• 전기화학회지
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• 제5권3호
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• pp.153-158
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• 2002

전해전착법을 이용한 상감(damascene)구리 배선 충전시 레벨러 효과에 대해 연구하였다. 레벨러를 첨가한 도금액과 첨가하지 않은 도금액을 제조하여 선 폭이 $0.37{\mu}m,\;0.18{\mu}m$인 선형 트렌치를 충전한 후 field emission scanning electron microscope(FE-SEM)로 트렌치 단면을 관찰하였다. 레벨러로 Janus Green B를 사용하였으며, 억제제로서 polyethylene glycol(PEG), 촉진제로서 3-mercapto-1-propansulfonic acid를 사용하였다 레벨러를 첨가하지 않은 경우 $0.37{\mu}m$(종횡비 2.7:1) 트렌치를 공극 없이 충전할 수 있었으나 $0.18{\mu}m$(종횡비 5.25:1) 트렌치에서는 공극(void)이 형성되었다. 레벨러를 첨가한 경우에는 $0.18{\mu}m$ 트렌치를 공극 없이 충전할 수 있었다. 레벨러를 첨가하지 않은 경우 트렌치 모서리에서의 전착속도를 충분하게 억제하지 못하고 거칠게 전착되어 미세한 트렌치 충전시 공극을 형성한 반면, 레벨러를 첨가한 경우는 트렌치 상부모서리에서의 전착속도를 억제하고 균일한 전착을 유도하여 미세한 트렌치를 공극 없이 채울 수 있었다.

• Corrosion Science and Technology
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• 제6권4호
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• pp.154-158
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• 2007

For the application of flexible printed circuit board (FPCB), electroplated copper is required to have low surface roughness and residual stress. In the paper, the effects of surface roughness and residual stress of electroplated copper as thick as $8{\mu}m$ were studied on organic additives such as inhibitor, leveler and accelerator. Polyimide film coated with sputtered copper was used as a substrate. Surface roughness and surface morphology were measured by 3D-laser surface analysis and FESEM, respectively. Residual stress was calculated by Stoney's equation after measuring radius curvature of specimen. The addition of additives except high concentration of accelerator in the electrolyte decreased surface roughness of electroplated copper film. Such a tendency was explained by the function of additives among which the inhibitor and the leveler inhibit electroplating on a whole surface and prolusions, respectively. The accelerator plays a role in accelerating the electroplating in valley parts. The inhibitors and the leveler increased residual stress, whereas the accelerator decreased it. It was thought to be related with entrapped additives on electroplated copper film rather than the preferred orientation of electroplated copper film. The reason why additives lead to residual stress remains for the future work.

• 전력전자학회논문지
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• 제16권1호
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• pp.20-29
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• 2011

본 논문에서는 동특성이 느린 용융탄산염 연료전지 (Molten Carbonate Fuel Cell, MCFC) 스택을 사용하여 계통사고 시 추가적인 UPS (Uninterruptible Power Supply) 없이 비상부하 (Critical Load)로 전력 공급이 가능하고, 사고 발생 후에도 정격전력으로 발전 가능한 비상부하 추종형 백업 시스템을 제안한다. 제안된 MCFC 발전 시스템용 비상부하 추종형 백업 시스템은 3상 인버터로 구성된 PCS (Power Conditioning System) 출력단에 3상 PWM 컨버터를 연결한 구조이고, 비상부하 추종이 가능한 추가적인 제어 알고리즘을 가지는 Load Leveler를 제어한다. 제안된 비상부하 추종형 백업 시스템의 회로와 제어 알고리즘의 타당성을 5kW 기반의 컴퓨터 시뮬레이션을 통하여 검증한다.

• 소성∙가공
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• 제13권6호
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• pp.497-502
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• 2004

The shape of cold rolled steel sheets is defined as the degree of flatness, and the flatter, the better. Because undesirable strip shapes of cold rolled steel sheets can affect not only visible problem but also automatic working process in customer's lines, the requirement of the customers is more and more stringent. So we usually used the tension leveler to make high quality of strip flatness. For the improvement of the quality of strip flatness, this report developed three- dimensional FEM (Finite Element Method) simulation model, and analysis about the strain and stress distribution of strip in the tension leveling process. The numerical study can be summarized as follows. (1) If we pass the edge wave material (steepness: $1.0\%$) that the stress-difference between the strip center and the edge is 5.2kgf through tension leveler. the stress-difference is decreased 0.45kgf and the steepness is improved to $0.29\%$. (2) If the Intermesh is increased from 6mm to 7mm, the steepness is improved from $0.294\%$ to $0.268\%$. (3) If the initial steepness is decreased form $1.0\%$ to $0.75\%$, the final steepness is improved from $0.294\%$ to $0.263\%$. We know that more increased intermesh and lower initial steepness make the final steepness improved.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2004년도 춘계학술대회 논문집
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• pp.74-79
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• 2004

The shape of cold rolled steel sheets is the degree of flatness, and the flatter, the better. Because undesirable strip shapes of cold rolled steel sheets can affect not only visible problem but also automatic working process in customer's lines, the requirement of the customers is more and more stringent. So we usually used the tension leveler to make high quality of strip flatness. For the improvement of the quality of strip flatness, this report developed three-dimensional FEM (Finite Element Method) simulation model, and analysis about the strain and stress distribution of strip in the tension leveling process.

• 소성∙가공
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• 제17권2호
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• pp.107-112
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• 2008

In order to investigate the residual stress evolution during the leveling process of hot rolled high strength coils for cold forming, the in-plane residual stress of plate sampled at SPM, rough leveler and finish leveler were measured by cutting method. Residual stress was localized near the edge of plate. As the thickness of plate was increased, the size of residual stress region was expanded. The gradient of residual stress within the plate was reduced during the leveling process. But the residual stress itself was not removed completely within the ranges of tested conditions. The exact camber of cut plate was able to be predicted by the measurement of residual stress distribution after leveling of the plate.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2007년도 추계학술대회 논문집
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• pp.112-115
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• 2007

In order to investigate the residual stress evolution during the leveling process of hot rolled high strength coils for cold forming, the in-plane residual stress of plate sampled at SPM, rough leveler and finish leveler were measured by cutting method. Residual stress was localized near the edge of plate. As the thickness of plate was increased, the region with residual stress was expanded. The gradient of residual stress within plate was reduced during the leveling process. But the residual stress itself was not removed at the ranges of tested conditions. From the measured residual stress distribution within the plate, camber of plate cut to small width was predicted exactly within error range of experiment.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2016년도 추계학술대회 논문집
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• pp.139-139
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• 2016

반도체 다마신배선용 도금용 구리도금첨가제는 대표적으로 accelerator, suppressor 및 leveler 첨가제를 사용하여 다마신 패턴을 채우고 평탄화를 시킬 수 있다. Si 반도체 공정기술에 기반한 정확한 구조분석을 통해 각각의 첨가제의 기능이 비교적 체계적으로 연구되었으며, 최근에는 유속영향을 많이 받는 것으로 알려진 leveler 첨가제에 대한 연구가 활발히 진행되고 있다. 본 연구는 대표적 leveler 첨가제의 하나인 Janus Green B(JGB, $C_{30}H_{31}ClN_6$)를 0 ~ 1 mM을 첨가하여 Si 기판위에 증착된 Cu 씨드층 상의 도금후 표면상태 및 불순물의 농도를 분석하고, 이 박막층들의 결정립 성장 경향성을 electron backscattered diffraction(EBSD) 분석을 통해 진행하였다. C, H, N 등의 불순물이 JGB 농도와 선형적 관계를 가지고 증가하는 것을 알 수 있었으며, S와 O의 불순물도 JGB 농도 증가에 따라 증가하는 것을 알 수 있었다. 또한 0.1 mM 첨가한 경우에 60% 정도 결정립 성장이 진행된 것을 알 수 있었으며, 0.2 mM을 넣은 경우에는 결정립 성장이 일어나지 않은 것을 알 수 있었다. 흥미로운 점은 4 point probe를 통한 면저항 측정을 통해 EBSD를 통한 결정립성장이 관찰되지 않은 0.2 mM JGB를 첨가한 경우에 대해서도 면저항의 감소가 관찰되며, 오히려 JGB 농도가 높을수록 이러한 면저항의 감소가 빠르게 시작되는 것을 관찰할 수 있었다. 이는 JGB 농도 증가에 따라 박막층의 불순물의 농도가 증가하고 막내에 존재하는 불순물의 농도가 증가하면 내부응력장이 커짐으로 인해 더욱 빠른 속도로 불순물의 재배치가 일어난 것으로 보인다. 이러한 불순물이 결정립계면에 편석되는 경우에 pinning을 통해 결정립계면의 이동을 저하시킬 수 있으므로 결정립의 성장 억제가 가능해진 것으로 판단된다.

• 마이크로전자및패키징학회지
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• 제19권4호
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• pp.39-43
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• 2012

Via-filling plating and through-hole plating are absolutely imperative for manufacturing of printed-wiring board. This Paper is introducing the latest developments of our company worked on the high-performance of acid copper plating additives for them.

• 한국표면공학회지
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• 제46권4호
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• pp.153-157
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• 2013

The defect like the void or seam is frequently generated in the PCB (Printed Circuit Board) Via-Filling plating inside via hole. The organic additives including the accelerating agent, inhibitor, leveler, and etc. are needed for the copper Via-Filling plating without this defect for the plating bath. However, the decomposition of the organic additive reduces the lifetime of the plating bath during the plating process, or it becomes the factor reducing the reliability of the Via-Filling. In this paper, the interaction of each organic additives and the decomposition of additive were discussed. As to the accelerating agent, the bis (3-sulfopropyl) disulfide (SPS) and leveler the Janus Green B (JGB) and inhibitor used the polyethlylene glycol 8000 (PEG). The research on the interaction of the organic additives and decomposition implemented in the galvanostat method. The additive decomposition time was confirmed in the plating process from 0 Ah/l (AmpereHour/ liter) to 100 Ah/l with the potential change.