• Laser Solutions
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• v.15 no.4
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• pp.6-11
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• 2012

Laser beam can be either absorbed or scattered in porous ceramic material and its optical characteristics need to be understood. Electro-magnetic multiphysics software was used to simulate and understand the actual scattering phenomena in porous materials. 785nm femtosecond laser was irradiated on the surface of ceramic material and strong scattering occurred in drilling process. The computer results showed the scattering and absorption phenomena of Aluminum oxide were a mixture of dielectric and metallic material. The computer simulation showed the laser beam was almost extinct at the aspect rate of 5 approximately.

• Laser Solutions
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• v.4 no.2
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• pp.29-38
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• 2001

A development of in-process and reliable monitoring system in laser materials processing is essential for successful applications toward the real industrial fields. It was known that optical signals induced by laser-matter interactions provide a good indication not only to monitor various defects but also to characterize and identify the process However there are still difficulties to implement the optical monitoring system in real fields since the system is susceptible to the spurious change of the signal affected by the variation of experimental conditions and environmental noises. In this article. a new type of optical monitoring technique named 'chromatic modulation technique' is described as a reliable, robust and sensitive monitor for the applications in laser materials processing in order to tackle the conventional problems in optical system.

• Proceedings of the Korean Society of Laser Processing Conference
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• 2006.06a
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• pp.108-111
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• 2006

Recently, mobile information devices, such as cellular phone, PDA(Personal Digital Assistant, PDA) are getting smaller and thinner. Accordingly, ultra precision welding technology is required to manufacture the high performance system for use in the telecommunication industry. In this study, we propose the laser micro welding process. Using ytterbium fiber laser, a wide range of experiments have been carried out for the gold wire-to-gold thin film welding.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.423-426
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• 2005

A new chip on glass(COG) technique by making use of a high power diode laser for LCD driver IC packaging of LCD has been developed. A laser joining technology of the connection of IC chip to glass panel has several advantages over conventional method such as hot plate joining: shorter process time, high reliability of joining, and better fur fine pitch joining. The reach time to cure temperature of ACF in laser joining is within 1 second. In this study, results show that the total process time of joining is reduced by halves than that of conventional method. The adhesion strength is mainly 100-250 N/cm. It is confirmed that the COG technology using high power diode laser joining can be applied to advanced LCDs with a fine pitch.

• Laser Solutions
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• v.10 no.2
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• pp.25-28
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• 2007

Rapidity and flexibility are very important in the electronic components industry. The laser process provides the industry with more rapidity and flexibility. For this reason, the laser process is considered as an acceptable method in terms of rapidity and flexibility. In this study, a wide range of experiments have been carried out on the gold wire-to-nickel thin film joining using the continuous wave fiber laser. In particular, changes in the shape of joint depending on the changes of a target point have been observed.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.10 no.1
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• pp.31-37
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• 2011

Recently, the technology of surface treatment is being more important which affects the material cost reduction and substitution to the expensive material. The material used for the mechanical processing should have not only high intensity, but also strength toughness, wear resistance and corrosion resistance. In order to increase the durability and have better quality of the parts using such kind of tooling material, various kinds of research of the surface hardening through many kinds of heat resources is being done and practically applied. In this study, the characteristics of hardening surface zone for high strength of the press die material through laser beam irradiation are researched. In this study, it is experimentally observed by the status of the surface morphology, tensile strength, the hardness distribution of the base metal and wear condition by the surface hardness pattern by the laser beam based on the process parameters of $CO_2$ laser by using SM45C and STD11 used for press tool. Through this research, the characteristics of surface hardened zone for high strength of the thin metal by laser beam irradiation is done.

• Journal of the Korean Society for Precision Engineering
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• v.19 no.2
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• pp.106-113
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• 2002

Stencil is used normally as a mask for seeder pasting on pad of PCB. The objective of this study is to develop stencil cutting system and determine optimal conditions which make good-quality stencil by using a Nd:YAG laser. The effects of process parameters such as laser power, type of mask, gas pressure, cutting speed and pulse width old the cut edge quality were investigated. In order to analyse fille cut surface characteristics(roughness, kerf width, dross) optical microscopy, SEM photography and roughness test were used. As a result, the optimal conditions of process parameters were determined, and the practical feasibility of the proposed system is also examined by using a commercial Gerber file for PCB stencil manufacturing.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.709-713
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• 2004

Characteristics of laser-assisted wet etching of titanium in phosphoric acid were investigated to examine the feasibility of this method for fabrication of high aspect ratio microchannels. Laser power, number of scans, etchant concentration, position of beam waist and scanning speed were taken into consideration as the major process parameters exerting the temperature distribution and the cross sectional profile of etched channels. Experimental results indicated that laser power influences on both etch width and depth while number of scans and scanning speed mainly affect on the etch depth. At a low etchant concentration, the cross sectional profile of an etched channel becomes a U-shape but it gradually turns into a V-shape as the concentration increases. On the other hand, surface of the laser beam focus with respect to the sample surface is found to be a key factor determining the bubble dynamics and thus the process stability. It is demonstrated that metallic microchannels with different cross sectional profiles can be fabricated by properly controlling the process parameters. Microchannels of aspect ratio up to 8 with the width and depth ranges of 8∼32 m and 50∼300 m, respectively, were fabricated.

• Transactions of the Korean Society of Automotive Engineers
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• v.7 no.6
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• pp.8-16
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• 1999

In this study, a new type of laser-induced ignition using a conical cavity has been developed to utilize all the available incident laser energy. In the method, it is possibile to ignite combustible methane/air mixtures by directing a laser beam of a constant small diameter into a small conical cavity, without focusing the laser beam. Shadow graphs for the early stage of combustion process show that a hot gas jet is ejected from the cavity, especially with lean mixture. After a very show time, the hot gas jet finishes issuing and the flame behavior is quite similar to flame propagation initiated by a conventional spark ignition. The combustion process using the new method exhibits more rapid pressure increase and a higher maximum pressure rise than that of the center ignition using laser-induced spark, with significant decrease in the combustion time. Also, the new ignition method is numerically modeled to simulate the flame kernel development and subsequent combustion process using the KIVA-IIcode. The calculated results show satisfactory agreement with experimental results.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.10
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• pp.23-28
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• 2010

Resistance trimming and cutting processes of printed circuit board by making use of high power UV laser with nano-second pulse width have been proposed and investigated experimentally. Also laser-based application system with high flexibility and complex has been designed and adopted power controller, auto beam size control, auto-focusing and control program developed for ourselves. The function of each module shows that they can be reliable for industrial equipments. Resistance trimming method used a plunge and double cut process with $20{\mu}m$ spot size beam. Results show that double cut process is more effective to control resistance trimming in precision than plunge cut process.