• 한국레이저가공학회지
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• 제10권3호
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• pp.15-24
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• 2007

In this paper laser micromachining system design process for commercialization is suggested. The constructed system design process is properly adjusted for laser micromachining area after tailoring engine process of system engineering process such as requirement analysis, functional analysis and allocation, system synthesis and system optimization process. In the current laser machining system design, system components and specifications are determined on the basis of experimental experience which a laser is being used in machining some materials as well as the current machining and research trend. In this paper, however, systematic process is suggested in addition to experimental experience, which the laser and system components and their specifications are decided in the process of definition of functional requirements and engine design variables of system to satisfy the customer's requirements.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2004년도 추계학술대회 논문집
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• pp.560-563
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• 2004

Invar is a compound metal of Fe-Ni system and contain 36％ Ni. The most distinction characteristic of Invar is the coefficient of thermal expansion is 1.0 10$^{-6}$ /$^{\circ}C$. That is a tenth of general steel material. This low thermal expansion characteristic of Invar is applied to the missile, aircraft, monitor CRT and frontier display's shadow mask such as FED and OLED. The usage of the Invar shadow mask for display is increasing due to the requirement of larger size and flatness monitor. The Invar shadow mask is machined by two ways electro-forming and laser now. However the electro-forming takes a too long time and the laser machining is accompanied with Burr. In this study, PEMM(pulse electrochemical micro machining) is conducted to machine the micro hole to the Invar and 80${\mu}{\textrm}{m}$ hole was machined.

• 한국생산제조학회지
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• 제21권4호
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• pp.658-665
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• 2012

Micro-EDM is widely used in metallic pattern, electronics, nuclear power and industry in the form of precision process. The improvement of Electro Discharge Machining has been on a steady progress since $19^{th}$ century. The technology has overcome the limits of the traditional precision process, enabling micro-EDM, micro electrolytic machining, micro drilling, micro punching and laser beam machining, which create versatile products with smaller sizes. What have been known about the major feature of Micro-EDM is high thermal energy so that their products are free from the hardness of their products as long as they are electrical conductor. However, each metal is suspected to have different features and natures even if they are created through the same procedure. In this thesis, the methodology of Micro-EDM and how to categorize them are explained. Also, the nature of the examined materials with surface shape and surface roughnes are analyzed. The results of the experiments are expected to understand surface roughness and workability of other materials for Micro-EDM.

• 한국기계가공학회지
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• 제11권1호
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• pp.62-67
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• 2012

Recently UV laser is widely used to process micro parts using various materials such as polymers, metals and ceramics because it has a very high intensity at the focused spot area. It is generally known that there are still some difficulties for alumina($Al_2O_3$) ceramics to directly make micro patterns like holes and lines on the surface of working material using 355nm UV laser because the alumina has a very low absorption coefficient at that wavelength. But nowadays new alumna with nano-porous holes is developed and applied to advanced micro functional parts of IT, BT and BT industries. In this paper, we are going to show the mechanism of photo-thermal ablation for nano-porous ceramics. Inside hole there is a lot of multiple reflections along the depth of hole. Experimentally we can find the micro hole drilling and micro grooving on the surface of nano-porous alumina.

• 소성∙가공
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• 제13권3호
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• pp.253-261
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• 2004

The machining technology for the brittle materials such as ceramics are applied to the fields of MEMS(micro electromechanical system) by the progress of new machining technologies such as Etching, Diamond machining, Micro drilling, EDM(Electro discharge machining), ECDM(Electro discharge machining), USM(Ultrasonic machining), LBM(Laser beam machining), EBM(Electron beam machining). Especially, the USM technology can be applied to the dieletric brittle materials such as silicon, borosilicate glass, silicon nitride, quartz and ceramics with high aspect ratio. The micro machining system with machining force controlled position servo is developed in this paper and the optimized ultrasonic machining algorithm is constructed by the force controlled position servo control. The load cell is adapted in the force measuring and the servo control algorithm, suit for the ultrasonic machining characteristics, is estabilished with using the PID auto-tunning functions at the PMAC system which is generally adapted in the field of robot industries. The precision force signal amplifier is constructed with high precision operational amplifier AD524. The vacuum adsorption chuck which is made of titanum and internal flow line is engraved, is used in the workpiece fixing. The mahining results by USM shows that there are some deviation between the force command and the actual machining force that the servo control algorithm should be applied in the machining procedures. Therefore, the constant force controlled position servo system is developed for the micro USM system and by the examination machining process in USM, the stable USM system is realized by tracking the average value of machining force.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1997년도 춘계학술대회 논문집
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• pp.1053-1057
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• 1997

Laser thin film process with a Q-switch pulsed YAG laser was performed for micro machining. In this research, we performed basic Cr thin film on glass substrates removal machining experiments. Form experiments, it happens not only evaporration of thin film but also spatter and cohesion of melting substance in working region, when machining a Cr thin film by Q-switch YAG laser beam irradiation. Critical energy of surface irradiation type by irradiation direction of laser in a face composing thin film on the glass is higher than that of back irradiation type, but the latter is favorable because of spatter appearance. In case of image formation position when laser beam is irradiated, the defocus is permitted to a certain extent within forcus depth. Ifexceeds focus depth, formation of pattern is vanishing step by step.

• 한국추진공학회:학술대회논문집
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• 한국추진공학회 2007년도 제29회 추계학술대회논문집
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• pp.285-288
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• 2007

레이저가공에서 나타나는 가공부위의 용융된 물질을 밀어내는 가스의 역할을 모사하기 위하여, 구멍이 있는 평판 상부에 충돌하는 마이크로 초음속 제트유동의 경계층 효과가 수치해석적으로 연구되었다. 충돌유동과 충격파의 구조 및 구멍통과 질량유량이 관찰되어 경계층 영향이 고려되지 않은 과거 연구와 비교되었다. 노즐내부 유동의 경계층 효과로 인하여 가공부위 상부에서 보다 강한 마하디스크가 생성되고, 아울러 구멍통과 질량유량도 줄어드는 것이 관찰되었다.

• Journal of Welding and Joining
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• 제28권5호
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• pp.80-85
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• 2010

This study focused on laser assisted machining (LAM) of silicon nitride ceramic that efficiently removes the material through machining of the softened zone by local heating. The effects of laser-assisted machining parameters were studied for cost reduction, and active application in processing of silicon nitride ceramics in this study. Laser assisted machining of silicon nitride allows effective cutting using CBN tool by local heating of the cutting part to the softening temperature of YSiAlON using by the laser beam. When silicon nitride is sufficiently preheated, the surface is oxidized and decomposed and then forms bloating, micro crack and silicate layer, thereby making the cutting process more advantageous. HIPSN and SSN specimens were used to study the machining characteristics. Higher laser power makes severer oxidation and decomposition of both materials. Therefore, HIPSN and SSN specimens were machined more effectively at higher power.

• 한국정밀공학회지
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• 제25권1호
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• pp.138-144
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• 2008

Micro-machining of a brittle material such as glass, silicon, etc., is important in micro fabrication. Particularly, micro-abrasive jet machining (${\mu}-AJM$) has become a useful technique for micro-machining of such materials. The ${\mu}-AJM$ process is mainly based on the erosion of a mask which protects brittle substrate against high velocity of micro-particle. Therefore, fabrication of an adequate mask is very important. Generally, for the fabrication of a mask in the ${\mu}-AJM$ process, a photomask based on the semi-conductor fabrication process was used. In this research a rapid mask fabrication technology has been developed for the ${\mu}-AJM$. By scanning the focused UV laser beam, a micro-mask pattern was fabricated directly without photolithography process and photomask. Two kinds of mask patterns were fabricated using SU-8 and photopolymer (Watershed 11110). Using fabricated mask patterns, abrasive-jet machining of Si wafer were conducted successfully.

• 한국기계가공학회지
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• 제11권5호
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• pp.99-103
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• 2012

Presently, A glass is widely used in telecommunication system, optoelectronic devices and micro electro mechanical systems. Micro drilling of glass using the laser can save processing cost and improve the accuracy. This paper experiments micro drilling using KrF excimer laser on the pyrex glass of $500{\mu}m$ thickness. We have experiment to find out optimum laser machining conditions of micro drilling of glass and ablation depth and influence by processing parameter suc'h pulse repetition rate, energy density and number of pulses. Pulse repetition rate don't influence ablation depth at the micro drilling of pyrex glass. Energy density influence micro drilling of parallelism and maximum thickness that can be drilled. Ablation depth is most influenced by number of pulses.