• Laser Solutions
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• v.10 no.3
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• pp.15-24
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• 2007

In this paper laser micromachining system design process for commercialization is suggested. The constructed system design process is properly adjusted for laser micromachining area after tailoring engine process of system engineering process such as requirement analysis, functional analysis and allocation, system synthesis and system optimization process. In the current laser machining system design, system components and specifications are determined on the basis of experimental experience which a laser is being used in machining some materials as well as the current machining and research trend. In this paper, however, systematic process is suggested in addition to experimental experience, which the laser and system components and their specifications are decided in the process of definition of functional requirements and engine design variables of system to satisfy the customer's requirements.

• Journal of Welding and Joining
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• v.14 no.5
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• pp.59-68
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• 1996

This study was aimed to characterize the laser cutting process for the cold rolled stainless steel sheet. The principal process parameters of the cutting process were applied to both the continuous wave form and the pulsed wave form for the laser output mode. The laser-oxygen cutting process and the laser-nitrogen cutting process were also considered to characterize the quality and efficiency of the cutting process. The laser-oxygen cutting process revealed the better productivity than the laser-nitrogen cutting process, since the laser energy and the exothermic oxidation energy exerted on the laser-oxygen cutting process simultaneously during the entire cutting process. However, the straightness of the cutting section, which was considered as the most important factors, was inferior to that of the laser-nitrogen cutting process due to the formation of chromum oxide on the cutting surface. Frequency and duration of the pulsed wave form act as the main factors for the better quality, When the frequency increased from 100 Hz to 200 Hz and the duty increased from 20% to 40%, the quality factors such as the height of dross and the surface roughness were improved remarkably. The increase in the frequency from 200 Hz to 300 Hz, on the other hand, revealed the less effective in the cutting quality.

• Proceedings of the Korean Society of Laser Processing Conference
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• 2006.11a
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• pp.103-107
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• 2006

Decapsulation of EMC(Epoxy Molding Compound) in package device is a method used to inspect inside of device by removing plastic molding. So far, chemical etching and mechanical grinding methods have been used widely. Recently, several works using laser have been carried out. This method has advantages with fast process time and precision than conventional methods because of noncontact process. Also, laser process is a clean process because of removing EMC directly without using toxic chemicals. The wavelength of laser used in this study is 355nm. Key parameters of removing EMC are laser power, scan speed, and number of scans of laser. It if confirmed that laser decapsulation is a useful process to inspect inside a device with a small thermal damage to chip surface.

• Transactions of Materials Processing
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• v.15 no.4 s.85
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• pp.319-325
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• 2006

The laser forming process is a new flexible forming process without forming tools and external force, which is applied to various fields of industry. Especially, applications of the laser forming process focused on cutting, welding and marking process. In this paper, the laser bending process of sheet metal which is heated by laser beam and formed by internal stress is simulated by using thermo elastic-plastic analysis model. Based on the result of FE-analysis, the laser bending machine is made to obtain reliable data for sheet bending. Under the same condition as FE-analysis, the laser bending experiment has been performed to ver 펴 the result of FE-analysis and good agreement has been obtained between FE-analysis and experiments. Additional laser bending experiments have been performed to evaluate the laser bending machine.

• Laser Solutions
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• v.6 no.2
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• pp.27-33
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• 2003

A laser shock cleaning technology is a new dry cleaning methodology for the effective removal of small particles from the surface. This technique uses a plasma shock wave produced by a breakdown of air due to an intense laser pulse. In order to optimize the laser shock cleaning process, it needs to evaluate the cleaning performance quantitatively by using a monitoring technique. In this paper, an acoustic monitoring technique was attempted to investigate the laser shock cleaning process with an aim to optimize the cleaning process. A wide-band microphone with high sensitivity was utilized to detect acoustic signals during the cleaning process. It was found that the intensity of the shock wave was strongly dependent on the power density of laser beam and the gas species at the laser beam focus. As a power density was larger, the shock wave became stronger. It was also seen that the shock wave became stronger in the case of Ar gas compared with air and N$_2$ gas.

• Laser Solutions
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• v.11 no.2
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• pp.33-38
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• 2008

Laser micromachining has increasingly been adopted in various advanced industries where the high-precision machining of large-area, high-density and multi-layered components is in a strong demand. To effectively meet the requirements, the laser micromachining process must be carefully monitored. In order to facilitate the development of a new laser micromachining process and/or a new system, we have fabricated a UV laser micromachining platform that is equipped with optical modules for monitoring the process online. They include a laser power stabilizing module, a module for laser-induced breakdown spectroscopy, and an auto-focusing module.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.3
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• pp.9-17
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• 2010

The FPCB is used for electronic products such as LCD display. The process of manufacturing FPCB includes a cutting process, in which each single FPCB is cut and separated from the panel where a series of FPCBs are arrayed. The most-widely used cutting method is the mechanical punching, which has the problem of creating burrs and cracks. In this paper, the cutting characteristics of the FPCB have been experimented using Nd:YAG DPSS UV laser as a way of solving this problem. To maximize the industrial application of this laser cutting process, test samples of the multilayered FPCB have been chosen as it is actually needed in industry. The cutting area of the FPCB has four different types of layer structure. First, to cut the test sample, the threshold laser cut-off fluence has been found. Various combinations of laser and process parameters have been made to supply the acquired laser cut-off fluence. The cutting characteristics in terms of the variation of the parameters are analyzed. The laser and process parameters are optimized, in order to maximize the cutting speed and to reach the best quality of the cutting area. The laser system for the process automation has been also developed.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.11 no.3
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• pp.72-79
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• 2002

Though the laser cutting process is increasingly used in industry, a process automation and systematic database is still yet to be developed. In this study, as the fundamental step toward the construction of a reliable process expert system, a laser cutting quality monitoring/analysis system is developed based on simulations and experimental results. The relations between laser process parameters and laser cutting surface quality parameters such as kerf geometry, striation, surface roughness and dross formation are characterized and analyzed. A graphical user interface is used to visualize the results.

• Journal of Welding and Joining
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• v.31 no.2
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• pp.4-15
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• 2013

The laser/arc hybrid welding process is a new process combining the laser beam and the arc as welding heat source. The laser beam and arc influence and assist one another. By application of hybrid welding, synergistic effects are achievable, and disadvantage of the respective processes can be compensated. The laser-arc hybrid welding process has good potential to extend the field of applications of laser technology, and provide significant improvements in weld quality and process efficiency in manufacturing applications. This review analyses the recent advances in the fundamental understanding of hybrid welding processes using the works of the data base of Web of Science (SCI-Expanded) since the 2000 year. The research activity on the hybrid welding has been become more actively since 2006, especially in China, presenting the most research papers in the world. Since the hybrid welding process was adopted in manufacturing of the automobile in Europe in the early of 2000's, its adopting is widely expanded in the field of manufacturing of automobile, ship building, steel construction and the other various industry. The hybrid welding process is expected to advance toward higher productivity, higher precision, higher reliability through the mixing of high power and flexible fiber laser or disk laser and digitalized pulsed arc source.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.844-847
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• 2001

The application of laser direct etching has been discussed, and believed that the process is a very powerful method for micro machining. This study is focused on the micro patterning technology using laser direct etching process with no chemical damage of the material surface. A new introduced concept of energy synergy effect for surface micro machining is the combination of chemically ion reaction and laser thermal process. The etchant can't etch the material in room temperature, and used Ar laser has not power enough to machine. But, the machining is occurred in local area of the material by the combined energy. Using this process, the material is especially prevented from chemical damage for electric property. We have tested this new concept, and achieved a line with $1{mu}m$ width. The Ar laser with 488nm wavelength was used. The material was Si(100) wafer, and etchant is KOH solution. The application and flexibility of this process is in great hopes for MEMS structures and fabrication of the micro electric device parts.