• 한국레이저가공학회:학술대회논문집
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• 한국레이저가공학회 2006년도 춘계학술발표대회 논문집
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• pp.60-65
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• 2006

Previous studies demonstrated that laser ablation under transparent liquid can result in ablation enhacement and particle removal from the surface. In this work, the liquid-assisted excimer laser ablation process is examined fer polyethylene terephthalate (PET), polymethyl methacrylate (PMMA), Si, and alumina with emphasis on ablation enhacement, surface topography, and debris formation. In the case of PET and PMMA, the effect of liquid is analyzed both fer thin water film and bulk water. As the ablation enhanement by liquid is already known for Si and alumina, the analysis focuses on surface topography and debris formation resulting from the liquid-assisted laser ablation process. The results show that application of liquid increases the ablation rate of PMMA while that of PET remains unchanged even in the liquid-assisted process. It is also revealed that the liquid can significantly improve the surface quality by reducing the debris deposition. However, the surface roughness is generally deteriorated in the liquid-assisted process. The surface toporaphy is found to be strongly dependent on the method of liquid application, i.e., thin film or bulk liquid.

• 대한기계학회논문집
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• 제19권8호
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• pp.1907-1914
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• 1995

An on-line measurement of the workpiece hardened depth in laser surface hardening processes is very much difficult to achieve, since the hardening process occurs in depth wise direction. In this paper, the hardened depth is estimated using a multilayered neural network. Input data of the neural network are the surface temperatures at arbitrary chosen five surface points, laser power and traveling speed of laser beam torch. To simulate the actual hardening process, a finite difference method(FDM) is used to model the process. Since this model yields the calculation results of the temperature distribution around the workpiece volume in the vicinity of the laser torch, this model is used to obtain the network's training data and laser to evaluate the performance of the neural network estimator. The simulation results show that the proposed scheme can be used to estimate the hardened depth with reasonable accuracy.

• 한국레이저가공학회지
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• 제11권3호
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• pp.10-15
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• 2008

This study is aimed to analyse the laser glass bonding process numerically. Due to the viscoelastic behaviour of glass, the extremely large deformation of the frit seal is resulted continuously over the transition temperature, so that the thermal boundary condition be changed in the entire calculation process. The commercial FEM algorithm is restrictively able to remesh the large geometrical boundary shape and to adapt the boundary conditions simultaneously. According to our manual adaptation of increasing the laser line intensity to 700 mW/mm, it is possible to estimate the thermal glass bonding process under the fracture stress in principle. But it should be studied further in the case of high laser line intensity.

• 한국레이저가공학회지
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• 제3권3호
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• pp.13-19
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• 2000

The stencil is a thin stainless sheet in which a pattern is formed, which is placed on a surface of plate to reproduce the pattern of electric circuit. Conventionally the stencil has been produced by etching process. This process has many anti-environmental factors. In this study, Nd : YAG laser cutting process has been applied for stencil manufacturing. The study is focused on estimating kerf width of laser cut stencil by E.B.P.(Error Back-Propagation). This algorithm is good for estimating target value from input value. In this paper, target value was kerf width, and input values were frequency, pulse width, cutting speed and laser power. E.B.P. after teaming input and target could estimate kerf width from some variables precisely.

• 한국기계가공학회지
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• 제21권2호
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• pp.11-22
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• 2022

This paper presents the development process for a high-power diode laser for metal surface hardening. To combine the emissions from several laser bars, it is necessary to collimate the emitted light using an optical lens. Thus, to achieve a suitable power density and uniform beam profile, several optical layouts were proposed. To estimate the laser beam for a flat-top distribution, a numerical analysis was performed using the ZEMAX software, and the results were compared with the experimental results. With a focal lens assembled in a serial diode stack source, the design can utilize the advantage of compacting the overall beam size. Experimental results for a robotic system demonstrated the processing ability of this diode laser module in industrial laser hardening.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2005년도 금형가공,미세가공,플라스틱가공 공동 심포지엄
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• pp.54-58
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• 2005

Femtosecond laser is the latest generation pulsed laser delivering shortest pulses. Any solid materials can be machined by it. Femtosecond laser micromachining allows highest precision and minimal heat influence within the workpiece. But due to the complex physical phenomena between the laser beam and the workpiece materials, it is very difficult to determine the optimal process conditions in the femtosecond laser micromachining. In this study, a method to simulate the femtosecond laser micromachining process was proposed. And femtosecond laser micro patterning processes of chromium thin film are simulated by the proposed method using a commercial FE code, LS-Dyna. Simulation results were compared with those of experiments.

• 소성∙가공
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• 제19권8호
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• pp.517-522
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• 2010

Selective laser melting (SLM) is emerged as a new manufacturing technique to directly fabricate precise parts using metallic materials. The final characteristics of a component fabricated through the SLM process are strongly dependent upon various parameters such as laser power, scan rate and pulse duration, etc. This paper, therefore, focuses on the dimensional characteristics of melted $20{\mu}m$ Fe-Cr-Ni powder by fiber laser for the selective laser melting process. With energy density decrease, the height and depth were decreased. Although the conditions are of the same energy density, the shape is different by laser power and scan rate. The shapes at various laser parameters were divided into 3 groups based on depth over height. The smooth regular shape is obtained under the conditions of $50{\mu}m$ of powder height and $15-20{\mu}s$ of pulse duration. And the laser power influenced the variation of shape more significantly than the scan rate.

• 한국정밀공학회지
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• 제27권10호
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• pp.40-44
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• 2010

Laser drilling is an enabling technology for Through Silicon Via (TSV) interconnect applications. Recent advances in picoseconds laser drilling of blind, micron sized vias in silicon is presented here highlighting some of the attractive features of this approach such as excellent sidewall quality. In this study, we dealt with comparison of heat affection around drilled hole between a picosecond laser and a nanosecond laser process under the UV wavelength. Points which special attention should be paid are that picosecond laser process lowered experimentally recast layer, surface debris and micro-crack around hole in comparison with nanosecond laser process. These finding suggests that laser TSV process has possibility to drill under $10{\mu}m$ via. Finally, the laser drilling platform was constructed successfully.

• 한국정밀공학회지
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• 제22권7호
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• pp.19-26
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• 2005

The objective of this study is to investigate the influence of process parameters, such as power of laser, cutting speed of laser and material thickness, on the practical cutting region and the kerfwidth fer the case of cutting of CSP IN sheet using high power Nd:YAC laser in continuous wave(CW) mode. In order to obtain the practical cutting region and the relationship between process parameters on the kerfwidth, several laser cutting experiments are carried out. The effective heat input is introduced to consider the influence of power and cutting speed of laser on the kerfwidth together. From the results of experiments, the allowable cutting region and the relationship between the effective heat input and kerfwidth fur the case of cutting of CSP 1N sheet using high power CW Nd:YAG laser have been obtained to improve the dimensionalaccuracyofthecutarea.

• Journal of Welding and Joining
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• 제12권2호
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• pp.20-27
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• 1994

The laser marking system is widely used in many industrial manufacturing companies as an effective process, because it is versitile, clean, and fast to run. Minimal heat deformation and zero tool wear can be obtained using fast and non-contact process of laser marking. As an introductory level, the basic knowledges about laser marking system layout and its components are presented with diagrams. The effects, requirements, and application example of laser marking process are also described in this paper.