omega}{\cdot}cm$. In current stress test, narrow silver line with 30 ${\mu}m$ width was able to a current flow up to 50 mA (2.1A/$cm^2$). Using surface treatment on poly-arylate substrate with $UVO_3$, we obtained clean-edge narrow line without any edge waviness.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2006.06a
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• pp.49-54
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• 2006

During most of manufacturing processes of auto-body panels, the trimming line should be designed in advance prior to flanging. It is an important task to find a feasible trimming line to obtain a precise final part shape after flanging. This paper proposes a new fast method to find feasible trimming line based on one-step analysis. The basic idea of the one-step analysis is to seek for the nodal positions in the initial blank from the final part, and then the distribution of strain, stress and thickness in the final configuration can be calculated by comparing the nodal position in the initial blank sheet with the one of the final part. The one-step analysis method is able to predict the trimming line before flanging since the desired product shape after flanging can be defined from the final configuration and most of strain paths are simple during the flanging process. Finally, designers can obtain a discrete trimming line from the boundary of the developed meshes after one-step analysis and import it into CAD system in the early design stage. The proposed method has been successfully applied to two basic curve flanging processes demonstrating many advantages.

• Journal of Ocean Engineering and Technology
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• v.20 no.4 s.71
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• pp.24-30
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• 2006

Different methods exist for the estimation of thermaldeformation of plates in the line heating process. These are based on the assumption of residual strains in the heat-affected zone, known as the method of inherent strains, or simulated relations between heating conditions and residual deformations. The purpose of this paper is to develop a simulator of thermal deformation in the line heating, using the artificial neural network. Curvature deformations for the plate-forming are investigated, which can be used as a prime deformation parameter in the process. The curvature of plates are calculated using the approximation of plate surface by NURBS. Line heating experiments for 11 specimens of different thickness and heating conditions were performed. Two neural networks predicting the maximum temperature and curvature deformations at the heating line are studied. It was concluded that the thermal deformations predicted by the neural network can be used in a line heating simulator, which is considered an attractive and practical alternative to the existing methods.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.2
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• pp.79-84
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• 2016

A flexible electronic device deformed by external force causes the failure of a semiconductor die. Even without failure, the repeated elastic deformation changes carrier mobility in the channel and increases resistivity in the interconnection, which causes malfunction of the integrated circuits. Therefore it is desirable that a semiconductor die be placed on a neutral line where the mechanical stress is zero. In the present study, we investigated the effects of design factors on the position of neutral line by finite element analysis (FEA), and expected the possible failure behavior in a flexible face-down packaging system assuming flip-chip bonding of a silicon die. The thickness and material of the flexible substrate and the thickness of a silicon die were considered as design factors. The thickness of a flexible substrate was the most important factor for controlling the position of the neutral line. A three-dimensional FEA result showed that the von Mises stress higher than yield stress would be applied to copper bumps between a silicon die and a flexible substrate. Finally, we suggested a designing strategy for reducing the stress of a silicon die and copper bumps of a flexible face-down packaging system.

• Journal of the Korean Society for Precision Engineering
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• v.29 no.10
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• pp.1144-1148
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• 2012

Process conditions for generating nano patterns handle different process according to the pattern characteristics, and different process data according to patterns in questions. To efficiently find optimal process conditions for generating nano patterns, process data by experiment is needed consideration of the pattern characteristics concerning the equipment. In particular, coating methods of a cylindrical mold differ from it of a flat plate because of viscosity of coating materials. Also the coating thickness affects nano process and pattern line width. So coating method of coating thickness for cylindrical mold is very important on nano pattern generating. In this study, a method is proposed for coating Photo Resist through the spray in order to coat cylindrical mold and measuring the thickness of coating using measuring tip considering the size of cylindrical mold because there is no method in the existing SEM. The proposed method is applied to a real printed electronics system to verify its accuracy and efficiency.

• Journal of electromagnetic engineering and science
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• v.17 no.4
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• pp.202-207
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• 2017

This paper presents the performance of a planar, low-profile, and wide-gain-bandwidth leaky-wave slit antenna in different thickness values of high-permittivity gallium arsenide substrates at terahertz frequencies. The proposed antenna designs consisted of a periodic array of $5{\times}5$ metallic square patches and a planar feeding structure. The patch array was printed on the top side of the substrate, and the feeding structure, which is an open-ended leaky-wave slot line, was etched on the bottom side of the substrate. The antenna performed as a Fabry-Perot cavity antenna at high thickness levels ($H=160{\mu}m$ and $H=80{\mu}m$), thus exhibiting high gain but a narrow gain bandwidth. At low thickness levels ($H=40{\mu}m$ and $H=20{\mu}m$), it performed as a metasurface antenna and showed wide-gain-bandwidth characteristics with a low gain value. Aside from the advantage of achieving useful characteristics for different antennas by just changing the substrate thickness, the proposed antenna design exhibited a low profile, easy integration into circuit boards, and excellent low-cost mass production suitability.

• Journal of the Korean Chemical Society
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• v.35 no.5
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• pp.539-544
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• 1991

A method to determine the thickness of silicone resin film on zinc eletroplated steel using X-ray compton scattering was investigated. On the basis of the fact that compton scattering process predominates over photoelectric absorption for the light elements such as C, H, O and Si, the compton scattered line of RhK$_{\alpha}$ was used to determine the thickness of silicone resin. In this method, the standard calibration curve for thickness determination of silicone resin film was found to be linear in the range of 0.2~5.0 ${mu}$m film thickness. The analytical results agreed well with those obtained by the gravimetric method and the accuracy was found to be 0.22 ${mu}$m.