• Title/Summary/Keyword: Laser process

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Micro-pattern Fabrication of Amorphous Alloy by Laser Beam Machining (비정질 합금의 마이크로 패턴 레이저 가공)

  • Kim, Haan;Park, Jong Wuk
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.21 no.4
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    • pp.77-83
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    • 2022
  • Amorphous alloys exhibit excellent mechanical properties; therefore, application technology development is being attempted in various fields. However, industrial use of application technology is limited owing to the limitations in fabrication. In this study, micropattern fabrication of an amorphous alloy was conducted using laser beam machining. Although microhole fabrication is possible without the deformation of the amorphous phase through nanosecond pulsed laser beam machining, there are limitations in the generation of recast layers and spatters. In cover plate laser beam machining (c-LBM), a cover plate is used to reduce the thermal deformation and processing area. Therefore, it is possible to fabricate holes at the level of several micrometers. In this study, it was confirmed that recast layers are hardly generated in c-LBM. Furthermore, square-shaped micropatterns were successfully fabricated using c-LBM.

Characterization of the Deposited Layer Obtained by Direct Laser Melting of Fe-Cr Based Metal Powder (Fe-Cr계 금속 분말의 직접 레이저 용융을 통해 형성된 적층부 특성 분석)

  • Jang, Jeong-Hwan;Joo, Byeong-Don;Jeon, Chan-Hu;Moon, Young-Hoon
    • Korean Journal of Metals and Materials
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    • v.50 no.2
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    • pp.107-115
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    • 2012
  • Direct laser melting (DLM) is a powder-based additive manufacturing process to produce parts by layer-by-layer laser melting. As the properties of the manufactured parts depend strongly on the deposited laser-melted bead, deposited layers obtained by the DLM process were characterized in this study. This investigation used a 200 W fiber laser to produce single-line beads under a variety of different energy distributions. In order to obtain a feasible range for the two main process parameters (i.e. laser power and scan rate), bead shapes of single track deposition were intensively investigated. The effects of the processing parameters, such as powder layer thickness and scan spacing, on geometries of the deposited layers have also been analyzed. As a result, minimum energy criteria that can achieve a complete melting have been suggested at the given powder layer thickness. The surface roughnesses of the deposited beads were strongly dependent on the overlap ratio of adjacent beads and on the energy distributions of laser power. Through microstructural analysis and hardness measurement, the morphological and mechanical properties of the deposited layers at various overlapped beads have also been characterized.

Development of remote welding system using fiber laser (화이버 레이저 원격용접 기술개발)

  • Kim K. S.;Jung C. H.;Kim I. H.;Chang I. S.;Lee H. B,
    • Laser Solutions
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    • v.8 no.3
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    • pp.27-30
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    • 2005
  • Nowadays, most automotives companies are making use of laser welding in car body assembly shop. But even though laser welding is better than resistance spot welding in many points, its application has been limited to special technology for manufacturing. The paper introduces in the field of remote welding system (RWS) to improve the process efficiency of laser welding. Positioning time of RWS between welding stitches is dramatically reduced to zero. It is a kind of solutions to generalize laser welding in mass production. This RWS consists of fiber laser, industrial robot and 3-axis scanner.

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Laser Preheating Method for Three-Dimensional Laser Assisted Milling (3차원 레이저 보조 밀링을 위한 레이저 예열 방법에 관한 연구)

  • Oh, Won-Jung;Lee, Choon-Man
    • Journal of the Korean Society for Precision Engineering
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    • v.32 no.12
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    • pp.1031-1037
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    • 2015
  • Laser assisted machining (LAM) is an effective method with which to effectively process difficult-to-cut materials. Simple machining processes, such as turning and linear tool paths, have been studied by many researchers. But, there are few research efforts on LAM workpieces using threedimensional shapes because of difficulties controlling the laser heat on workpieces with inclined angles or curved surfaces. Two methods for machining three-dimensional workpieces are proposed in this paper. The first is that the heat source shape and laser focal length are maintained using an index table. Second, a rotary type laser module is controlled using an algorithm to move the laser heat source in all directions. This algorithm was developed to control the rotary type laser module and the machine tool simultaneously. These methods are verified by a CATIA simulation.

A Study on Laser Ablation of Copper Thin Foil by 355nm UV Laser Processing (355nm UV 레이저를 이용한 구리 박판 가공 시 어블레이션에 관한 연구)

  • Oh, Jae-Yong;Shin, Bo-Sung
    • Journal of the Korean Society for Precision Engineering
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    • v.24 no.2 s.191
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    • pp.134-139
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    • 2007
  • Usually nanosecond pulsed laser processing of metal is mainly affected by the thermal ablation. Many studies of the theoretical analysis and modeling to predict the laser ablation of metal are suggested on the basis of the photothermal mechanism at higher laser fluence. In this paper, we investigate the etching depth and laser fluence of laser ablation of copper foils and propose the simplified SSB Model(Srinivasan-Smrtic-Babu model) to study the photothermal effect of nanosecond pulsed laser ablation. The experimental results show that the photothermal ablation of the 355nm DPSS $NdYVO_{4}$ laser is useful to process the copper thin foils.

The Study on Wafer Cleaning Using Excimer Laser (엑사이머 레이저를 이용한 웨이퍼 크리닝에 관한 고찰)

  • 윤경구;김재구;이성국;최두선;신보성;황경현;정재경
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2000.05a
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    • pp.743-746
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    • 2000
  • The removal of contaminants of silicon wafers has been investigated by various methods. Laser cleaning is the new dry cleaning technique to replace wafer wet cleaning in the near future. A dry laser cleaning uses inert gas jet to remove contaminant particles lifted off by the action of a KrF excimer laser. A laser cleaning model is developed to simulate the cleaning process and analyze the influence of contaminant particles and experimental parameters on laser cleaning efficiency. The model demonstrates that various types of submicrometer-sized particles from the front sides of silicon wafer can be efficiently removed by laser cleaning. The laser cleaning is explained by a particle adhesion model. including van der Waals forces and hydrogen bonding, and a particle removal model involving rapid thermal expansion of the substrate due to the thermoelastic effect. In addition, the experiment of wafer laser cleaning using KrF excimer laser was conducted to remove various contaminant particles.

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Visualization of weld plume using high-speed holography (고속 홀로그래피에 의한 용접 플룸 거동의 가시화)

  • 백성훈;박승규;김민석;정진만;김철중
    • Journal of Welding and Joining
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    • v.17 no.1
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    • pp.71-76
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    • 1999
  • The real-time holographic interferometer with digital high-speed camera is applied to the experimental study of laser induced plasma/plume in pulsed Nd:YAG laser welding. A pulsed Nd:YAG laser with 1.2 kW average power is applied to generate laser induced plume. The recording speed of the high-speed camera is 3,000 f/s. The high speed photographs of weld plume without another visualization method, are compared with the visualization photographs with holographic interferometer. The radiation intensity from the laser induced plume is recorded by the high speed photographs, which fluctuated during laser radiation and disappeared after laser end. The density distribution of the plume is recorded by the holographic visualization method. The experimental results show the process of generation of the laser induced plasma/plume, and give the feasibility of quantitative measurement of laser induced plume in laser welding.

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Selective Laser Sintering of Cu/Polyamide Mixed Powder (Cu/Polyamide 혼합분말의 선택적 레이저 소결)

  • 박흥일;이길근
    • Journal of Powder Materials
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    • v.8 no.4
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    • pp.239-244
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    • 2001
  • To investigate the effect of process parameters on selective laser sintering of Cu/polyamide mixed powder, Cu/polyamide mixed powder was sintered by selective laser with changing laser power and scanning speed. The properties of sintered body were evaluated by measuring the density and tensile strength, and analysis of XRD, FT-Raman and microstructure. With an increase in the laser power, the density and ultimate tensile strength of sintered Cu/polyamide body increase and then decrease. The maximum values of the density and ultimate tensile strength were decreased with increasing laser scanning speed. These changes were concerned with the difference of irradiation energy of laser into the powder layer. It was considered that the change of the mechanical property of the sintered body with irradiation energy of laser is due to the changes of amount of copper particle and property of polyamide.

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The Design of Parallel Processing S/W Using CUDA for Realtime 3D Laser Ladar Imaging System (실시간 3차원 레이저 레이더 영상 생성을 위한 CUDA 기반 병렬처리 소프트웨어 설계)

  • Cho, Yong Il;Ha, Choong Lim;Yang, Ji Hyeon;Kim, Jae Hyup
    • Journal of the Korea Society of Computer and Information
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    • v.18 no.1
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    • pp.1-10
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    • 2013
  • In this paper, we propose a CUDA(Common Unified Device Architecture) based SW(software) design method for CPU(Central Processing Unit) and GPU(Graphic Processing Unit) parallel structure to implement real-time process in 3D Laser ladar(LADAR) imaging system. LADAR is a complex system to generate 3-dimensional image based on the laser ranging information, and requires massive process resources in each phase. Therefore, designing and implementing parallel structure are crucial to realize a real-time process within limited system resource. As a conclusion, we can meet the speed of required real-time process allocating separable work load to CUDA GPU by analyzing process algorithm in each phase and confirm the process speed increase by 46%.

Laser Micro Soldering and Soldering Factors (레이저 마이크로 솔더링과 솔더링 인자)

  • Hwang, Seung Jun;Hwang, Sung Vin;Jung, Jae Pil
    • Journal of the Microelectronics and Packaging Society
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    • v.27 no.3
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    • pp.1-8
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    • 2020
  • In this paper, the principles, characteristics and recent studies of the laser micro soldering are reviewed. The factors which influence laser micro welding and soldering are also included. Laser soldering is a non-contact process that transfers energy to solder joint by a precisely controlled laser beam. In recent electronics industry, the demands for laser soldering are increasing due to bonding for complex circuits and local heating in micro-joint. In laser soldering, there are several important factors like laser absorption, laser power, laser scanning speed, and etc, which affect laser solderability. The laser absorption ratio depends on materials, and each material has different absorption or reflectivity for the laser beam, which requires fine adjustment of the laser beam. Laser types and operating conditions are also important factors for laser soldering performance, and these are also reviewed.