• 한국정밀공학회지
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• 제27권6호
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• pp.17-23
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• 2010

Recent research topics of ultra-precision micro, nano machining using femtosecond lasers are described in the paper.

• 한국레이저가공학회지
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• 제15권1호
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• pp.15-19
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• 2012

The fabrication of internal diffraction gratings with photoinduced refractive index modification in transparent materials was demonstrated using low-density plasma formation excited by a femtosecond (130 fs) Ti: sapphire laser (${\lambda}_p$=800 nm). The refractive index modifications with diameters ranging from $1{\mu}m$ to $3{\mu}m$ were photoinduced after plasma formation occurred upon irradiation with peak intensities of more than $2.0{\times}10^{13}W/cm^2$. The graded refractive index profile was fabricated to be a symmetric around from the center of the point at which low-density plasma occurred.

• 한국정밀공학회지
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• 제27권11호
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• pp.24-29
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• 2010

The shape of combustion nozzles varies from large diameter to small diameter ones. In the case of small nozzle, nozzle exit can be easily winkled or damaged in machining process. Femtosecond laser is a micro machining technology that is able to drill a small nozzle without damaging the nozzle exit. In this experiment, a small nozzle of combustion was fabricated by using a femtosecond laser. The fabricated nozzle of combustion provided a very small nozzle diameter with clean nozzle exit without wrinkling or collateral damage.

• 한국공작기계학회논문집
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• 제13권1호
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• pp.55-62
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• 2004

This paper addresses the method for figuring out the hole diameter on the mask containing the information about machining depth. With this mask e micro machining is carried out with a simple 2D movement of the mask. Based on e suggested method excimer laser ablation processes are modeled and determination of the optimal laser ablation conditions such as hole diameter, step size, mask movement velocity, etc. is completed. The excimer laser ablation simulation for creating 3D micro lens is carried out by employing determined ablation conditions to prove verification of the method. The results from simulation illustrated the average error of 140nm and e relative error of 2％.

• 한국정밀공학회지
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• 제32권8호
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• pp.687-692
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• 2015

LAM (Laser-Assisted Machining) is an effective method for processing difficult-to-cut workpieces. The focal length of a LAM system is changed by the change of the workpiece shape during laser preheating; this problem is solved by changing the lens of the laser module. Linear- and rotary-type lens changers were developed to change the laser lens of a LAM system. The linear-type lens changer is operated by a motor with a ball-screw, and the rotary type is operated by a stepping motor. The natural frequency and structural stability of the laser lens changers were confirmed by using a finite element analysis; in addition, the functions of the lens changers were verified by measuring the iterative accuracy. The measured results show that the rotary-type lens changer is more accurate than the linear-type changer.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1997년도 추계학술대회 논문집
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• pp.887-890
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• 1997

Recently micromachining using DPSSL(Diode Pumped Solid State Laser) with 3rd harmonic wavelength is actively studied in laser machining area. Micromachining using DPSSL have outstanding advantages as UV source comparing with excimer laser in various aspect such a maintenance cost, maskless machining, high repetition rate and so on. In this study micro-drilling of PCB type substrate which consists of Cu-PI-Cu layer was performed using DPSS Nd:YAG laser(355nm, wavelength) in vector scanning method. Experimental and numerical method(Matlab simulation, FEM) are used to optimize process parameter and control machining depth. The man mechanism of this process is laser ablation. It is known that there is large gap between energy threshold of copper and that of PI. Matlab simulation considering energy threshold of material is performed to effect of duplication of pulse and FEM thermal analysis is used to predict the ablation depth of copper. This study could be widely used in various laser micromachining including via hole microdrilling of PCB, and micromachining of semiconductor components, medical parts and printer nozzle and so on.

• 한국정밀공학회지
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• 제26권4호
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• pp.47-54
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• 2009

In the last few years, lasers have found new applications as tools for ceramic machining which is laser-assisted machining(LAM). LAM process for the machining of difficult-to-machine materials such as structural ceramics, has recently been studied on silicon nitride workpiece for a wide range of operating condition. However, there have been few studies on rake angle in LAM process. In this paper we analyzed difference of machinability between positive and negative rake angle in tools. We have obtained interesting results that we could eliminate chattering, lower specific cutting and cutting ratio in case of positive rake angle. The results suggest that positive rake angled tools can make more plastic deformation and stable cutting of silicon nitride in comparison with negative rake angled one.

• 한국정밀공학회지
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• 제28권12호
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• pp.1347-1352
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• 2011

Recently, as the aged population grows around the world, many medical instruments, devices, and their fabrication processes are developing. Among the devices, a drug delivery stent is a good example for precision machining. Conventional drug delivery stent has problem of the remaining polymer because the drug is coated on the surface with it. If the drug is impregnated into the micro hole array on the stent surface, the polymer can be perfectly eliminated. Micro sized holes are generally fabricated by laser machining however, the fabricated holes do not have an enough aspect ratio to contain the drug or a good surface finish to deliver the stend to blood vessel tissue. To overcome these problems, we propose a vibration-assisted machining mechanism with PZT (Piezoelectric Transducers) for abrication of micro sized holes better. The results indicated that the burr size can be significantly decreased with vibration assisted in nanosecond pulse laser drilling test.

• 한국자기학회지
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• 제13권3호
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• pp.115-120
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• 2003

스퍼터링 방법으로 FM/M/FM의 다층박막을 증착한 다음 초소형 박막 인덕터를 제작하기 위하여 반도체 공정을 대체할 수 있는 레이저 미세가공 기술을 개발하였다. TE $M_{00}$ 모드로 발진하는 CW Nd:YAG 레이저를 active Q-switching 하여 펄스폭이 200 ns인 극 초단 레이저 펄스를 얻었다. 레이저 미세가공 조건을 반복율 5 kHz, 펄스 당 에너지 5 mJ/pulse로 최적화 하여 분해능이 20 $\mu\textrm{m}$인 line patterning을 얻었다.

• 한국레이저가공학회지
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• 제17권1호
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• pp.1-6
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• 2014

Indium tin oxide (ITO) is an important transparent conducting oxide (TCO). ITO films have been widely used as transparent electrodes in optoelectronic devices such as organic light-emitting devices (OLED) because of their high electrical conductivity and high transmission in the visible wavelength. Finding ways to control ITO micromachining depth is important role in the fabrication and assembly of display field. This study presented the depth control of ITO patterns on glass substrate using a femtosecond laser and slit. In the proposed approach, a gaussian beam was transformed into a quasi-flat top beam by slit. In addition, pattern of square type shaped by slit were fabricated on the surfaces of ITO films using femtosecond laser pulse irradiation, under 1030nm, single pulse. Using femtosecond laser and slit, we selectively controlled forming depth and removed the ITO thin films with thickness 145nm on glass substrates. In particular, we studied the effect of pulse number on the ablation of ITO. Clean removal of the ITO layer was observed when the 6 pulse number at $2.8TW/cm^2$. Furthermore, the morphologies and fabricated depth were characterized using a optical microscope, atomic force microscope (AFM), and energy dispersive X-ray spectroscopy (EDS).