• 한국기계가공학회지
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• 제17권5호
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• pp.37-44
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• 2018

In laser material processing for high thermal conductivity, the thermal effect of laser beam shape was examined through computer simulations. In this paper, a circular beam with a focal radius of $500{\mu}m$, an elliptical beam with a major axis of 4 mm and a minor axis of 1 mm, and a rotating beam with a focal radius of $500{\mu}m$ and an angular velocity of 5 rad/sec were compared. Simulation results showed that there was no clear difference in the maximum temperature between the circular focus and the elliptical shape, but the heating and cooling rates were different. The simulation result for a laser beam rotating in a circular pattern with a radius of 5 mm showed an asymmetric temperature rise due to the combination of linear and rotational motion. At points where the rotational and linear speeds combined, the temperature gradually rose and reached the maximum temperature; whereas at points where the rotational and linear speeds were attenuated, the temperature tended to gradually decrease after reaching the maximum temperature. Based on the results of this study, the authors expect to be able to optimize laser material processing by designing patterns of laser beams.

• International Journal of Quality Innovation
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• 제8권1호
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• pp.137-153
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• 2007

Failure mode and effects analysis (FMEA) is a preventive technique in reliability management field. The successful implementation of FMEA technique can avoid or reduce the probability of system failure and achieve good product quality. The FMEA technique had applied in vest scopes which include aerospace, automatic, electronic, mechanic and service industry. The marking process is one of the back ends testing process that is the final process in semiconductor process. The marking process failure can cause bad final product quality and return although is not a primary process. So, how to improve the quality of marking process is one of important production job for semiconductor testing factory. This research firstly implements FMEA technique in laser marking process improvement on semiconductor testing factory and finds out which subsystem has priority failure risk. Secondly, a CCD position solution for priority failure risk subsystem is provided and evaluated. According analysis result, FMEA and CCD position implementation solution for laser marking process improvement can increase yield rate and reduce production cost. Implementation method of this research can provide semiconductor testing factory for reference in laser marking process improvement.

• Journal of Welding and Joining
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• 제29권6호
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• pp.82-87
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• 2011

In this study, we conducted laser welding by using remote scanner that is 5J32 aluminum alloy to observe the mechanical properties and optimize welding process parameters. As the control factors, laser incident angle, laser power and welding speed were set and as the result of weldablility, tensile shear tests were performed. ANOVA (Analysis of Variation) was also carried out to identify the influence of process variables on tensile shear strength. Strength estimation models were suggested using regression alnalysis and 2nd order polynomial model had the best estimation performance. In addition optimal welding condition was determined in terms with wedalility and productivity using objective function and fitness function. Final optimized welding condition was laser power was 4 kW, and welding speed was 4.6 m/min.

• 한국기계가공학회지
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• 제18권5호
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• pp.74-81
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• 2019

This study reports the CW $CO_2$ laser scribing of soda lime glass. In this study, scribing experiments are carried out at different laser powers, scan speeds, and focal positions to investigate the effect of the process parameters on the interaction characteristics between a laser beam and glass. In particular, the interaction characteristics are analyzed and described with the input laser energy per unit length. According to the experimental results, the damage threshold for the glass surface was found to exist between 0.072 and 0.08 J/mm. The input laser energy in this region induced partial melting of the surface and grain-shaped cracks. These cracks tended to increase as the input laser energy increased. At the laser input energy larger than 1 J/mm, a huge crack propagating along the scan direction was produced, and the volume below the scribed area was fully melted. The growth of this crack finally resulted in the complete cutting of the glass at the input laser energy above 8 J/mm. It was found that both the width and depth of the scribed line increased with increasing input laser energy. For the beam focusing at the rear surface, the width of the scribed line varied irregularly. This could be ascribed to the increased asymmetry of the beam intensity distribution when the laser beam was focused at the rear surface. Under this condition, a large burr was only produced on one side of the scribed line.

• International Journal of Quality Innovation
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• 제2권2호
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• pp.69-92
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• 2001

The laser-assisted seeding (LAS) process has potential to replace conventional electroless copper plating in Printed Circuit Board (PCB) manufacturing since it combines the steps of laser drilling and plating into one single process. In the LAS process, the single extra LAS step can metallize a microvia. Thus, the process steps can be greatly reduced and the productivity enhanced, but also the high aspect ratio microvias can be metallized. The objectives of this paper are to study the LAS copper thickness within PCB microvias and the thermal reliability of the microvias produced by this process. It was found that results were satisfactory in both the reliability test and also the LAS copper thickness which both comply with IPC standard, the copper thickness produced by the LAS process is sufficient for subsequent electro-plating process. The reliability of the microvias produced by LAS process is acceptable which are free from any voids, corner cracks, and distortion in the plated copper.

• 한국정밀공학회지
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• 제23권2호
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• pp.129-137
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• 2006

Polymer micro-fluidic devices were fabricated with laser processes. A UV laser and a femto laser were used to machine polymer micro-fluidic structures directly. This laser direct machining process suits the need of rapid prototyping, as in many applications changes from the original design are often required. As examples, two polymer micro-systems were developed: a micro-check valve and a micro diffuser pump. The micro fluidic devices can be applied for many applications such as clinical diagnostics and drug delivery. Advantages and disadvantages using polymers as a material for micro-fluidic applications are discussed.

• 한국레이저가공학회지
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• 제5권3호
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• pp.21-30
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• 2002

In automotive industry, the studies about light weight vehicle and improving the productivity have been accomplished. For that, TRIP steel was developed and research for the laser welding process have been performed. In this study, the monitoring system using photodiode was developed for laser welding process of TRIP steel. With measuring light, neural network model for estimating bead width and tensile strength was made and weld quality classification algorithm was formulated with fuzzy inference method.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2000년도 제15차 학술회의논문집
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• pp.292-292
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• 2000

Since high-power CO$_2$ Laser can be make a high densed energy to Local processing area, manufacturing processes using the laser can be processed for very Localized areas at a very fast rate with minimal or no distortion. Accordingly, the laser has been widely used in the fields of thermal manufacturing processes such as welding, fusion cutting, grooving, and heat treatment of metals. In particular, interest in the laser heat treatment process has grown tremendously in the past few years. In this process, maintaining the uniform hardening depth is important problem to obtain good quality products and to reduce heat induced distortion and residual stress. For achieving this objective, we introduced a new design technique of a fuzzy logic controller that greatly simplified the design procedure by defining several simplified design parameters. In the design procedure, the major design parameters of the controller are characterized by identifying several common aspects. From a series of simulation results, we found that the proposed design technique can be effectively used to design of a fuzzy logic controller for the LASER surface hardening process.

• 한국생산제조학회지
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• 제21권3호
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• pp.516-524
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• 2012

Selective Laser Sintering(SLS) system consists of various element technologies. Main components of the system include a position control system, a speed control system of the roller, and nitrogen atmosphere furtherance for the powdered sintering. Other systems which make the core of the SLS system are build room and the feed room for powder epitaxial, a temperature control system, and a scan path generator for the laser. The powder material for laser sintering is necessary to produce prototypes in Solid Freeform Fabrication(SFF) based on SLS process. This powder material is sintered in powder room using $CO_2$ laser after spreading evenly using roller to reproduce mold via SFF. This study addresses an SFF system by using the SLS process which applies single laser system to enable manufacturing of 3D shape. And to evaluate applicability of the single laser system, experiments were conducted with optimal fabricating process.

• 한국레이저가공학회지
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• 제5권3호
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• pp.15-20
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• 2002

The principal obstacle to selection of a laser processing method in production is its relatively high equipment cost and the natural unwillingness of production supervision to try something new until it is thoroughly proven. The major objective of this work is focused on the combined features of gas tungsten arc and a low-power cold laser beam. In this work, the laser beam from a 7 watts carbon monoxide laser was combined with electrical discharges from a short-pulsed capacitive discharge GTA welding power supply. When the low power CO laser beam passes through a special composition shielding gas, the CO molecules in the gas absorbs the radiation, and ionizes through a process blown as non-equilibrium, vibration-vibration pumping. The resulting laser-induced plasma(LIP) was positioned between various configurations of electrodes. The high-voltage impulse applied to the electrodes forced rapid electrical breakdown between the electrodes. Electrical discharges between tungsten electrodes and aluminum sheet specimens followed the ionized path provided by LIP. The result was well-focused melted spots.