• 한국산학기술학회논문지
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• 제16권9호
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• pp.5748-5755
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• 2015

스크라이빙 공정은 LED 칩 생성을 위한 절단 공정으로 칩의 특성 및 생산량을 결정하는 중요한 공정이다. 기존의 기계적 방식 및 레이저 방식의 스크라이빙 공정은 칩의 열 변형 및 강도 저하, 절단 영역의 제한 등의 문제점이 있다. 이러한 문제를 해결하기 위해 웨이퍼 내부에 공극을 생성하여 자가 균열을 유도하는 내부 레이저 스크라이빙 공정이 연구되고 있으나 LED 칩 제작을 위한 사파이어 웨이퍼의 절단에 대한 연구는 미비한 실정이다. 본 논문은 LED 칩 제작에 사용되는 사파이어 웨이퍼의 내부 레이저 스크라이빙 공정을 적용하기 위해 주요 가공 변수를 정립하고 가공 실험을 통하여 절단 특성을 분석함으로써 내부 레이저 스크라이빙 시스템 구축을 위한 기초 가공 조건을 확립하였다.

• 한국정밀공학회지
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• 제27권6호
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• pp.32-38
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• 2010

Laser material processing technology is adopted in several industry as alternative process which could overcome weakness and problems of present adopted process, especially semiconductor and display industry. In semiconductor industry, laser photo lithography is doing at front-end level, and cutting, drilling, and marking technology for both wafer and EMC mold package is adopted. Laser cleaning and de-flashing are new rising technology. There are 3 kinds of main display industry which use laser technology - TFT LCD, AMOLED, Touch screen. Laser glass cutting, laser marking, laser direct patterning, laser annealing, laser repairing, laser frit sealing are major application in display industry.

• 한국정밀공학회지
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• 제20권7호
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• pp.44-55
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• 2003

The Nd:YAG laser process is known to have high speed and deep penetration capability to become one of the most advanced welding technologies. This paper describes the machining characteristics of SM45C carbon steel welding by use of an Nd:YAG laser. In spite of its good mechanical characteristics, SM45C carbon steel has a high carbon contents and suffers a limitation in the industrial application due to the poor welding properties. The major process parameters studied in the present laser welding experiment were position of focus, travel speed and laser power. Optical microscope and SEM were used to investigate the microstructures of the welded zone. The experimental results showed that penetration depth of the welding process increases with laser power. Both the microstructural investigation and the theoretical calculations indicated that materials undergoes a very high heating and cooling cycle during welding process. It was also found that the austenite nucleation takes place at the initial stage and the completion temperature of austenite transformation is much higher than in the case of the arc welding.

• 한국기계가공학회지
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• 제14권6호
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• pp.104-110
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• 2015

LED has added value as a lighting source in the illuminating industry because of its high efficiency and low power consumption. In LED production processes, the chip cutting process, which mainly uses a scribing process with a laser has an effect on quality and productivity of LED. This scribing process causes problems like heat deformation, decreasing strength. The inner laser method, which makes a void in wafer and induces self-cracking, can overcome these problems. In this paper, cutting sapphire wafer for fabricating LED chip using the inner laser scribing process is proposed and evaluated. The aim is to settle basic experiment conditions, determine parameters of cutting, and analyze the characteristics of cutting by means of experimentation.

• 한국레이저가공학회지
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• 제4권2호
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• pp.39-45
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• 2001

This paper introduces a cleaning process for removing submicron-sized particles from NiP hard disk substrates by the liquid-assisted laser cleaning technique. Measurements of cleaning Performance and time-resolved optical diagnostics are Performed to analyze the physical mechanism of contaminant removal. The results reveal that nanosecond laser pulses are effective for removing the contaminants regardless of the wavelength and that a thermal mechanism involving explosive vaporization of liquid dominates the cleaning process.

• 한국레이저가공학회지
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• 제16권4호
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• pp.17-23
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• 2013

The research for the development of roll-to-roll printing process is actively underway on behalf of the existing semiconductor process. The roll-to-roll printing system can make the electronic devices to low-cost mass production. This study is performed for developing the manufacturing technology of the printing roll used in the printing process of electronic devices. The indirect laser engraving technology is used to create printable roll and the printable roll is made out of the chrome coated roll after coating copper and polymer on the surface of steel roll, ablating the polymer on the surface of roll and etching the roll. The 3 dimensional laser scanner and roll rotating systems are constructed and the system control program is developed. We have used the fiber laser of 100 W grade, the 3 dimensional laser scanner and the 3 axes moving stage system with a rotating axis. We have found the optimal conditions by performing the laser patterning experiments and can make the minimum line width of $24{\mu}m$ by using the developed 3 dimensional laser scanner system.

• Journal of Welding and Joining
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• 제24권5호
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• pp.67-73
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• 2006

Laser welding is suitable for welding to the aluminum alloy sheet. In order to apply the aluminum laser welding to production line, parameters should be optimized. In this study, the optimal welding condition was searched through the genetic algorithm in laser welding of AA5182 sheet with AA5356 filler wire. Second-order polynomial regression model to estimate the tensile strength model was developed using the laser power, welding speed and wire feed rate. Fitness function for showing the performance index was defined using the tensile strength, wire feed rate and welding speed which represent the weldability, product cost and productivity, respectively. The genetic algorithm searched the optimal welding condition that the wire feed rate was 2.7 m/min, the laser power was 4 kW and the welding speed was 7.95 m/min. At this welding condition, fitness function value was 137.1 and the estimated tensile strength was 282.2 $N/mm^2$.

• International Journal of Precision Engineering and Manufacturing
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• 제4권1호
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• pp.23-29
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• 2003

Stencil is used normally as a mask for solder pasting on pad of a printed circuit board (PCB). The objective of this study is to develop a stencil cutting system and determine the optimal conditions to make good-quality stencil by using a Nd:YAG laser. The effects of process parameters such as laser power, type of mask, gas pressure, cutting speed and pulse duration on the cut edge quality were investigated. In order to analyze the cut surface characteristics (roughness, kerfwidth, dross) optical microscopy, SEM microscopy and roughness measurements were used. As a result, the optimal conditions of cutting process parameters were determined, and the practical feasibility of the proposed system was also examined by using a commercial Gerber file for PCB stencil manufacturing.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2004년도 추계학술대회
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• pp.910-915
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• 2004

The objective of this study is to investigate the influence of process parameters, such as power of laser, travel speed of laser and material thickness, on the practical cutting region and the kerfwidth for the case of cutting of CSP 1N sheet using high power Nd:YAG laser with continuous wave(CW). In order to find the practical cutting region and the relationship between process parameters on the kerfwidth, several laser cutting experiments are carried out. The effective heat input is introduced to consider the influence of power and travel speed of laser on the kerfwidth together. From the results of experiments, the allowable cutting region and the relationship between the effective heat input and kerfwidth for the case of cutting of CSP 1N sheet using high power CW Nd:YAG laser have been obtained to improve the dimensional accuracy of the cut area.

• 한국레이저가공학회지
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• 제14권4호
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• pp.14-20
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• 2011

The advantage of using lasers for through silicon via (TSV) drilling is that they allow higher flexibility during manufacturing because vacuums, lithography, and masks are not required; furthermore, the lasers can be applied to metal and dielectric layers other than silicon. However, conventional nanosecond lasers have disadvantages including that they can cause heat affection around the target area. In contrast, the use of a picosecond laser enables the precise generation of TSVs with a smaller heat affected zone. In this study, a comparison of the thermal and crystallographic defect around laser-drilled holes when using a picosecond laser beam with varing a fluence and repetition rate was conducted. Notably, the higher fluence and repetition rate picosecond laser process increased the experimentally recast layer, surface debris, and dislocation around the hole better than the high fluence and repetition rate. These findings suggest that even the picosecond laser has a heat accumulation effect under high fluence and short pulse interval conditions. To eliminate these defects under the high speed process, the CDE (chemical downstream etching) process was employed and it can prove the possibility to applicate to the TSV industry.