• 제목/요약/키워드: Laser machining

검색결과 377건 처리시간 0.031초

세리믹 미세 구멍가공에서의 레이저 초점위치가 미치는 가공특성 연구 (A study of machining chracteristics effecting on laser focusing position in the ceramics microhole machining)

  • 김병용;이건상
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2001년도 춘계학술대회논문집C
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    • pp.513-518
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    • 2001
  • [ $Al_[2}O_{3}$ ] ceramics are generally used as components in processing equipment, devices or machinery. But it's difficult to machining as being machanical because $Al_[2}O_{3}$ ceramics are brittle materials. This study described a basic study of the input parameters effect on the dimension of the microhole at the $Al_[2}O_{3}$ ceramics using Nd:YAG laser. Major input parameters are peak power, pulse frequency and pulse duration in the laser microhole machining of $Al_[2}O_{3}$ ceramics. We will get a smaller microhole and diameter rate by an appropriate peak power, pulse duration.

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가상 레이저가공 시뮬레이션 프로그램 구축 (Development of a Simulation Program for Virtual Laser Machining)

  • 이호용;임중연;신귀성;윤경구;황경현;방세윤
    • 한국정밀공학회지
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    • 제22권7호
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    • pp.54-61
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    • 2005
  • A simulator for virtual laser machining is developed to help understanding and predicting the effects of machining parameters on the final machined results. Main program is based on the model for polymer ablation with short pulse excimer lasers. Version f of the simulator is built using Visual Fortran to make the user work under visual environment such as Windows on PC, where the important machining parameters can be input via dialog box and the calculated results for machined shape, beam fluence, and temperature distribution can be plotted through the 2-D graphics windows. Version II of the simulator is built using HTML, CGI and JAVA languages, allowing the user to control the input parameters and to see the results plot through the internet.

다중열원 보조가공을 위한 평판 시편의 예열 효과에 관한 해석적 연구 (An Analytical Study on the Preheating Effect of Flat Workpiece in Thermally Assisted Machining by Multi Heat Sources)

  • 문성호;이춘만
    • 한국정밀공학회지
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    • 제33권8호
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    • pp.629-634
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    • 2016
  • Laser-assisted machining (LAM) is one of the most effective methods of processing difficult-to-cut materials, such as titanium alloys and various ceramics. However, it is associated with problems such as the inability of the laser heat source to generate an appropriate preheating temperature. To solve the problem, thermally assisted machining with multiple heat sources is proposed. In this study, thermal analysis of multiple heat sources by laser and arc is performed according to power, heat source size, and leading heat source position. Then, the results are analyzed according to each condition. The results of this analysis can be used as a reference to predict preheating temperature in thermally assisted machining with multiple heat sources.

질화규소 세라믹의 레이저 예열선삭에 관한 연구 (III) - SSN 및 HIPSN의 예열선삭시 절삭력 및 공구수명의 특성 - (A Study on Laser Assisted Machining for Silicon Nitride Ceramics (III) - Variation of the Main Cutting Force and Life of Cutting Tool by LAM of SSN and HIPSN -)

  • 김종도;이수진;강태영;서정;이제훈
    • Journal of Welding and Joining
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    • 제28권6호
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    • pp.35-39
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    • 2010
  • Generally, ceramic material is very difficult to machine due to high strength and hardness. However, ceramic material can be machined at high temperature by plastic flow as metallic material due to the deterioration of the grain boundary glassy phase. Recently, a new method was developed to execute cutting process with CBN cutting tool by local heating of surface with laser. There are various parameters in LAM because it is a complex process with laser treatment and machining. During laser assisted machining, high power results in reducing of cutting force and increasing tool life, but excessive power brings oxidation of the surface. The effect of laser power, feed rate, cutting depth and etc. were investigated on the life of cutting tool. Chips were observed to find out suitable machining conditions. Chips of SSN had more flow-types than HIPSN. It means SSN is easier to machining. The life of cutting tool was increased with increasing laser power and decreasing feed rate and cutting depth.

펨토초 레이저 응용 선택적 어블레이션 연구 (Selective Removal of Thin Film on Glass Using Femtosecond Laser)

  • 유재용;조성학;박정규;윤지욱;황경현;고지 수지오카;홍종욱;허원하;다니얼 뵈머;박준형;세바스찬 잰더
    • 한국레이저가공학회지
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    • 제14권2호
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    • pp.17-23
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    • 2011
  • Active thin films are ubiquitous in the manufacture of all forms of flat panel display (FPD). One of the most widely employed thin films is indium tin oxide (ITO) and metal films used electrically conductive materials in display industries. ITO is widely used for fabrication of LCD, OLED device, and many kinds of optical applications because of transparency in visible range and its high conductivity and metal films are also widely employed as electrodes in various electric and display industries. It is important that removing specific area of layer, such as ITO or metal film on substrate, to fabricate and repair electrode in display industries. In this work, we demonstrate efficient selective ablation process to ITO and aluminum film on glass using a femtosecond laser (${\lambda}p=1025nm$) respectively. The femtosecond laser with wavelength of 1025nm, pulse duration of 400fs, and the repetition rate of 100kHz was used for selectively removing ITO and Al on glass in the air. We can successfully remove the ITO and Al films with various pulse energies using a femtosecond laser.

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펨토초 레이저를 이용한 실리콘 웨이퍼 표면 미세가공 특성 (Micromachining of the Si Wafer Surface Using Femtoseocond Laser Pulses)

  • 김재구;장원석;조성학;황경현;나석주
    • 한국정밀공학회지
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    • 제22권12호
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    • pp.184-189
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    • 2005
  • An experimental study of the femtosecond laser machining of Si materials was carried out. Direct laser machining of the materials for the feature size of a few micron scale has the advantage of low cost and simple process comparing to the semiconductor process, E-beam lithography, ECM and other machining process. Further, the femtosecond laser is the better tool to machine the micro parts due to its characteristics of minimizing the heat affected zone(HAZ). As a result of line cutting of Si, the optimal condition had the region of the effective energy of 2mJ/mm-2.5mJ/mm with the power of 0.5mW-1.5mW. The polarization effects of the incident beam existed in the machining qualities, therefore the sample motion should be perpendicular to the projection of the electric vector. We also observed the periodic ripple patterns which come out in condition of the pulse overlap with the threshold energy. Finally, we could machined the groove with the linewidth of below $2{\mu}m$ for the application of MEMS device repairing, scribing and arbitrary patterning.

레이져를 이용한 3차원 형상가공에 관한 연구 (Laser application in 3-D micromachining)

  • 윤경구;이성국;황경현
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 1995년도 추계학술대회 논문집
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    • pp.75-78
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    • 1995
  • This paper presents the feasibility of laser ablation process in 3-D micro machining of MEMS (micro Electro Mechanical System)parts. The micro machining characteristics of polymer(Energy fluence, pulse repetition rate, number of pulse, ablation rate)are investigated and 3-D micro machined samples are demonstrated.

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세라믹스의 제거가공 기술 동향 (Review of Technology Trends for Ceramics Removal-Machining)

  • 곽재섭;곽태수
    • 한국정밀공학회지
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    • 제30권12호
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    • pp.1227-1235
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    • 2013
  • Ceramic materials are classified by oxide, nitride and carbide material and have high brittleness, strength and hardness. Ceramic materials are strong in compression but weak in shearing and tension. This review paper has focused on technology trends and mechanism analysis of ceramics removal machining. The ceramic materials have superior mechanical, physical and chemical properties, but it is very hard to machining and the use of ceramics has been limited because of high strength and brittleness. In this paper, technology trends of ceramic removal-machining was introduced for types of machining technology, abrasive machining, cutting process, laser machining and so on.