• Journal of Institute of Convergence Technology
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• v.4 no.2
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• pp.41-45
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• 2014

Micro fabrication technologies of aluminium have been required to satisfy many demands in technology fields. Pulsed laser beam machining can be an alternative method to accomplish the micro machining of aluminium. Pulsed laser beam can be applied to micro machining such as micro drilling and milling. Using pulsed laser beam, the machining characteristics of aluminium in micro drilling and milling were investigated according to average power, repetition rate, moving speed of spot. The laser beam machining with the optimal conditions can achieve precise micro figures. As a result, micro pattern, text and structures on aluminium surface was successfully fabricated by pulsed laser beam machining.

• Journal of Institute of Convergence Technology
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• v.5 no.2
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• pp.21-25
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• 2015

This paper proposes a fabrication process of deposited layer with micro patterns that uses a combination of a pulsed laser beam machining and an electrodeposition. This process consists of the electrodeposition and the laser beam machining. The deposited layer on metal can be selectively eliminated by laser ablation. As a result, the deposited layer with micro patterns can be fabricated without a mask. The characteristics of the deposited layer on stainless steel were investigated according to the average power and marking speed in the pulsed laser beam machining. The optimal laser beam conditions for precise micro patterning of the deposited layer were determined. Finally, the deposited copper layer with micro text was successfully fabricated by the pulsed laser beam machining.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.2
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• pp.7-12
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• 2010

Due to the extremely short interaction time (< $10\times10^{-12}$sec) between laser pulse and material, which enables the minimization of heat affection, ultrafast laser micro-machining has rapidly widened its applications. In this paper, the characteristics of ultrafast laser micro-machining have been reviewed and experimentally demonstrated in laser drilling of silicon wafer and in laser cutting of rigid PCB.

• Journal of the Semiconductor & Display Technology
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• v.20 no.3
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• pp.77-82
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• 2021

This numerical study focuses on the analysis of fume particle dispersion characteristics over the surface of target workpiece in laser micro-hole machining process. The effects of oblique stagnation flow over fume generating machining point are examined by carrying out a series of three-dimensional random particle simulations along with probabilistic particle generation model and particle drag correlation of low Reynolds number. Present computational model of fume particle dispersion is found to be capable of assessing and quantifying the fume particle contamination in precision hole machining which may influenced by different types of air flow patterns and their flow intensity. The particle size dependence on dispersion distance of fume particles from laser machining point is significant and the effects of increasing flow oblique angle are shown quite differently when slot blowing or slot suction flows are applied in micro-hole machining.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.844-847
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• 2001

The application of laser direct etching has been discussed, and believed that the process is a very powerful method for micro machining. This study is focused on the micro patterning technology using laser direct etching process with no chemical damage of the material surface. A new introduced concept of energy synergy effect for surface micro machining is the combination of chemically ion reaction and laser thermal process. The etchant can't etch the material in room temperature, and used Ar laser has not power enough to machine. But, the machining is occurred in local area of the material by the combined energy. Using this process, the material is especially prevented from chemical damage for electric property. We have tested this new concept, and achieved a line with $1{mu}m$ width. The Ar laser with 488nm wavelength was used. The material was Si(100) wafer, and etchant is KOH solution. The application and flexibility of this process is in great hopes for MEMS structures and fabrication of the micro electric device parts.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.873-877
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• 2005

The burr of micro drilling and micro cutting on thin metal film is a major obstacle to mass production for micro PCB boards in micro technologies of personal computing and telecom explosion. As the burr affects on the assembling process, it is necessary to study continuously on control or elimination of the burr. In order to get higher valued products, it is also needed to competitive techniques with the high resolution. In this paper, we studied experimentally the burr generation that when it is processed on the copper foil by laser in micro-hole machining. Unlike mechanical machining the burr produced on substrate is a resultants of melt and re-solidification of a melten metal which was heated and treated by laser. And higher laser energy increases the size of burr. Therefor in micro-drilling with laser, it is difficult to reduce the effects of burr for very thin metal sheets. We investigated the stale of the burr and analyzed the laser ablation Cu micro machining with respect to laser intensity and processing time.

• Journal of the Korean Society for Precision Engineering
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• v.26 no.10
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• pp.108-115
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• 2009

Although nanosecond pulsed laser drilling and milling are rapid and non-wear processes in micromachining, the quality cannot meet the precision standard due to the recast layer and heat affected zone. On the other hand, electrical discharge machining (EDM) is a well-known high precision machining process in micro scale; however, the low material removal rate (MRR) and tool wear remain as drawbacks. In this paper, hybrid process of laser beam machining (LBM) using nanosecond pulsed laser and micro EDM was studied for micro drilling and milling. While the quality of the micro structure fabricated by this hybrid process remains as high as direct EDM, the machining time and tool wear can be reduced. In addition, variable depth of layer was introduced as an effective method improving efficiency of hybrid milling.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1995.10a
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• pp.75-78
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• 1995

This paper presents the feasibility of laser ablation process in 3-D micro machining of MEMS (micro Electro Mechanical System)parts. The micro machining characteristics of polymer(Energy fluence, pulse repetition rate, number of pulse, ablation rate)are investigated and 3-D micro machined samples are demonstrated.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1195-1198
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• 2003

Micro former has been known as a useful tool for machining micro parts. It makes micro holes automatically with punches, a hole-shape die and material by rotation of crank shaft synchronously. Micro displacement in micro forming affects on the performance of machining because micro forming size is similar with its mechanical displacement. Therefore, the measurement of this micro displacement is essential to be guaranteed to obtain high forming precision in the whole machine as well as its devices. This paper addresses the development of a laser interferometer to measure micro displacement for a micro former. The laser interferometer is able to measure micro displacement during a few micro seconds with non-contact. For the experiment, a laser probe is installed on the optical table with optical devices and a micro displacement generating device. The velocity decoding board is also added to calculate doppler shift frequency directly. Finally simple experiments are conducted to confirm its functional operation.

• Journal of the Korean Magnetics Society
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• v.13 no.3
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• pp.115-120
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• 2003

We have developed laser micro-machining technology for fabrication of the micro thin-film inductors. After the thin layers of FM/M/FM films were coated to the silicon substrate by using the conventional sputtering method, the new laser machining was applied to the patterning process that used to be carried out by the semiconductor lithography procedure. A CW Nd:YAG laser operating in TEM$\sub$00/ mode was actively Q-switched to obtain the very short pulse of 200 ns. The laser micro-machining process with pulse energy and repetition rate have been optimized as 5 mJ/pulse and 5 kHz, respectively, to obtain the line resolution as fine as 20 $\mu\textrm{m}$.