• Transactions of the Korean Society of Machine Tool Engineers
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• v.12 no.3
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• pp.58-67
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• 2003

Welding characteristics of austienite 304 stainless and SM45C using a continuous wave Nd:YAG laser n experimentally investigated Laser beam welding is increasingly being used in welding of structural steels. The laser welding process is one of the most advanced manufacturing technologies owing to its high speed and deep penetration. The thermal cycles associated with laser welding are generally much Inter than those involved in conventional welding processes, leading to a rather small weld zone. Experiments are performed for 304 stainless steel plates changing several process parameter such as laser power, welding speed, shielding gas flow rate, presence of surface pollution, with fixed or variable gap and misalignment between the similar and dissimilar and plates, etc. The Nd:YAG laser welding process is one of the most advanced manufacturing technologies owing to its high speed and penetration. This paper describes the weld ability of SM45C carbon steel for machine structural use by Nd:YAG laser. The follow conclusions can be drawn that laser power and welding speed have a pronounced effect on size and shape of the fusion zone. Increase in welding speed resulted in an increase in weld depth/aspect ratio and hence a decrease in the fusion zone size. The penetration depth increased with the increase in laser power.

• Textile Coloration and Finishing
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• v.35 no.2
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• pp.121-127
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• 2023

In this study, a comprehensive investigation was conducted on the morphological and property changes of laser-induced nanocarbon (LINC) as a function of laser process parameters. LINC was formed on the surfaces of polyimide films with different backbone structures under various process conditions, including laser power, scan speed, and resolution. Three different forms of LINC electrodes (i.e., continuous 3D porous graphene, wooly nanocarbon fibers, line cut) were formed depending on the laser power and scan speed. Furthermore, heteroatom doping induced from the chemical structure of the polyimide during laser patterning was found to be effective in modifying the electrical properties of LINC electrodes. The LINC surfaces exhibited different microstructures depending on the laser beam resolution under constant laser power and scan speed, allowing for controllable surface wettability. The correlation between the chemical structure of the polymer substrate, laser process parameters, and carbonized surface properties in this study is expected to be utilized as fundamental understanding for the manufacturing of next-generation carbon-based electronic devices.

• Laser Solutions
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• v.13 no.4
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• pp.7-13
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• 2010

Today, the most common process for generating Through Silicon Vias (TSVs) for 3D ICs is Deep Reactive Ion Etching (DRIE), which allows for high aspect ratio blind holes with low surface roughness. However, the DRIE process requires a vacuum environment and the use of expensive masks. The advantage of using lasers for TSV drilling is the higher flexibility they allow during manufacturing, because neither vacuum nor lithography or masks arc required and because lasers can be applied even to metal and to dielectric layers other than silicon. However, conventional nanosecond lasers have the disadvantage of causing heat affection around the target area. By contrast, the use of a picosecond laser enables the precise generation of TSVs with less heat affected zone. In this study, we conducted a comparison of thermalization effects around laser-drilled holes when using a picosecond laser set for a high pulse energy range and a low pulse energy range. Notably, the low pulse energy picosecond laser process reduced the experimentally recast layer, surface debris and melts around the hole better than the high pulse energy process.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2003.10a
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• pp.391-394
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• 2003

Laser direct writing process is developed 3rd harmonic Diode Pumped Solid State Laser with the near visible wavelength of 355 m sensitive polymer is irradiated by UV laser and developed using polymer solvent to obtain quasi-3D. It is important to reduce line width for image mode waveguides, so some investigations will be carried out in various conditions of process parameters such as laser power, writing speed, laser focus and optical properties of polymer. This process could be to fabricate a single mode waveguide without expensive mask projection method. Experimentally, the patterns of trapezoidal shape were manufactured into dimension of 8.4 mm width and 7.5 mm height. Propagation loss of straight waveguide measured 3 dB/cm at 1,550 nm.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.22 no.1
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• pp.56-62
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• 2013

The laser cutting process which is flexible and rapid usually provides a better result in cutting of flexible printed circuit boards (FPCB). However, circuit-short by the re-deposition of debris from laser ablation or its heat affect zone (HAZ) on the cutting surfaces can be a problem. A laser cutting process of FPCB in the presence of liquid can minimize these negative effects. The temperature distribution of copper and polymer parts of FPCB was analyzed with numerical simulation and the experimental results were presented to evaluate this process. Generally, laser cutting under liquid has advantages of less re-deposition of carbides and less HAZ on the cutting edges. However, bubble generation and laser beam control through the liquid media should be considered carefully to obtain a successful result.

• Proceedings of the KSME Conference
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• 2003.04a
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• pp.1407-1411
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• 2003

Due to the heat confinement in the shallow region of the target for a short time scale, pulsed laser annealing has received increasing interest for the fabrication of poly-Si thin film transistors(TFTs) on glass as a low cost substrate in the flat panel displays. The formation and growth mechanisms of poly silicon(poly-Si) grains in thin films are investigated using an excimer laser crystallization system. To understand the crystallization mechanism, the grain formations are observed by FESEM analysis. The optical reflectance and transmittance during the crystallization process are measured using HeNe laser optics. A two-step ELC(Excimer Laser Crystallization) process is applied to enhance the grain formation uniformity.

• Laser Solutions
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• v.6 no.2
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• pp.9-17
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• 2003

Due to the heat confinement in the shallow region of the target for a short time scale, pulsed laser annealing has received an increasing interest for the fabrication of poly-Si thin film transistors(TFTs) on glass as a low cost substrate in the flat panel displays. The formation and growth mechanisms of poly silicon(poly-Si) grains in thin films are investigated using an excimer laser crystallization system. To understand the crystallization mechanism, the grain formations are observed by FESEM photography. The optical reflectance and transmittance during the crystallization process are measured using HeNe laser optics. A two-step ELC(Excimer Laser Crystallization) process is applied to enhance the grain formation uniformity.

• Laser Solutions
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• v.11 no.3
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• pp.1-4
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• 2008

A selective laser micro bonding process using liquid glass (methylsilsesquioxane) was developed and the results are analysed. The liquid glass can be solidified with Nd:YAG laser irradiation and it can be applied for joining two glass substrates. A bonding thickness of a few micrometers can be achieved. The appropriate laser power density (or this process is around 40-60 $kW/cm^2$ and its bonding force is 1000-1200 $gf/mm^2$. This process can be applied for bonding micro devices such as micro bio-sensors or display products. Its advantages and limitations are presented and discussed.

• Transactions of Materials Processing
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• v.21 no.6
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• pp.378-383
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• 2012

Laser forming is an advanced process in sheet metal forming in which a laser heat source is used to shape the metal sheet. This is a new manufacturing technique that forms the metal sheet only by a thermal stress. Analyses of the temperature and stress fields are very important to identify the deformation mechanism in laser forming. In this paper, temperature distributions and deformation behaviors of DP980 steel sheets are investigated numerically and experimentally. FE simulations are first conducted to evaluate the response of a square sheet in bending. The effects of process parameters such as laser power and scanning speed are then analyzed numerically and experimentally. It is observed that experimental and numerical results are in good agreement. These results provide a relationship between the line energy and the angles for laser bending of DP980 steel sheets.

• Laser Solutions
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• v.17 no.1
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• pp.13-16
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• 2014

Indium Tin Oxide (ITO) has been used widely for transparent conducting thin films. In this work, the feasibility of a laser sintering process to fabricate ITO thin films on flexible substrates is examined. Nanoparticles of ~10 nm were spin coated on a Si wafer and then sintered by a KrF excimer laser. The sintered structure was characterized by scanning electron microscopy. Polycrystalline structures were fabricated by the process without thermally damaging the substrate. The electrical resistivity of the film was reduced to ~ 1/1000 of the initial value. This work demonstrates that nanosecond laser sintering of ITO particles can be a useful tool to fabricate ITO films on various flexible substrates.