• Title/Summary/Keyword: Laser micro-machining

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Micro-groove machining of SUS304 using by femto second laser (펨토초 레이저를 이용한 SUS304 의 마이크로 홈가공)

  • Kwak T.S.;Ohmori H.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2005.06a
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    • pp.1179-1180
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    • 2005
  • 3D micro scaled shapes are fabricated with the method of direct writing and superposing grooving in ambient air using femto-second laser pulses and copper, aiming at establishing an industrially useful femto-second laser processing machine to be able to fabricate three dimensional micro-scale structures, especially micro scaled molds, and processing techniques. For the several advantages, there is no thermally influenced region around the area irradiated by the laser beam and surfaces irradiated laser beam are smooth and substances ablated to form are no attached on the surface of works and so on, the femto-second laser technology is anticipated for advanced micro/nano precision technology.

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Practical application of picosecond laser micro-machining to the direct fabrication of a diffraction grating mold (피코초 레이저를 이용한 회절 격자 금형 개발)

  • No, Ji-Hwan;Lee, Je-Hun;Son, Hyeon-Gi;Seo, Jeong;Sin, Dong-Sik
    • Proceedings of the Korean Society of Laser Processing Conference
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    • 2006.06a
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    • pp.97-100
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    • 2006
  • Picosecond (ps) laser micro-machining has emerged as an attractive method of fabricating high-precision microstructures, especially in metals. In this paper, a metallic mold for diffraction gratings is fabricated with a mode-locked 12 ps $Nd:YVO_4$ laser. Laser pulses with a wavelength of 355nm are irradiated on the surface of NOK 80, a mold material, to generate line patterns. In order to minimize the line width, laser power is set just above the ablation threshold of NOK 80. Results show that the spectrum from the fabricated mold is good enough for some industrial application.

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Computational Analysis of 355 nm UV Laser Single-Pulsed Machining of Copper Material Considering the Strain Rate Effect (변형률 속도 효과를 고려한 355 nm UV 레이저 구리재질의 싱글 펄스 전산해석)

  • Lee, Jung-Han;Oh, Jae Yong;Park, Sang Hu;Shin, Bo Sung
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.9 no.3
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    • pp.56-61
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    • 2010
  • Recently, UV pulse laser is widely used in micro machining of the research, development and industry field of IT, NT and BT products because the laser short wavelength provides not only micro drilling, micro cutting and micro grooving which has a very fine line width, but also high absorption coefficient which allows a lot of type of materials to be machined more easily. To analyze the dynamic deformation during a very short processing time, which is nearly about several tens nanoseconds, the commercial Finite Element Analysis (FEA) code, LS-DYNA 3D, was employed for the computitional simulation of the UV laser micro machining behavior for thin copper material in this paper. A finite element model considering high strain rate effect is especially suggested to investigate the micro phenomena which are only dominated by mechanically pressure impact in disregard of thermally heat transfer. From these computational results, some of dynamic deformation behaviors such as dent deformation shapes, strains and stresses distributions were observed and compared with previous experimental works. These will help us to understand micro interaction between UV laser beam and material.

Micro-pattern Fabrication of Amorphous Alloy by Laser Beam Machining (비정질 합금의 마이크로 패턴 레이저 가공)

  • Kim, Haan;Park, Jong Wuk
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.21 no.4
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    • pp.77-83
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    • 2022
  • Amorphous alloys exhibit excellent mechanical properties; therefore, application technology development is being attempted in various fields. However, industrial use of application technology is limited owing to the limitations in fabrication. In this study, micropattern fabrication of an amorphous alloy was conducted using laser beam machining. Although microhole fabrication is possible without the deformation of the amorphous phase through nanosecond pulsed laser beam machining, there are limitations in the generation of recast layers and spatters. In cover plate laser beam machining (c-LBM), a cover plate is used to reduce the thermal deformation and processing area. Therefore, it is possible to fabricate holes at the level of several micrometers. In this study, it was confirmed that recast layers are hardly generated in c-LBM. Furthermore, square-shaped micropatterns were successfully fabricated using c-LBM.

Thin Film Micromachining Using Femtosecond Laser Photo Patterning of Organic Self-assembled Monolayers

  • Chang Won-Seok;Choi Moo-Jin;Kim Jae-Gu;Cho Sung-Hak;Whang Kyung-Hyun
    • International Journal of Precision Engineering and Manufacturing
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    • v.7 no.1
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    • pp.13-17
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    • 2006
  • Self-Assembled Monolayers (SAMs) formed by alkanethiol adsorption to thin metal film are widely being investigated for applications as coating layer for anti-stiction or friction reduction and in fabrication of micro structure of molecules and bio molecules. Recently, there have been many researches on micro patterning using the advantages of very thin thickness and etching resistance of Self-Assembled Monolayers in selective etching of thin metal film. In this report, we present the several machining method to form the nanoscale structure by Mask-Less laser patterning using alknanethiolate Self-Assembled Monolayers such as thin metal film etching and heterogeneous SAM structure formation.

Laser Process of Polymer Micro Fluidic Devices (레이저 가공 폴리머 마이크로 유체 장치)

  • Kim, Joo-Han
    • Journal of the Korean Society for Precision Engineering
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    • v.23 no.2 s.179
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    • pp.129-137
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    • 2006
  • Polymer micro-fluidic devices were fabricated with laser processes. A UV laser and a femto laser were used to machine polymer micro-fluidic structures directly. This laser direct machining process suits the need of rapid prototyping, as in many applications changes from the original design are often required. As examples, two polymer micro-systems were developed: a micro-check valve and a micro diffuser pump. The micro fluidic devices can be applied for many applications such as clinical diagnostics and drug delivery. Advantages and disadvantages using polymers as a material for micro-fluidic applications are discussed.

A Study on the Mechanical Micro Machining System set-up and Applications (기계적 미세 가공 시스템 구성 및 응용 연구)

  • 제태진;이응숙;최두선;이선우
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2001.04a
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    • pp.934-937
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    • 2001
  • It is well-known that the micro fabrication technology of micro parts are the high energy beam or silicon-based micro machining method such as LIGA Process, Laser machining, photolithography and etching technology. But, for fabricating complex 3-D structure it is better to use mechanical machining. This machining method by the mechanical machine tool with nanometer accuracy is getting attention in some field-especially micro optics machining such as grating, holographic lens, micro lens array, fresnel lens, encoder disk etc.. In this study, we survey the micro fabrication by mechanical cutting method and set up the mechanical micro machining system. And we carried out micro cutting experiments for micro parts with v-shape groove.

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Micromachining Modelling and Simulation for Microlens Using Excimer Laser (액시머 레이저를 이용한 마이크로 렌즈 가공 모델링 및 시뮬레이션)

  • 최경현;배창현
    • Transactions of the Korean Society of Machine Tool Engineers
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    • v.13 no.1
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    • pp.55-62
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    • 2004
  • This paper addresses the method for figuring out the hole diameter on the mask containing the information about machining depth. With this mask e micro machining is carried out with a simple 2D movement of the mask. Based on e suggested method excimer laser ablation processes are modeled and determination of the optimal laser ablation conditions such as hole diameter, step size, mask movement velocity, etc. is completed. The excimer laser ablation simulation for creating 3D micro lens is carried out by employing determined ablation conditions to prove verification of the method. The results from simulation illustrated the average error of 140nm and e relative error of 2%.