• Proceedings of the KWS Conference
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• 2005.11a
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• pp.231-233
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• 2005

Laser have been utilized as a heat source for the soldering of electronic components for the their capability of localized heating and faster heating rate. Laser soldering process, especially the diode laser soldering of BGA solderball was investigated. In this study, an attempt was made to investigate the possibility of laser soldering using Sn-37Pb and Sn-3Ag-0.5Cu solderball. The laser energy absorbed on the pad raised the temperature of the solderball forming a reflowed solder bump. The result were discussed based on the measurement of pull and shear strength of the bond.

• Laser Solutions
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• v.4 no.2
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• pp.47-57
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• 2001

This study deals with the laser cutting of stencil for the PCB. The most important aim of this study is to determine optimal conditions which make good-qualify stencil in Nd:YAG laser cutting. We made an experiment according to various variables (power. type of mask. gas pressure, cutting speed, and pulse width) and analyzed the cutting characteristics (surface roughness, kerf width. dross) . Each variable has optimal value for good-qualify cut edge under fixed condition. And neural network after learning experimental data with a million time iteration could predict surface roughness of cut edge under arbitrary condition approximately.

• Proceedings of the KIEE Conference
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• 1997.07d
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• pp.1301-1303
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• 1997

This study was performed to investigate the deposition mechanism of $SiO_2$ by ArF excimer Laser(193nm) CVD with $Si_2H_6$ and $N_2O$ gas mixture and evaluate Laser CVD quantitatively by modeling. In this study, new model of $SiO_2$ deposition process by Laser CVD is introduced and deposition rates are simulated by computer with the basis on this modeling. And simulation results are compared with experimental results measured at various conditions such as reaction gas ratio, chamber pressure, substrate temperature and laser beam intensity.

• Laser Solutions
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• v.3 no.3
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• pp.21-29
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• 2000

For the direct metal shape processing the powder feed device which is different from the widely used in rapid prototyping. is developed, The three dimensional object is shaped with the melting metal powder. The developed research has applied to rapid prototyping in ultraprecision for MEMS and medical science fields required of rapid manufacture of complex shape. The goal of this study make 3D model which has precision accuracy. Powder spreading apparatus has been more improved because that the control of powder spread is very important in layer manufacturing. It consists of the vibration motor, nozzle and tube which supplies various metal powder. This apparatus could control the spreading velocity that could control powder spreading thickness. Laser on/off switch was adapted because laser scanning velocity must be preserved constantly to prevent heat transformation of laser overheating. The error between sintered thickness md experimental one occurred by shrinkage in sintering melting process. The problem of heat transformation was solved by On/Off switching system.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2006.05a
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• pp.251-254
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• 2006

In this paper, cutting qualifies and fracture strength of silicon dies by laser dicing are investigated. Laser micromachining is the non-contact process using thermal ablation and evaporation mechanisms. By these mechanisms, debris is generated and stick on the surface of wafer, which is the problem to apply laser dicing to semiconductor manufacture process. Unlike mechanical sawing using diamond blade, chipping on the surface and crack on the back side of wafer isn't made by laser dicing. Die strength by laser dicing is measured via the three-point bending test and is compared with the die strength by mechanical sawing. As a results, die strength by the laser dicing shows a decrease of 50% in compared with die strength by the mechanical sawing.

• Journal of Welding and Joining
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• v.29 no.6
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• pp.45-48
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• 2011

In this research, laser welding of automotive transmission components was investigated to replace electron beam welding which is normally conducted under vacuum condition. Fiber laser welding was applied to the automotive transmission components - hub clutch and annulus gear. In the component welding, the laser welding parameters were optimized to eliminate spatters and the end crater. By applying laser welding to the transmission parts, the process time could be reduced up to 70% compared with the current electron beam welding process.

• Medical Lasers
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• v.10 no.2
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• pp.76-81
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• 2021

Biological tissues and organs are composed of different arrays of cells, biochemical cues, and extracellular matrices arranged in a complex microarchitecture. Laser-Assisted Bioprinting (LAB) is an emerging and promising technology that is reproducible with high accuracy that can be used for fabricating complex bioengineered scaffolds that mimic tissues and organs. The LAB process allows researchers to print intricate structural scaffolds using cells and different biomaterials essential for facilitating cell-scaffold interaction and to induce tissue and organ regeneration which cannot be achieved in a traditional scaffold fabrication. This process can fabricate artificial cell niches or architecture without affecting cellular viability and material integrity. This review tackles the basic principles and key aspects of Laser-Assisted Bioprinting. Recent advances, limitations, and future perspectives are also discussed.

• Journal of the Korean Society of Safety
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• v.10 no.3
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• pp.30-41
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• 1995

This paper proposed a simple method for measuring surface roughness of ground surface. Utilizing non-contact in-process measuring system using the diode laser. The measurement system is consisted of a laser unit with a diode laser and a cylindrical lens, a detecting unit with polygon mirror and CCD array sensor, and a signal processing unit with a computer and device. During operation, this measuring system can provide information on surface roughness in the measuring distance with a single sampling and simultaniously monitor the state of the grind wheel. The experimental results, showed that the Increase of the feed rate and the dressing speed an caused increase in the surface roughness and when the surface roughness is 4Rmax-10Rmax, the cutting speed is 1653m/min-1665m/min, the table speed is 0.2n1/min -0.9m/min, the dressing speed is 0.2mm/rev～0.4mm/rev, the stylus method and the in-process method can be obtained the same results. Thus, under limited working conditions, using the proposed system, the surface roughness of the ground surface during cylindrical grinding can be obtained through the in-process measurement method using the diode laser.

• Advances in materials Research
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• v.13 no.1
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• pp.1-18
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• 2024

The present experimental investigation focuses on finding optimal parametric data-set of laser micro-drilling operation with minimum taper and Heat-affected zone during laser micro-drilling of Carbon Nanotube/Epoxy-based composite materials. Experiments have been conducted as per Box-Behnken design (BBD) techniques considering cutting speed, lamp current, pulse frequency and air pressure as input process parameters. Then, the relationship between control parameters and output responses is developed using second-order nonlinear regression models. The analysis of variance test has also been performed to check the adequacy of the developed mathematical model. Using the Response Surface Methodology (RSM) and an Accelerated particle swarm optimization (APSO) technique, optimum process parameters are evaluated and compared. Moreover, confirmation tests are conducted with the optimal parameter settings obtained from RSM and APSO and improvement in performance parameter is noticed in each case. The optimal process parameter setting obtained from predictive RSM based APSO techniques are speed=150 (m/s), current=22 (amp), pulse frequency (3 kHz), Air pressure (1 kg/cm²) for Taper and speed=150 (m/s), current=22 (amp), pulse frequency (3 kHz), air pressure (3 kg/cm²) for HAZ. From the confirmatory experimental result, it is observed that the APSO metaheuristic algorithm performs efficiently for optimizing the responses during laser micro-drilling process of nanocomposites both in individual and multi-objective optimization.

• ETRI Journal
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• v.35 no.3
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• pp.459-468
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• 2013

A novel integrated laser, that is, a distributed reflector laser diode integrated with an electroabsorption modulator, is proposed to improve the output efficiency, single-mode stability, and chirp. The proposed laser can be realized using the selective metalorganic vapor phase epitaxy technique (that is, control of the width of the insulating mask), and its fabrication process is almost the same as the conventional electroabsorption modulated laser (EML) process except for the asymmetric coupling coefficient structure along the cavity. For our analysis, an accurate time-domain transfer-matrix-based laser model is developed. Based on this model, we perform steady-state and large-signal analyses. The performances of the proposed laser, such as the output power, extinction ratio, and chirp, are compared with those of the EML. Under 10-Gbps NRZ modulation, we can obtain a 30% higher output power and about 50% lower chirp than the conventional EML. In particular, the simulation results show that the chirp provided by the proposed laser can appear to have a longer wavelength side at the leading edge of the pulse and a shorter wavelength side at the falling edge.