• Restorative Dentistry and Endodontics
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• 제26권4호
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• pp.307-315
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• 2001

The application of Nd:YAG laser and irrigants to the root surface can change its surface configurations. The purpose of this study was to investigate the effects of Nd:YAG laser and irrigants on the apical seal of obturated canals. In this study, 66 single rooted teeth were randomly assigned to 4 group of 14 teeth each. 8 teeth were served us positive and negative controls. The teeth were divided into 6 groups as follows. Group A: Nd:YAG laser, 5% NaOCl + Rc-prep Group B: Nd:YAG laser, Saline Group C: 5% NaOCl + Rc-prep Group D: Saline Group E: Positive control Group F: Negative control 66 teeth were instrumented using Maillefer ProFile$^{\circledR}$ (Orifice Shapers, .04 taper, .06 taper Dentsply, Switzerland). Two of each group were selected at random, and the canal wall surfaces were examined under a SEM. 12 teeth of each group were obturated using by lateral condensation technique. Specimens were immersed in india ink for 7days, decalcified by 10% nitric acid, dehydrated by 75. 80. 85, 90, 95 and 100% alcohol in order cleared by methyl salicylate and then measured of dye penetration with stereomicroscope($\times$15 magnification) and Image Pro plus. The data were analyzed statistically by one-way ANOVA test and Duncan's Multiple Range test. The results were as follows : 1. The mean leakage was 0.128$\pm$0.376 for group A, 0.237$\pm$0.325 for group B, 0.397$\pm$0.468 for group C, 0.586$\pm$0.402 for group D, and there were statistically significant differences between group A and group D, group B and group D. (p<0.05). 2. Group A had better sealing ability than Group C, but there was statistically no significant differences. (p>0.05). 3. Group B had better sealing ability than Group D and there was statistically significant difference. (p<0.05). 4 Group A had better sealing ability than Group B, but there was statistically no significant difference. (p>0.05). 5. Group C had better sealing ability than Group D, but there was statistically no significant difference. (p>0.05). 6. As a result of observation under SEM, Smear layers were removed in Group A, B. but Smear layers were partially removed and smear plugs were remained in Group C, Smear layers were not removed in Group D. To be specially, Melting of smear layer were showed in Group C. 7. These results suggests that the laser has a potential in reducing the apical microleakage of obturated canals.

• 대한기계학회논문집B
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• 제36권11호
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• pp.1135-1140
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• 2012

마스크를 이용하여 니켈 시드층의 형성 후 실버 도금을 통해 태양전지 상부전극을 형성하는 2 단계 전극형성 공정이 태양전지의 고효율화 방안으로 제안되었다. 본 연구에서는, 자외선 경화형 혹은 상변화 잉크를 고비용의 인쇄공정을 통해 마스크를 형성하는 방법을 대신하여, 코팅과 레이저의 복합공정을 통해 마스크를 형성하는 방법에 대해 제안하도록 한다. 마스크를 형성하는 물질로서 저비용의 저융점 왁스 혹은 플루오르카본 용액을 태양전지 웨이퍼 상에 코팅 후 레이저로 선택적으로 제거하여 전극패턴을 형성하였으며, 플루오르카본 용액 코팅이 왁스 코팅보다 패턴 균일도 측면에서 우수할 뿐만 아니라 통계적으로 0.16% 태양전지 효율증대를 유발한다는 점이 발견되었다.

• Journal of Welding and Joining
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• 제23권3호
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• pp.76-82
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• 2005

Recently the application of laser welding technology has been considered to shipbuilding structure. However, when this technology is applied to primer coated steel, good quality weld beads are not easily obtained. Because the primer-coated layer caused the spatter, humping bead and porosity which are main part of the welding defect attributed to the powerful vaporizing pressure of zinc. So we performed experiment with objectives of understanding spatter and porosity formation mechanism and producing sound weld beads in 6mmt primer coated steels by a $CO_2$ CW laser. The effects of welding parameters; defocused distance, welding speed, coated thickness and coated position; were investigated in the bead shape and penetration depth on bead and lap welding. Alternative idea was suggested to suspend the welding defect by giving a reasonable gap clearance for primer coated thickness. The zinc of primer has a boiling point that is lower than melting point of steel. Zinc vapor builds up at the interface between the two sheets and this tends to deteriorate the quality of the weld by ejecting weld material from lap position or leaving porosity. Significant effects of primer coated position was lap side rather than surface. Therefore introducing a small gap clearance in the lap position, the zinc vapor could escape through it and sound weld beads can be acquired. In conclusion, formation and suspension mechanism of the welding defects was suggested by controling the factors.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제51권6호
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• pp.229-235
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• 2002

This paper presents the fabrication of polycrystalline thin film transistor(TFT) using sequential lateral solidification(SLS) of amorphous silicon. The fabricated SLS TFT showed high Performance suitable for active matrix liquid crystal display(AMLCD). The SLS process involves (1) a complete melting of selected area via irradiation through a patterned mask, and (2) a precisely controlled pulse translation of the sample with respect to the mask over a distance shorter than the super lateral growth(SLG) distance so that lateral growth extended over a number of iterative steps. The SLS experiment was performed with 550$\AA$ a-Si using 308nm XeCl laser having $2\mu\textrm{m}$ width. Irradiated laser energy density is 310mJ/$\textrm{cm}^2$ and pulse duration time was 25ns. The translation distance was 0.6$\mu$m/pulse, 0.8$\mu$m/pulse respectively. As a result, a directly solidified grain was obtained. Thin film transistors (TFTs) were fabricated on the poly-Si film made by SLS process. The characteristics of fabricated SLS p -type poly-Si TFT device with 2$\mu\textrm{m}$ channel width and 2$\mu\textrm{m}$ channel length showed the mobility of 115.5$\textrm{cm}^2$/V.s, the threshold voltage of -1.78V, subthreshold slope of 0.29V/dec, $I_{off}$ current of 7$\times$10$^{-l4}$A at $V_{DS}$ =-0.1V and $I_{on}$ / $I_{off}$ ratio of 2.4$\times$10$^{7}$ at $V_{DS}$ =-0.1V. As a result, SLS TFT showed superior characteristics to conventional poly-Si TFTs with identical geometry.y.y.y.

• Journal of Welding and Joining
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• 제18권2호
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• pp.86-94
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• 2000

This study was performed to investigate types and formation mechanism of cracks in two Al alloy welds, A5083 and A7N01 spot-welded by pulse Nd : YAG laser, using SEM, EPMA and Micro-XRD. In the weld zone, three types of crack were observed : center line crack({TEX}$C_{C}${/TEX}), diagonal crack({TEX}$C_{D}${/TEX}), and U shape crack({TEX}$C_{U}${/TEX}). Also, HAZ crack({TEX}$C_{H}${/TEX}) was observed in the HAZ region, furthermore, mixing crack({TEX}$C_{M}${/TEX}) consisting of diagonal crack and HAZ crack was observed. White film was formed at th hot crack region in the fractured surface after it was immersed to 10% NaOH water. In the case of A5083 alloy, white films in {TEX}$C_{C}${/TEX} crack and {TEX}$C_{D}${/TEX} crack region were composed of low melting phases, {TEX}$Fe_{2}SiAl_{8}${/TEX} and eutectic phases, $Mg_2$Al$_3$ and $Mg_2$Si. Such films observed $CuAl_2$, {TEX}$Mg_{32}(Al,Zn)_{3}${/TEX}, MgZn$_2$, $Al_2$CuMg and $Mg_2$Si were observed in the whitely etched films near {TEX}$C_{C}${/TEX} crack and {TEX}$C_{D}${/TEX} crack regions. The formation of liquid films was due to the segregation of Mg, Si, Fe in the case of A5083 alloy and Zn, Mg, Cu, Sim in the case of A7N01 alloy, respectively. The {TEX}$C_{C}${/TEX} and {TEX}$C_{D}${/TEX} cracks were regarded as a result of the occurrence of tensile strain during the welding process. The formation of {TEX}$C_{M}${/TEX} crack is likely to be due to the presence of liquid film at the grain boundary near the fusion line in the base metal as well as in the weld fusion zone during solidification. The {TEX}$C_{U}${/TEX} crack is considered a result of the collapsed keyhole through incomplete closure during rapid solidification.

• Design & Manufacturing
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• 제13권4호
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• pp.10-16
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• 2019

Semiconductor chip is bonded to the substrate by melting solder bumps. In general, the chip bonding is applied by a Reflow process or a Thermo-Compression(TC) bonding process. In this paper, we introduce a Laser Assisted Thermo-Compression bonding (LATCB) process to improve the anxiety of the existing process(Reflow, TC bonding). In the LATCB process, the chip is bonded to the substrate by irradiating a laser with a uniform energy density in the same area as the chip to melt only the solder bumps and press the chip with a Transparent Compression Module (TCM). The TCM consists of a fused silica header for penetrating the laser and pressurizing the chip, and a piezoelectric actuator (P.A.) coupled to both ends of the header for micro displacement control of the header. In addition, TCM is a structure that can pressurize the chip and deliver it to the chip and solder bumps without losing the energy of the laser. Fused silica, which is brittle, is vulnerable to deformation, so the header may be damaged when an external force is applied for pressurization or a displacement differenced is caused by piezoelectric actuators at both ends. On the other hand, in order to avoid interference between the header and the adjacent chip when pressing the chip using the TCM, the header has a notch at the bottom, and breakage due to stress concentration of the notch is expected. In this study, the thickness and notch length that the header does not break when the external force (500 N) is applied to both ends of the header are optimized using structural analysis and Coulomb-Mohr failure theory. In addition, the maximum displacement difference of the P.A.s at both ends where no break occurred in the header was derived. As a result, the thickness of the header is 11 mm, and the maximum displacement difference between both ends is 8 um.

• 대한치과의사협회지
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• 제50권3호
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• pp.140-147
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• 2012

Recently, the digital solution of fabricating removable prosthesis by applying haptic input device, electronic surveying, and rapid prototyping was introduced. This review article covers the concept of electronic surveying, computer-aided denture framework designing procedure, discussions after several digital denture cases, directions of future development, such as digital tooth arrangement and RP flasking.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2010년도 추계학술대회 초록집
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• pp.44.1-44.1
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• 2010

레이저 가공기술은 공정 적용이 용이하고 응용 분야가 넓어 산업 전반에 걸쳐 널리 사용되고 있다. 특히, 태양전지 제조공정에서는 cutting, grooving, doping, ablation등의 분야에 활발하게 적용되고 있으며 최근에는 다양한 종류의 레이저를 기술을 이용하여 효율 향상과 원가 절감을 위해 많은 기관에서 활발하게 연구를 진행하고 있다. 본 연구에서는 실리콘웨이퍼에 특정 파장의 레이저를 조사하여 실리콘웨이퍼 표면의 용융과 고상화를 통해 구조적, 전기적 특성 변화를 확인하였다. Si wafer의 표면은 레이저 조사 조건에 의해 다결정화 하며 레이저의 power와 frequency, scan speed등을 조절하여 다결정 실리콘 영역의 형성 깊이를 조절 할 수 있다. 다결정화 된 부분의 구조적 특성은 SED과 XRD를 이용하여 측정하였으며, 전기적 특성은 면저항 측정을 통하여 실시하였다. 또한 이러한 특성을 이용하여 태양전지 제조 공정의 적용가능성을 평가하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1989년도 춘계학술대회 논문집
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• pp.111-113
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• 1989

This paper reports the optical characteristics of TeS$_{5}$ Ge$_{5}$ thin film. In phase diagram, TeS$_{5}$ Ge$_{5}$ has the eutetic point with the loweat melting point. Therfore, TeS$_{5}$ Ge$_{5}$ thin film will be melted by Diode Laser with low energy. TeS$_{5}$ Ge$_{5}$ thin films start to change the phase from amorphous to crystalline near 10$0^{\circ}C$, but perfectly change the phase at 28$0^{\circ}C$. As-deposit TeS$_{5}$ Ge$_{5}$ thin film start to change the phase to crystalline in enviroment og 66$^{\circ}C$ 80%RH.circ}C$ 80%RH.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2017년도 춘계학술대회 논문집
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• pp.90-90
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• 2017

Cold spray (Cold gas dynamic spray, kinetic spray) is the latest spray coating process that is known as solid state deposition process. In cold spray, inert gases (typically nitrogen and helium) accelerate powder particles prior to impact onto the substrate. Accelerating particles start to deposit onto the substrate after reaching certain critical velocities depending on the coating materials and substrate. Since process gas temperatures are kept below to melting temperature of the coating materials, it is possible to spray temperature sensitive materials such as copper and titanium, nanocrystal materials, and amorphous metals without affecting the phase change and oxide formation. It is also possible to deposit thick coatings because cold spray coatings present compressive residual stresses. This ability to deposit thick coatings is suitable to repair or rebuild parts as an additive manufacturing process. In this presentation, cold spray is introduced and compared to other additive manufacturing processes such as laser and electron beam based processes. It is also presented some applications especially in the view point of additive manufacturing process.