• Laser Solutions
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• v.5 no.2
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• pp.31-38
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• 2002

This paper describes the process of nanoparticle synthesis by laser ablation of consolidated microparticles. We have generated nanoparticles by high-power pulsed laser ablation of Al, Cu and Ag microparticles using a Q-switched Nd:YAG laser (wavelength 355 nm, FWHM 5 ㎱, fluence 0.8∼2.0 J/㎠). Microparticles of mean diameter 18∼80 ㎛ are ablated in the ambient air The generated nanoparticles are collected on a glass substrate and the size distribution and morphology are examined using a scanning electron microscope and a transmission electron microscope. The effect of laser fluence and collector position on the distribution of particle size is investigated. The dynamics of ablation plume and shock wave is analyzed by monitoring the photoacoustic probe-beam deflection signal. Nanosecond time-resolved images of the ablation process are also obtained by laser flash shadowgraphy. Based on the experimental results, discussions are made on the dynamics of ablation plume.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.04a
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• pp.230-235
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• 1997

During laser welding, a laser induced matal vapour and plasuma is formed. The plasma shows strong fluctuation combined with acoustic sound emission. On-line monitoring of the process is possible by measuring and analysing the plasma and acoustic sound emission. This paper introduce the method of on line process monitoring in the laser beam welding and analysis being monitoring signal. The results show the complementary information on the process.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.11a
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• pp.709-710
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• 2008

• Laser Solutions
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• v.9 no.3
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• pp.7-13
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• 2006

Auto focusing system to find optimized focal position of laser beam used for material process has been investigated by using fiber confocal method. Wavelength of laser diode (LD) and diameter of single-mode fiber are 780nm and $5.3{\mu}m$, respectively. Intensity distributions of beam reflected from the surface of mirror and silicon bare wafer have been observed in a gaussian form. Experimental results show that focal position obtained by LD is shifted from one observed from surface scribed by laser about $80{\mu}m$. It is due to the difference of wavelength and each divergence of between LD and laser used for material process. It is confirmed that auto focusing control system through position calibration has operated steadily.

• Korean Journal of Metals and Materials
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• v.50 no.3
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• pp.191-200
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• 2012

The purpose of this paper is to review the state of laser processing technology using metal powders. In recent years, a series of research and development efforts have been undertaken worldwide to develop laser processing technologies to fabricate metal-based parts. Layered manufacturing by the laser melting process is gaining ground for use in manufacturing rapid prototypes (RP), tools (RT) and functional end products. Selective laser sintering / melting (SLS/SLM) is one of the most rapidly growing rapid prototyping techniques. This is mainly due to the processes's suitability for almost any materials, including polymers, metals, ceramics and many types of composites. The interaction between the laser beam and the powder material used in the laser melting process is one of the dominant phenomena defining feasibility and quality. In the case of SLS, the powder is not fully melted during laser scanning, therefore the SLS-processed parts are not fully dense and have relatively low strength. To overcome this disadvantage, SLM and laser cladding (LC) processes have been used to enable full melting of the powder. Further studies on the laser processing technology will be continued due to the many potential applications that the technology offers.

• ETRI Journal
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• v.27 no.2
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• pp.188-194
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• 2005

We report on the improvement of critical dimension (CD) linearity on a photomask by applying the concept of process proximity correction to a laser lithographic process used for the fabrication of photomasks. Rule-based laser process proximity correction (LPC) was performed using an automated optical proximity correction tool and we obtained dramatic improvement of CD linearity on a photomask. A study on model-based LPC was executed using a two-Gaussian kernel function and we extracted model parameters for the laser lithographic process by fitting the model-predicted CD linearity data with measured ones. Model-predicted bias values of isolated space (I/S), arrayed contact (A/C) and isolated contact (I/C) were in good agreement with those obtained by the nonlinear curve-fitting method used for the rule-based LPC.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2016.11a
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• pp.134-134
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• 2016

The effect of different thermal treatments on the sub-50 nm copper nanoparticles is examined in the aspects of chemical, electrical and surface morphology. The copper nanoparticles are chemically synthesized and fabricated for paste-type solution. Simple bar coating method is practiced as a deposition process to form copper thin film on a typical slide glass. Deposited copper thin films are annealed by two different routes: general tube furnace with 99.99 % Ar atmosphere and selective laser sintering process. The thermal behavior of the different thermal-treated copper thin films is compared by SEM, XRD, FT-IR and XPS analysis. In this study, the laser sintering process ensures low annealing temperature, fast working speed and ambient-accessible route. Moreover, the laser-sintered copper thin film shows good electrical property and enhanced chemical stability than conventional thermal annealing process. Consequently, the proposed laser sintering process can be compatible with plastic substrate for flexible applications.

• Journal of Welding and Joining
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• v.32 no.6
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• pp.64-69
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• 2014

The applications by using fiber laser have increased recently. However, due to high beam quality of fiber laser, it is inappropriate to apply the existing laser welding monitoring technology to the fiber laser welding as it is. On this study, thus, we analyzed emission signal with RMS and FFT for the in-process monitoring during fiber laser welding. 12mm-thick 304L stainless steel sheet was used in fiber laser welding and the result showed as follows: The intensity changes in RMS did not clarify the distinction between full penetration and partial penetration. However, as welding speed increases, specific frequency also increases in regards of frequency analysis by using FFT.

• Transactions of Materials Processing
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• v.20 no.2
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• pp.118-123
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• 2011

Manufacturing of the bipolar plate of a direct methanol fuel cell (DMFC) by direct laser melting technology (DLM) was attempted. The DLM technology is highly influenced by process parameters such as laser power, scan rate and layering height. Therefore, an analysis of the DLM technology was performed under various conditions. The bipolar plates were fabricated using the DLM process with 316L stainless steel (STS 316L) plates and powder. Powder melting trials at various energy density were performed in order to select a feasible melting range for a given laser power. The melting line height increases and eventually saturates when the energy density increases, but decreases when the laser power increases at a given energy density. For the estimation of the potential performance of the bipolar plate, the surface roughness and contact resistance of the DLM layer were also analyzed. The changes of line height and thickness are useful information to report when manufacturing bipolar plate of fuel cell through the DLM process.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.4
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• pp.63-68
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• 2014

For a nanoscale Cu/low-k wafer, inter-layer dielectric (ILD) and metal layers peelings, cracks, chipping, and delamination are the most common dicing defects by traditional diamond blade saw process. Sidewall void in sawing street is one of the key factors to bring about cracks and chipping. The aim of this research is to evaluate laser grooving & mechanical sawing parameters to eliminate sidewall void and avoid top-side chipping as well as peeling. An ultra-fast pico-second (ps) laser is applied to groove/singulate the 28-nanometer node wafer with Cu/low-k dielectric. A series of comprehensive parametric study on the recipes of input laser power, repetition rate, grooving speed, defocus amount and street index has been conducted to improve the quality of dicing process. The effects of the laser kerf geometry, grooving edge quality and defects are evaluated by using scanning electron microscopy (SEM) and focused ion beam (FIB). Experimental results have shown that the laser grooving technique is capable to improve the quality and yield issues on Cu/low-k wafer dicing process.