• 한국레이저가공학회:학술대회논문집
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• 한국레이저가공학회 2006년도 추계학술발표대회 논문집
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• pp.114-117
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• 2006

Diffraction grating is the optical device which has periodic pattern. Decorative logotypes is the one of application of diffraction grating. In this paper diffraction grating for decorative logotype is fabricated by dot pattern in stead of line pattern. A metallic mold for diffraction gratings is fabricated with a mode-locked 12 ps $Nd:YVO_4$ laser. Laser pulses with a wavelength of 355nm are irradiated on the surface of NOK 80, a mold material, to generate dot patterns. In order to minimize the dot diameter, laser power is set just above the ablation threshold of NOK 80. Results show that the spectrum from the fabricated mold is good enough for some industrial application.

• Journal of Welding and Joining
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• 제18권2호
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• pp.163-163
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• 2000

• Journal of Welding and Joining
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• 제18권2호
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• pp.36-42
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• 2000

• 소성∙가공
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• 제8권5호
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• pp.429-436
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• 1999

In sheet metal forming , forming limit diagram is very important to design and analyze of sheet metal forming process. Recently tailor welded blanks of different thickness and different material and strength combinations are used widely in automobile industry to reduce car manufacturing cost. In order to analyze the forming characteristics of tailored welded blanks, we have investigated the forming limit dia-grams for 3 kinds of different material using mash seam and laser welding experimentally and dis-cussed for the characteristics of forming for tailor welded blanks. It is concluded that forming limit dia-gram for the different material combination TWB locates between FLD of the thinner base material sheet and the thicker ones.

• 한국레이저가공학회지
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• 제6권1호
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• pp.9-16
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• 2003

Micromachining using the DPSS 3rd Harmonic Laser (355nm) has outstanding advantages as a UV source in comparison with Excimer lasers in various aspects such as maintenance cost, maskless machining, high repetition rate and so on. It also has the greater absorptivity of many materials in contrast to other IR sources. In this paper, the process for micro-drilling of blind hole in Cu/PI/Cu substrate with the DPSS UV laser and the scanning device is investigated by the experimental methods. It is known that there is a large gap between the ablation threshold of copper and that of PI. We use the Archimedes spiral path for the blind hole with different energy densities to ablate the different material. Finally, the blind via hole of diameter 100$\mu\textrm{m}$ and 50$\mu\textrm{m}$ was drilled.

• Journal of Welding and Joining
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• 제19권5호
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• pp.481-485
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• 2001

Laser cladding processing allows rapid transfer of heat to the material being processed with minimum conduction into base metal. The effect of $CO_2$ laser cladding with high viscosity mixed powders was investigated. High viscosity mixed powder consists of bronze powder and flux that is used at a high temperature condition. The mixed powder has a high viscosity that it can be easily pasted over a curved or slope substrate. The device for mixed powder was designed and manufactured. It consists of the high viscosity mixed powder feeding system, the preheating system and the shielding gas system which prevents the clad layer from being oxidized. The results of experiment indicated that the feed rate of high viscosity mixed powder was important for later cladding with mixed powder feeding. The high viscosity mixed powder and substrate must be preheated to prevent porosity from breaking at the clad layer. The experimental result shows that the high viscosity mixed can be applied for laser cladding process.

• 한국공작기계학회논문집
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• 제13권5호
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• pp.67-74
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• 2004

Laser heat treatment is an effective technique used to improve the tribological properties and also to increase the service life of automobile components such as camshafts, crankshatfs, lorry brake drums and gears. High power $CO_2$ lasers and Nd:YAG lasers are employed for localized hardening of materials and hence are of potential application in the automobile industries. The heat is conducted rapidly into the bulk of the specimen causing self-quenching action to occur and the formation of matrensitic structure. In this investigation, the microstructrual features occurring in Nd:YAG laser hardening SM45C and $STD_11$ steel are discussed with the use of optical microscopic and scanning electron microscopic analysis. Moreover, This paper describes the optimisation of the processing parameters for maximum hardened depth of SM45C and $STD_11$ steel specimens of 10mm thickness by using CW:YAG laser.

• 한국레이저가공학회지
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• 제2권1호
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• pp.51-60
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• 1999

In this paper, weldability and formability of Tailored-Blank (TB) and the structural impact testing of bump beam were investigated to apply TB to automobile bumper beam. The optimal $CO_2$ laser welding condition for TB of SPFC and SPRC steel plates with different thicknesses was obtained. Before welding, the cross section of butt joint was prepared only by shearing without milling process. Real type bump beam was produced by two kind of forming processes such as roll-forming and press-forming, and the good formability of TB was obtained. Impact test results of bump by using pendulum and barrier were satisfied the impact regulation of bump. Finally. It may be confirmed that laser welded TB is well-balanced material in both weight reduction and production cost of automobile bump.

• 한국레이저가공학회지
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• 제3권2호
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• pp.45-51
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• 2000

In this paper, the possibilities and the limits of the laser seam welding were studied to utilize the advantageous properties of amorphous metal foils. For the conventional welding method, the high heat transfer makes the crystallized zone of the work material unavoidable. The laser is able to weld the amorphous metal without a crystallized zone, because heat transfer is limited within a very small restricted volume. The crystallized zone is restricted in the neighbor of welding spot and not in the melting area. This can be proved directly by the etching and indirectly by the tensile shear test, micro hardness test and bending test. The overlapping of welding bead could form the formation of wider and thicker amorphous zone.

• 마이크로전자및패키징학회지
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• 제21권2호
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• pp.53-57
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• 2014

Thin glass (< 100 microns) is a promising material from which advanced interposers for high density electrical interconnects for 2.5D chip packaging can be produced. But thin glass is extremely brittle, so mechanical micromachining to create through glass vias (TGVs) is particularly challenging. In this article we show how laser processing using deep UV excimer lasers at a wavelength of 193 nm provides a viable solution capable of drilling dense patterns of TGVs with high hole counts. Based on mask illumination, this method supports parallel drilling of up over 1,000 through vias in 30 to $100{\mu}m$ thin glass sheets. (We also briefly discuss that ultrafast lasers are an excellent alternative for laser drilling of TGVs at lower pattern densities.) We present data showing that this process can deliver the requisite hole quality and can readily achieve future-proof TGV diameters as small $10{\mu}m$ together with a corresponding reduction in pitch size.