• 전력전자학회:학술대회논문집
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• 전력전자학회 2008년도 하계학술대회 논문집
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• pp.379-381
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• 2008

Generally additional leakage inductance and two clamp diodes are adopted into the conventional phase shift full bridge (PSFB) converter for reducing the voltage stress of secondary rectifier diodes and extending the range of zero voltage switching (ZVS) operation. However, since additional leakage inductance carries the ac current similar to the primary one, the core and copper loss oriented from additional leakage inductance can be high enough to decrease the whole efficiency of DC/DC converter. Therefore, in this paper, a new ZVS phase shift full bridge converter with separated primary winding (SPW) is proposed. Proposed converter makes the transformer and additional leakage inductor with one ferrite core. Using this method, leakage inductance is controlled by the winding ratio of separated primary winding. Moreover, by manufacturing the both magnetic components with one core, size and core loss can be reduced and it turns out the improvement of efficiency and power density of DC/DC converter. The operational principle of proposed converter is analyzed and verified by the 1.2kW prototype.

• 한국표면공학회지
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• 제52권2호
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• pp.72-77
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• 2019

To study the characteristics of AC driven OLED, we fabricated the fluorescent OLEDs and analyzed the electroluminescence characteristics of OLEDs with AC negative voltage. The luminance and the current density of the OLED decreased, and the number and size of the dark spots increased in proportion to the duration time and level of the applied AC negative voltage. The current efficiency of the OLED was improved when high AC negative voltage was applied within a short time. When the AC negative voltage of 10 V was applied for 1 minute, the efficiency was improved by 12.4%. Also, the degradation of luminance and current efficiency due to the duration of light emission was improved in the case of OLED applied for 1 minute with 10 V AC negative voltage. These are expected as a result of the improvement of the leakage current characteristics by eliminating the short-circuit region formed by the defect of the OLED at the AC negative high voltage. As a result, the continuous application of AC negative voltage reduced the luminance and the current density of OLED, but the temporary application of AC negative voltage with the proper time and voltage could improve the efficiency and lifetime of OLED.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1999년도 하계학술대회 논문집 D
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• pp.1931-1933
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• 1999

In this paper, the current and voltage properties on the gate oxide film due to the variation of thickness are studied. The specimen is used for n-ch power MOSFET. It is shows the leakage current and current density characteristics due to the applied electric field when the oxide thickness is each $600[\AA],\;800[\AA]$ and $1000[\AA]$, respectively. We known that the leakage current is a little higher when the voltage as reverse bias contrast with forward bias in poly gate is applied. In order to experiment for AC properties is measured for capacitance characteristics. It is confirmed that the value of input capacitance have been a lot of influenced on $SiO_2$ thickness contrast with the value of output capacitance.

• JSTS:Journal of Semiconductor Technology and Science
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• 제14권5호
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• pp.601-608
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• 2014

In this paper, we have characterized the electrical properties related to gate leakage current in AlGaN/GaN MISHFETs with varying the thickness (0 to 10 nm) of $Al_2O_3$ gate insulator which also serves as a surface protection layer during high-temperature RTP. The sheet resistance of the unprotected TLM pattern after RTP was rapidly increased to $1323{\Omega}/{\square}$ from the value of $400{\Omega}/{\square}$ of the as-grown sample due to thermal damage during high temperature RTP. On the other hand, the sheet resistances of the TLM pattern protected with thin $Al_2O_3$ layer (when its thickness is larger than 5 nm) were slightly decreased after high-temperature RTP since the deposited $Al_2O_3$ layer effectively neutralizes the acceptor-like states on the surface of AlGaN layer which in turn increases the 2DEG density. AlGaN/GaN MISHFET with 8 nm-thick $Al_2O_3$ gate insulator exhibited extremely low gate leakage current of $10^{-9}A/mm$, which led to superior device performances such as a very low subthreshold swing (SS) of 80 mV/dec and high $I_{on}/I_{off}$ ratio of ${\sim}10^{10}$. The PF emission and FN tunneling models were used to characterize the gate leakage currents of the devices. The device with 5 nm-thick $Al_2O_3$ layer exhibited both PF emission and FN tunneling at relatively lower gate voltages compared to that with 8 nm-thick $Al_2O_3$ layer due to thinner $Al_2O_3$ layer, as expected. The device with 10 nm-thick $Al_2O_3$ layer, however, showed very high gate leakage current of $5.5{\times}10^{-4}A/mm$ due to poly-crystallization of the $Al_2O_3$ layer during the high-temperature RTP, which led to very poor performances.

• 한국진공학회지
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• 제19권1호
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• pp.52-57
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• 2010

$BiFeO_3(BFO)/Pb(Zr_{0.52}Ti_{0.48})O_3$(PZT) bilayer와 multilayer의 다층구조를 만들어 전기적 특성을 측정하여 같은 두께의 BFO 단층박막과 비교해 보았다. BFO와 PZT 용액을 이용하였으며 chemical solution deposition 방법으로 Pt/Ti/$SiO_2$/Si(100) 기판위에 각 박막을 증착하였다. X-ray diffraction 분석을 통해 모든 박막이 다배향(multi-orientation) 페로브스카이트 (perovskite) 구조를 가졌음을 확인하였다. BFO/PZT Bilayer와 multilayer 박막들은 BFO 단층박막의 비해 누설전류 값이 500 kV/cm에서 약 4, 5차수 정도 감소했으며, 이로 인해 BFO/PZT 다층박막의 강유전체 특성이 크게 향상되었다. BFO/PZT multilayer 다층구조 박막의 경우 안정된 이력곡선(hysteresis loop)을 나타냈으며, 잔류 분극(remanent polarization)의 값은 $44.3{\mu}C/cm^2$이었으며, 항전계($2E_c$) 값은 681.4 kV/cm였다.

• 한국전기전자재료학회논문지
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• 제14권5호
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• pp.417-422
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• 2001

The needs of new materials that substitute Si Oxide capacitor layer in high density DRAM increase. So in this paper, we choose the slim region 14/50/50 PLZT composition and fabricated thin films by PLD and estimated the characteristics for DRAM application. 14/50/50 PLZT thin films have crystallized into perovskite structure in the $600^{\circ}C$ deposition temperature and 200 mTorr Oxygen pressure. In this condition, PLZT thin films had 985 dielectric constant, storage charge density 8.17 $\mu$C/$\textrm{cm}^2$ and charging time 0.20ns. Leakage Current density was less than 10$^{-10}$ A/$\textrm{cm}^2$ until 5V bias voltage.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1999년도 추계학술대회 논문집
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• pp.433-436
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• 1999

In this paper we applied TVS(Triangular Voltage Sweep) method to calculate the mobile ionic charge densities in some ferroelectric thin films. During the measurement, the temperature of specimens were maintained at 20$0^{\circ}C$. By this method, the amount of mobile ionic charge Q$_{m}$ and mobile ionic charge density N$_{m}$ of a MFIS structure were calculated 3.5 [pC] and about 4.3$\times$10$^{11}$ [ions/cm$^2$], respectively. In order to successful TVS measurement, the gate leakage current density of films must be low 10$^{-9}$ (A/cm$^2$) order.der.

• 한국진공학회지
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• 제5권3호
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• pp.223-228
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• 1996

$SiO_2$ insulator layers on InSb have been prepared by remote PECVD system a low temperature below $200^{\circ}C$. The effects of deposition pressure, temperature, and gas flow ratio on the physical and electrical characteristics of the $SiO_2$ were studied. The InSb MIS device using $SiO_2$ was fabricated and measured its current-voltage and capacitance-voltage characteritance-voltage charateristics at 77K. The films evaluated Auger electron spectroscopy showed that composition atoms were distributed uniformaly throughout the oxide film and the outdiffusion of substrate atoms into the oxide were few. The leakage current density of the MIS device was about 6.26nA/$\textrm{cm}^2$ at 0.75MV/cm , and the breakdown voltage was about 1MV/cm. The interface-stage density at mid-bandgap extracted from 1MHz C-V measurement was $54\times 10^{11}\textrm{cm}^2-2V^{-1}$.

• 한국진공학회지
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• 제1권1호
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• pp.212-222
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• 1992

To use polycrystalline Si Thin Film Transistor (poly-Si TFT) in high density SRAM instead of High Load Resistor (HLR), TFT is needed to show good electrical characteristics such as large carrier mobility, low leakage current, high driver current and low subthreshold swing. To satisfy these electrical characteristics, the trap state density must be reduced in the channel poly. Technological issues pertinent to the channel poly fabrication process are investigated and discussed. They are solid phase growth (SPG), Si-ion implantation, laser annealing and hydrogenation. The electrical properties of several CVD oxides used as the gate oxide of TFT are compared. The dependence of the electrical characteristics of TFT on source-drain ion-implantation dose, drain offset length and dopant lateral diffusion are also described.

• 비파괴검사학회지
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• 제16권3호
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• pp.162-173
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• 1996

본 연구는 강편 빌레트의 표면 결함을 검출하기 위한 건식 자분 탐상에 관한 것으로 자분 탐상능을 대상체에 흘리는 자화 전류, 대상체의 온도, 자분의 총 분사량 등에 대하여 평가하였다. 선재 제품의 등급에 따라 필요로 하는 몇 가지 강종을 선택하여 강종별 자기적 특성을 평가하였으며, 이를 입력 자료로 하여 유한 요소법에 의한 자기 해석을 행하였고, 그 결과를 직류 자화 전류에 의한 누설 자속 측정 결과와 비교 분석하였다. 교류 자화 전류에 의한 건식 자분 탐상능을 직류 자화 전류에 의한 탐상능과 비교하여 강종 및 자화 전류의 유형에 따른 자화 전류치를 결정하였다. 직류 자화 전류에 의한 자분 탐상 결과를 유한 요소법에 의한 계산과 비교하였고, 빌레트의 표면과 표면 결함 부위에서 측정한 누설 자속으로 비교 결과를 평가하였다. 각 강편재의 경우 직류 자화 전류에 의한 표면 자장은 그 형상에 의한 영향으로 코너 부위에서는 면 중앙의 표면 자장치에 비해 30% 정도였으며, 교류 자화 전류에 의해서는 그 비율이 70% 정도였다. 교류 자화 전류는 코너로부터 면중앙으로 10mm 되는 영역을 제외하고는 전 면에서 균일한 표면 자장을 발생하였다. 대상체의 온도에 따른 자분의 흡착은 대상체의 온도 $150^{\circ}C$ 까지는 큰 변화가 없으나 자분의 고착에 있어서 $60^{\circ}C$ 이상의 고온재에 대해서는 융착 용매로 메틸렌 크로라이드를 사용하는 것이 부적합하였다. 자분의 총분사량은 자분 탐상능에 상당히 큰 영향을 미침을 확인하였고 이에 대한 정량적 평가를 행하였다.