• International Journal of Highway Engineering
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• 제14권6호
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• pp.45-55
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• 2012

PURPOSES : Skid resistance and noise of roads highly depend on the characteristics of pavement texture. Therefore, estimation of texture characteristics may give useful information for the skid resistance and noise of road. Generally, Sand Patch Test is performed in order to estimate MTD(Mean Texture Depth). However, it is time-consuming and needs traffic control. This study aimed to investigate the effectiveness of measurement texture depth using the Portable Laser Profiler that give the MPD(Mean Profile Depth). METHODS : MTD and MPD were collected on the number of expressway sections including Central Inland Test Road sections in Korea. Statistical analysis are performed to establish the relationship between MTD data based on Sand Patch Test and MPD data obtained by the Portable Laser Profiler. RESULTS : Linear relationship MPD and MTD is observed for both of asphalt pavement and concrete pavement such as R-square of 0.51 to 0.58. CONCLUSIONS : Even though, the test method and definition of MPD and MTD are different. EMTD(Estimated Mean Texture Depth) can be obtained by using the correlationship between MPD with MTD.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• 제24권1호
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• pp.91-97
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• 2013

The input parameters of scattering models for computing the backscattering coefficients of earth terrains are mainly soil moisture and surface roughness. The backscattering coefficients of soil surfaces are more sensitive to surface roughness than soil moisture. In this study, we propose a precise measurement method for roughness parameters and analyze measurement errors. We measured surface roughness using a pin-board profiler(1 m, 0.5 cm interval) and a laser profiler(1 m, 0.25 cm interval). The measurement differences between two profilers in an average sense are 0.097 cm for root-mean-square (RMS) height and 1.828 cm for correlation length. The analysis of the correlation functions and relative errors shows that the laser measurements are more stable than the pin-board measurements. The differences of the calculated backscattering coefficients using a surface scattering model between pin-board and laser profiler measurements are less than 1 dB.

• Journal of Powder Materials
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• 제18권5호
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• pp.406-410
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• 2011

Green strength is an important property of powders since high green strength guarantees easy and safe handling before sintering. The green strength of a powder compact is related to mainly mechanical and surface characters, governed by interlocking of the particles. In this study, the effect of powder surface roughness on the green strength of iron powders was investigated using a transverse rupture test. Three-dimensional laser profiler was employed for quantitative analyses of the surface roughness. Two different surface conditions, i.e. surface roughness, of powders were compared. The powders having rough surfaces show higher green strength than the round surface powders since higher roughness leads increasing interlocked area between the contacting powders.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• 제13권11호
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• pp.969-975
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• 2000

Laser direct writing of micro-patterned copper lines has been achieved by pyrolytic decomposition of copper formate films (Cu(HCOO)$_2$.4$H_2O$), as a metallo-organic precursor, using a focused CW Ar$^{+}$ laser beam (λ=514nm) on PCB boards and glass substrates. The linewidth and thickness of the lines wee investigated as a functin of laser power and scan speed. The profiles of the lines were measured by scanning electron microscope (SEM), surface profiler ($\alpha$-step) and atomic force measured by scanning electron microscope (SEM), surface profiler ($\alpha$-step) and atomic force microscopy (AFM). The electrical resistivities of the patterned lines were also investigated as a function of laser parameters using probe station and semiconductor analyzer. We compared resistivities of the patterned copper lines with these of the Cu bulk. Resistivities decreased due to changes in morphology and porosity of the deposit, which were about 3.8 $\mu$$\Omega$cm and 12$\mu$$\Omega$cm on PCB and glass substrates after annealing at 30$0^{\circ}C$ for 5 minutes.s.

• Proceedings of the KSRS Conference
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• 대한원격탐사학회 2003년도 Proceedings of ACRS 2003 ISRS
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• pp.1177-1179
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• 2003

Recently, the ground-based laser profiler is used for acquisition of 3D spatial information of a rchaeological objects. However, it is very difficult to measure complicated objects, because of a relatively low-resolution. On the other hand, texture mapping can be a solution to complement the low resolution, and to generate 3D model with higher fidelity. But, a huge cost is required for the construction of textured 3D model, because huge labor is demanded, and the work depends on editor's experiences and skills . Moreover, the accuracy of data would be lost during the editing works. In this research, using the laser profiler and a non-calibrated digital camera, a method is proposed for the automatic generation of 3D model by integrating these data. At first, region segmentation is applied to laser range data to extract geometric features of an object in the laser range data. Various information such as normal vectors of planes, distances from a sensor and a sun-direction are used in this processing. Next, an image segmentation is also applied to the digital camera images, which include the same object. Then, geometrical relations are determined by corresponding the features extracted in the laser range data and digital camera’ images. By projecting digital camera image onto the surface data reconstructed from laser range image, the 3D texture model was generated automatically.

• Proceedings of the KSRS Conference
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• 대한원격탐사학회 2003년도 Proceedings of ACRS 2003 ISRS
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• pp.769-769
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• 2003

• KSCE Journal of Civil and Environmental Engineering Research
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• 제33권4호
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• pp.1631-1638
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• 2013

Distress data, IRI, etc. are important factors in the evaluation of pavement condition. Recently, the need to consider tire-pavement noise in PMS (pavement management system) is raised. Generally, tire-pavement noise highly depends on the characteristics of pavement texture. Therefore, estimation of texture characteristics may give useful information to predict tire-pavement noise. Measurement of MPD (Mean Profile Depth) by using PLP (Portable Laser Profiler) provide very fast. The texture characteristics by means of MPD can be in a short time. hence, It can be a good alternative to give noise information, if MPD and tire-pavement noise have robust relationship. In this study, MPD and tire-pavement noise were simultaneously collected on the number of asphalt section to evaluate the tire-pavement noise due to the pavement texture characteristics. A set of statistical analysis was performed to propose relationship between tire-pavement noise and MPD for asphalt concrete pavement.

• Tribology and Lubricants
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• 제40권2호
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• pp.47-53
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• 2024

Surface topography plays a decisive role in determining the performance of several precision components. In particular, the surface roughness of semiconductor devices affects the precision of the circuit. In this regard, the surface topography of a given surface needs to be appropriately assessed. Typically, the average roughness is used as one of the main indicators of surface finish quality because it is influenced by both dynamic and static parameters. Owing to the increasing demand for such accurate and reliable surface measurement systems, studies are continuously being conducted to understand the parameters of surface roughness and measure the average roughness with high reliability. However, the differences in the measurement methods of surface roughness are not clearly understood. Hence, in this study, the surface roughness of the back of a silicon wafer was measured using both contact and noncontact methods. Subsequently, a comparative analysis was conducted according to various surface roughness parameters to identify the differences in surface roughness depending on the measurement method. When using a 3D laser confocal microscope, even smaller surface asperities can be measured compared with the use of a 3D profiler. The results are expected to improve the understanding of the surface roughness characteristics of precision components and be used as a useful guideline for selecting the measurement method for surface topography assessment.

• Journal of the Korean Wood Science and Technology
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• 제24권4호
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• pp.87-92
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• 1996

When cutting 2.0cm-thick red oak and hard maple with an air-jet-assisted carbon-dioxide laser of 2kW output power, maximum feed speed at the point of full penetration of the beam decreased with increasing the angle between grain and cutting direction. Feed speed averaged 3.75 and 3.38 meters per minute for red oak and hard maple, respectively. Gray-level of laser-cut surfaces were analyzed by image analysis system. The highest gray level of laser-cut surface was obtained when red oak was cut parallel to grain by laser. Surface profiler was used to scan the sawn and laser-cut surfaces. Center line average roughnesses of laser-cut surfaces were higher than those of sawn surfaces. Scanning electron micrographs showed the cell walls which were melted by laser.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 한국전기전자재료학회 2000년도 하계학술대회 논문집
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• pp.663-666
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• 2000

Laser direct writing of micro-patterned copper lines has been achieved by pyrolytic decomposition of copper formate films (Cu(HCOO)$_2$$.$4H$_2$O), as a precursor, using a focused Ar$\^$+/ laser beam ($\lambda$= 514 nm) on PCB boards and glass substrates. The linewidth and thickness of the lines were investigated as a function of laser power and scan speed. The profiles of the lines were measured by scanning electron microscope (SEM), surface profiler (${\alpha}$-step) and atomic force microscopy (AFM). The electrical resistivities of the patterned lines were also investigated as a function of laser parameter using probe station and semiconductor analyzer. we compared resistivities of the patterned lines with that of the Cu bulk, respectively.