• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2000.11a
• /
• pp.89-92
• /
• 2000

Laser claddmg 1s thc deposition of material on the surface of a part or workpiece. Cladding of metals produces a 100% dense metallurgically-bonded coating with minimal dilution for enhanced corrosion, abrasion and wear resistance. Despite of minimal heat Input and reduced processing time, cladding quality 1s affected by various process condition such as laser power and feed rate. Therefore, it is necessary to develop the momtoring and control methods of laser cladding process for the best cladding quality. In this paper, laser cladding monitoring system using CCD camera for measuring cladding pool shape, and photo-diode sensor for detecting optical signal emitted from the cladding front is introduced The variables extracted using this system can be apphed to control the laser cladding system to achieve the best claddmg results..

• Korean Journal of Materials Research
• /
• v.17 no.7
• /
• pp.352-357
• /
• 2007

Since a pattern defects "repair" system using a diode pumped solid state laser for Flat Panel Display (FPD) was suggested, a lot of laser systems have been explored and developed for mass-production microfabrication process. A maskless lithography system using 405 nm violet laser and Digital Micromirror Device (DMD) has been developed for PDP and Liquid Crystal Display (LCD) Thin Film Transistor (TFT) photolithography process. In addition, a "Laser Direct Patterning" system for Indium Tin Oxide (ITO) for Plasma Display Panel(PDP) has been evaluated one of the best successful examples for laser application system which is applied for mass-production lines. The "heat" and "solvent" free laser microfabrications process will be widely used because the next-generation flat panel displays, Flexible Display and Organic Light Emitting Diode (OLED) should use plastic substrates and organic materials which are very difficult to process using traditional fabrication methods.

• Current Photovoltaic Research
• /
• v.4 no.2
• /
• pp.54-58
• /
• 2016

Laser-doped selective emitter process requires dopant source deposition, spin-on-glass, and is able to form selective emitter through SiNx layer by laser irradiation on desired locations. However, after laser doping process, the remaining dopant layer needs to be washed out. Laser-induced melting of pre-deposited impurity doping is a precise selective doping method minimizing addition of process steps. In this study, we introduce a novel scheme for fabricating highly efficient selective emitter solar cell by laser doping. During this process, laser induced damage induces front contact destabilization due to the hindrance of silver nucleation even though laser doping has a potential of commercialization with simple process concept. When the laser induced damage is effectively removed using solution etch back process, the disadvantage of laser doping was effectively removed. The devices fabricated using laser doping scheme power conversion efficiency was significantly improved about 1% abs. after removal the laser damages.

• Journal of the Korean Society for Precision Engineering
• /
• v.21 no.12
• /
• pp.13-20
• /
• 2004

Manufacturing process for the microfluidic device can include such sequential steps as master fabrication, electroforming, and injection molding. The laser ablation using masks has been applied to the fabrication of channels in microfluidic devices. In this study, manufacturing of polymer master and mold insert for micro injection molding was investigated. Ablation of PET (polyethylene terephthalate) by the excimer laser radiation could be used successfully to make three dimensional master fur nickel mold insert. The mechanism fur ablative decomposition of PET with KrF excimer laser $({\lambda}: 248 nm, pulse duration: 5 ns)$ was explained by photochemical process, while ablation mechanism of PMMA (polymethyl methacrylate) is dominated by photothermal process, the .eaction between PC (polycarbonate) and KrF excimer laser beam generate too much su.face debris. Thus, PET was adopted in polymer master for nickel mold insert. Nickel electroforming using laser ablated PET master was preferable for replication method. Finally, it was shown that excimer laser ablation can substitute for X-ray lithography of LIGA process in microstructuring.

• Transactions of Materials Processing
• /
• v.18 no.3
• /
• pp.262-267
• /
• 2009

Selective laser sintering is a kind of rapid prototyping process whereby a three-dimensional part is built layer wise by laser scanning the powder. This process is highly influenced by powder and laser parameters such as laser power, scan rate, fill spacing and layer thickness. Therefore a study on fabricating Fe-Ni-Cr powder by selective laser sintering has been performed. In this study, fabrication was performed by experimental facilities consisting of a 200W fiber laser which can be focused to 0.08mm and atmospheric chamber which can control atmospheric pressure with argon. With power increase or energy density decrease, line width was decreased and line surface quality was improved with energy density increase. Surface quality of quadrangle structure was improved with fill spacing optimization.

• Laser Solutions
• /
• v.12 no.4
• /
• pp.17-25
• /
• 2009

The surface cleaning method based on the laser-induced breakdown (LIB) of gas and subsequent plasma and shock wave generation can remove small particles from solid surfaces. In the laser shock cleaning (LSC) process, a high-power laser pulse induces optical breakdown of the ambient gas above the solid surface covered with contaminant particles. The subsequently created shock wave followed by a high-speed flow stream detaches the particles. In this work, a novel surface cleaning process using laser-induced breakdown of liquid is introduced and demonstrated. LIB of a micro liquid jet increases the shock wave intensity and thus removes smaller particle than the conventional LSC method. Experiments demonstrate that the cleaning force and cleaning efficiency are also increased significantly by this method.

• Laser Solutions
• /
• v.8 no.2
• /
• pp.21-32
• /
• 2005

The excimer laser ablation of a polymer occurs by the excitation of chemical bonds to energy levels that are above the dissociation energy. In this process, however, fragmented debris is finally ejected explosively by the scission of bonds and accumulates on the material surface. In the present work, a process for eliminating surface debris contamination generated by the laser ablation of a polymer is developed. The proposed approach for removing surface debris utilizes an erasable ink pasted on a polymide. The ink pasted polyimide is ablated by KrF excimer laser. The surface debris ejected from the polyimide is then combined with the ink layer on the polymer. Finally, both the surface debris and the ink layer are removed using adhesive tape or alcohol solvent. The results suggest that the erasable ink method is a simple, low cost, and extremely effective debris eliminating process.

• Journal of Welding and Joining
• /
• v.28 no.3
• /
• pp.42-48
• /
• 2010

Polycarbonate (PC) and Acrylonitrile Butadiene Styrene (ABS) were welded by a combination of a diode laser and a CNC machining center. Laser beam delivered through the transparent PC and was absorbed in an opaque ABS. Polymers were melted and joined by absorbed and conducted heat. Experiments were carried out by varying working distance from 44mm to 50mm for the focus spot diameter control, laser input power from 10W to 25W, and scanning speed from 100 to 400mm/min. The weld bead and cross-section were analyzed for weld quality, and tensile results were presented through the joint force measurement. With focus distance at 48mm, laser power with 20W, and welding speed at 300mm/min, experimental results showed the best welding quality which bead size was measured to be 3.75mm. The shear strength at the given condition was $22.8N/mm^2$. Considering tensile strength of ABS is $43N/mm^2$, shear strength was sufficient to hold two materials. A single process was possible in a CNC machining system, surface processing, hole machining and welding. As a result, the process cycle time was reduced to 25%. Compared to a typical process, specimens were fabricated in a single process, with high precision.

• Transactions of the Korean Society of Machine Tool Engineers
• /
• v.11 no.3
• /
• pp.39-44
• /
• 2002

As laser cutting process is widely used in industry, an automated on-line process control system has become very important. In this paper, development of a laser cutting monitoring system, which is regarded as the fundamental step toward automation of the process, is presented. Acoustic emission and an artificial neural network were used for the monitoring system. With given process Parameters including laser power and scanning speed the system can predict the suitability of laser beam for the cutting or a stainless steel (STS304) plate.

• Laser Solutions
• /
• v.12 no.4
• /
• pp.1-5
• /
• 2009

Conventional patterning based on wet-process for multi-layered film is a relatively complex and costly process though it is a necessary step for fabrication of TFT-LCD module. Recently, a direct pattering by laser has been studied because it is low cost and simple process compared to the wet process. In this work, the selective removal process of multi-layered film (polyimide/indium tin oxide/glass) is studied by modeling the thermal and mechanical behavior for multi-layered structure. Especially, the effects of thickness of polyimide layer are examined.