• Title/Summary/Keyword: Laser ultrasonic

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Resolution Enhancement of Scanning Laser Acoustic Microscope Using Transverse Wave (횡파를 이용한 SLAM의 분해능 개선)

  • Ko, D.S.;Park, J.S.;Kim, Y.H.
    • Journal of the Korean Society for Nondestructive Testing
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    • v.16 no.4
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    • pp.234-240
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    • 1997
  • We studied the resolution enhancement of a novel scanning laser acoustic microscope (SLAM) using transverse waves. Mode conversion of the ultrasonic wave takes place at the liquid-solid interface and some energy of the insonifying longitudinal waves in the water will convert to transverse wave energy within the solid specimen. The resolution of SLAM depends on the size of detecting laser spot and the wavelength of the insonifying ultrasonic waves. Science the wavelength of the transverse wave is shorter than that of the longitudinal wave, we are able to achieve the high resolution by using transverse waves. In order to operate SLAM in the transverse wave mode, we made wedge for changing the incident angle. Our experimental results with model 2140 SLAM and an aluminum specimen showed higher contrast of the SLAM image in the transverse wave mode than that in the longitudinal wave mode.

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Bonding Method and Packaging of High Temperature RFID Tag (고온용 RFID 태그 패키징 및 접합 방법)

  • Choi, Eun-Jung;Yoo, Dea-Won;Byun, Jong-Hun;Ju, Dae-Keun;Sung, Bong-Gun;Cho, Byung-Lok
    • The Journal of Korean Institute of Communications and Information Sciences
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    • v.35 no.1B
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    • pp.62-67
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    • 2010
  • Our research group has investigated that RFID tag packaging development and RFID tag flip chip bonding method influences on the industry-environmental customized RFID tag development that has applications to various industry environmental conditions. RFID tag flip chip bonding is consisting with wire bonding, ultrasonic bonding, heat plate bonding, and laser bonding and those methods are also depending on the different RFID tag development. Our research data shows that, among the various industrial environments such as an extremely high temperature, cryogenic, high-humidity, flexible, high-durable, development of RFID tag in an extremely high temperature is inappropriate for laser bonding method, converting of heat energy as absorbing light energy or heat plate bonding method of straight heat transferring manner, on the other hand, is suitable for wire bonding method which directly connect bump to pattern using wire.

The development of laser doppler vibrometer using DPLL for the detection of ultrasonic vibration (Digital PLL을 이용한 초음파진동 측정용 레이저 도플러 진동계의 개발)

  • 김호성
    • Korean Journal of Optics and Photonics
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    • v.11 no.5
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    • pp.306-311
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    • 2000
  • This paper deals with the development of Laser Doppler Vibrometer (LDV) that can mea~ure the tlequency and amphlude of the ultrasonic vibralion. Hc-Ne laser (632.8 om) is used as a light source, and Michelson interferometer in winch frequency of the objective beam is shIfted by Bragg cell IS adopted The frequency modulated signal centered at 40 MHz flom the PIN diode IS amplified. down-col1vel1ed to 2.5 MHz, filtered and digiLized. The voltage output that is proportional to the velocity of the vibratwg surface is obtawed using digItal PLL. A microprocessor is used to extract the frequcncy aud amplitude of the vibratIOn from the voltage output. It is found that the developed LDV can measure up to 300 kHz vibratIOn and the mlillmUITI measurable amplitude is I nm at 300 kHz. We believe thatlhis LDV can be used to measure the vibratIOn of the heavy electric maclllnery and micro-size structures. tures.

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Laser Welding Characteristics of Aluminum and Copper Sheets for Lithium-ion Batteries (자동차 이차전지 제조를 위한 알루미늄과 무산소동의 레이저 용접특성)

  • Kang, Minjung;Park, Taesoon;Kim, Cheolhee;Kim, Jeonghan
    • Journal of Welding and Joining
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    • v.31 no.6
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    • pp.58-64
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    • 2013
  • Several joining methods involving resistance welding, laser welding, ultrasonic welding and mechanical joining are currently applied in manufacturing lithium-ion batteries. Cu and Al alloys are used for tab and bus bar materials, and laser welding characteristics for these alloys were investigated with similar and dissimilar material combinations in this study. The base materials used were Al 1050 and oxygen-free Cu 1020P alloys, and a disk laser was used with a continuous wave mode. In bead-on-plate welding of both alloys, the joint strength was higher than the strength of O tempered base material. In overlap welding, the effect of welding parameters on the tensile shear strength and bead shape was evaluated. Tensile shear strength of overlap welded joint was affected by interfacial bead width and weld defect formation. The tensile-shear specimen was fractured at the heat affected zone by selecting proper laser welding parameters.