• Proceedings of the Korean Society of Laser Processing Conference
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• 2002.05a
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• pp.61-64
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• 2002

• Journal of Biosystems Engineering
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• v.24 no.2
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• pp.159-166
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• 1999

A system to extract continuously the real 3-D geometric fearture information from 2-D image of an object, which is fed randomly via conveyor has been developed. Two sets of structured laser lightings were utilized. And the laser structured light projection image was acquired using the camera from the signal of the photo-sensor mounted on the conveyor. Camera coordinate calibration matrix was obtained, which transforms 2-D image coordinate information into 3-D world space coordinate using known 6 points. The maximum error after calibration showed 1.5 mm within the height range of 103mm. The correlation equation between the shift amount of the laser light and the height was generated. Height information estimated after correlation showed the maximum error of 0.4mm within the height range of 103mm. An interactive 3-D geometric feature extracting software was developed using Microsoft Visual C++ 4.0 under Windows system environment. Extracted 3-D geometric feature information was reconstructed into 3-D surface using MATLAB.

• Journal of the Korean Solar Energy Society
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• v.31 no.4
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• pp.103-111
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• 2011

Laser drilling of vias is the one of key technologies in developing Emitter-Wrap Through(EWT) solar cell which is particularly attractive due to the use of industrial processing and common solar grade p-type silicon materials. While alternative economically feasible drilling process is not available to date, the processing time and laser induced damage should be as small as possible in this process. This paper provides an overview on various factors that should be considered in using the laser via drilling technology for developing highly efficient and industrially applicable EWT solar cells.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.1
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• pp.39-43
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• 2003

Thermal management is very important for the success of high density circuit design in LTCC. In this paper, LTCC substrates containing thermal via and pad were fabricated in order to study the influence of the thermal dissipation. To realize the accurate thermal analysis for structure design, a series of simple thermal conductivity measurement by laser flash method and parametric numerical analysis have been carried out. The LTCC substrate including via and Ag pad has good thermal conductivity over 103 W/mK which is 44% value of pure Ag material. Thermal behaviors with via arrays, size and density in the LTCC substrate were studied by numerical method.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.11a
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• pp.598-601
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• 2000

We investigated the fabrication of Si nanoparticle and $C_{60}$ thin films by pulsed laser ablation. As a result, we observed visible green photoluminescence spectra in the Si/C$_{60}$ multilayer films after laser annealing. It is considered that this green photoluminescence is occurred from SiC particles, which is produced reaction of Si nanoparticles with $C_{60}$ via laser annealing.ing.

• Korean Journal of Head & Neck Oncology
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• v.31 no.2
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• pp.74-77
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• 2015

A lingual thyroglossal duct cyst(LTGDC) is a rare congenital anomaly that account for only 0.5% to 2% of total thyroglossal duct cyst. LTGDC is frequently associated with respiratory problem in infants and pharyngeal foreign body sensation or dysphagia in adults. Because of its location and characteristics, lingual thyroid, dermoid cyst, and vallecular cyst should be included in differential diagnosis. Standard treatment for thyroglossal duct cyst is sistrunk's operation, but in terms of LTGDC, because of its location and cosmetic reasons, different kinds of treatments such as electrical cauterization, $CO_2$ laser, Robort surgery via transoral approach have been introduced. Recently authors encountered 21 years old woman with LTGDC and the mass was removed successfully via transoral approach using $CO_2$ laser. We report the clinical course with review of the literature.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.11a
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• pp.743-744
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• 2008

• Proceedings of the KIEE Conference
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• 2004.11c
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• pp.478-480
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• 2004

다이아몬드 톱날을 이용한 얇은 Si 웨이퍼의 기계적인 다이싱은 chipping, crack 등의 문제점을 발생시킨다. 또한 stacked die 나 multi-chip등과 같은 3D-WLP(wafer level package)에서 via를 생성하기 위해 현재 사용되는 화학적 etching은 공정속도가 느리고 제어가 힘들며, 공정이 복잡하다는 문제점을 가지고 있다. 이러한 문제점을 해결하기 위해 현재 연구되고 있는 분야가 레이저를 이용한 웨이퍼 다이싱 및 드릴링이다. 본 논문에서는 UV 레이저를 이용한 얇은 Si 웨이퍼 다이싱 및 드릴링 시스템에 대해 소개하고, 웨이퍼 다이싱 및 드릴링 실험결과를 바탕으로 적절한 레이저 및 공정 매개변수에 대해 설명한다.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.1
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• pp.45-50
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• 2009

By Laser Through-Silicon-Via process, debris and particles occur when you are forming. Therefore the research of TSV cleaning become important to remove those particles and debris. Both chemical cleaning method that uses a surfactant and physical cleaning method that uses a brush were studied with the via of $30{\mu}m$ diameter and $100{\mu}m$ depth on the 8 inch CMOS Image Sensor wafer. On the DI water and a surfactant in mixture ratio of 2:1, debris show $73{\mu}m^2$ per $0.054mm^2$. Cleaning is superior by lower mixture ratio of DI water and surfactant. In addition, It is less than 5% of debris distribution in the laser condition changed by Laser's frequency and its speed and cleaning had no effect. In the physical cleaning, there are no crack and damage when the system condition is set by $1000{\sim}3000rpm$ strip, $50{\sim}3000rpm$ rinsing, and $200{\sim}300rpm$ brushing Therefore, debris and particles can be removed by enforced chemical method and physical method.

• Journal of Korea Society of Digital Industry and Information Management
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• v.10 no.2
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• pp.13-20
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• 2014

In this paper, we implemented the object scanning with nxtOSEK which is an open source platform. nxtOSEK consists of device driver of leJOS NXJ C/Assembly source code, TOPPERS/ATK(Automotive real time Kernel) and TOPPERS/JSP Real-Time Operating System source code that includes ARM7 specific porting part, and glue code make them work together. nxtOSEK can provide ANSI C by using GCC tool chain and C API and apply for real-time multi tasking features. We experimented the 3D scanning with ultra sonic and laser sensor which are made directly by laser module diode and experimented the measurement of scanning the object by knowing x, y, and z coordinates for every points that it scans. In this paper, the laser module is the dimension of $6{\times}10[mm]$ requiring 5volts/5[mW], and used the laser light of wavelength in the 650[nm] range. For detecting the object, we used the beacon detection algorithm and as the laser light swept the objects, the photodiode monitored the ambient light at interval of 10[ms] which is called a real time. We communicated the 3D scanning platform via bluetooth protocol with host platform and the results are displayed via DPlot graphic tool. And therefore we enhanced the functionality of the 3D scanner for identifying the image scanning with laser sensor modules compared to ultra sonic sensor.