• 제목/요약/키워드: Laser Processing Technology

검색결과 500건 처리시간 0.024초

인쇄 롤의 간접식 레이저 가공을 위한 코팅과 에칭 기술 (Coating and Etching Technologies for Indirect Laser processing of Printing Roll)

  • 이승우;김정오;강희신
    • 한국레이저가공학회지
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    • 제16권4호
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    • pp.12-16
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    • 2013
  • For mass production of electronic devices, the processing of the printing roll is one of the most important key technologies for printed electronics technology. A roll of printing process, the gravure printing that is used to print the electronic device is most often used. The indirect laser processing has been used in order to produce printing roll for gravure printing. It consists of the following processing that is coating of photo polymer or black lacquer on the surface of printing roll, pattering using a laser beam and etching process. In this study, we have carried out study on the coating and etching for $25{\mu}m$ line width on the printing roll. To do this goals, a $4{\mu}m$ coating thickness and 20% average coating thickness of the coating homogeneity of variance is performed. The factors to determine the thickness and homogeneity are a viscosity of coating solution, the liquid injection, the number of injection, feed rate, rotational speed, and the like. After the laser patterning, a line width of $25{\mu}m$ or less was confirmed to be processed through etching and the chromium plating process.

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레이저를 이용한 소재가공기술 동향 - ICALEO 2014를 중심으로 - (Recent Trends of the Material Processing Technology with Laser - ICALEO 2014 Review -)

  • 이목영
    • Journal of Welding and Joining
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    • 제33권4호
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    • pp.7-16
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    • 2015
  • New lasers such as high power, high brightness and short wavelength laser are using diverse industry. Also new technologies are developing actively to solve various issues such as spattering, process monitoring, deep penetration and key-hole stability. ICALEO is the international congress where recent technology for laser material processing and laser system are present. At 2014, it was held at San Diego in USA and more than 260 papers were presented from 28 country. The effect of the laser beam shape such as Gaussian like and top-hat was investigated on acoustic emission signal and pore formation in welding. Inline penetration depth was measured with ICI(Inline Coherent Imaging) technique and the data was verified with real time X-ray image on laser welding. The laser welding performance at low pressure environment was evaluated for the thick plate alloy steel. UV laser was used to weld various metals such as Cu, Aluminum, steel and stainless steel. The effect of the wavelength of the laser on the formation of the wave at the wall of the key-hole front and the absorptivity was investigated.

치과용 세라믹 보철물 소재 레이저 가공성 평가 (A study on the processing of dental ceramic composites by using laser)

  • 황준호;권성민;이찬우;김현덕;김임선;이규복
    • 대한치과보철학회지
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    • 제57권1호
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    • pp.1-7
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    • 2019
  • 목적: 레이저를 이용한 치과 보철물 세라믹 복합소재 Lava Ultimate와 IPS e.max의 가공성 평가를 하고자 한다. 재료 및 방법: 3M, Lava Ultimate와 Ivoclar vivadent, IPS e.max의 가공성 평가를 위해 $CO_2$ 레이저, 피코초 레이저, 펨토초 레이저를 사용하였으며, 공초첨 현미경을 이용하여 가공 형상을 분석하였다. 결과: 세라믹 복합체의 취성 및 탄화, 균열 등은 소재의 열축적에 영향을 받고 레이저 출력 및 펄스 시간에 의해 제어가 가능함을 알 수 있었다. 결론: $CO_2$ 레이저를 이용하여 세라믹 복합소재 가공 시 미세 균열과 탄화가 즉시 발생하였으며, 피코초 레이저 가공의 경우 미세 균열은 일부 개선되었으나 탄화 현상은 지속적으로 발생되었다. 하지만 펨토초 레이저를 이용한 레이저 가공 시 출력 대비 높은 효율의 가공성을 확인하였으며, 특히 세라믹 레진 복합소재인 Lava Ultimate의 경우 펨토초 레이저를 이용하여 가공 시 가장 우수한 가공성을 보였다.

다구찌법을 이용한 IR 레이저 Flip-chip 접합공정 최적화 연구 (A Study on the Optimization of IR Laser Flip-chip Bonding Process Using Taguchi Methods)

  • 송춘삼;지현식;김주한;김종형;안효석
    • Journal of Welding and Joining
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    • 제26권3호
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    • pp.30-36
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    • 2008
  • A flip-chip bonding system using IR laser with a wavelength of 1064 nm was developed and associated process parameters were analyzed using Taguchi methods. An infrared laser beam is designed to transmit through a silicon chip and used for transferring laser energy directly to micro-bumps. This process has several advantages: minimized heat affect zone, fast bonding and good reliability in the microchip bonding interface. Approximately 50 % of the irradiated energy can be directly used for bonding the solder bumps with a few seconds of bonding time. A flip-chip with 120 solder bumps was used for this experiment and the composition of the solder bump was Sn3.0Ag0.5Cu. The main processing parameters for IR laser flip-chip bonding were laser power, scanning speed, a spot size and UBM thickness. Taguchi methods were applied for optimizing these four main processing parameters. The optimized bump shape and its shear force were modeled and the experimental results were compared with them. The analysis results indicate that the bump shape and its shear force are dominantly influenced by laser power and scanning speed over a laser spot size. In addition, various effects of processing parameters for IR laser flip-chip bonding are presented and discussed.

펨토초 레이저 유도 나노 및 마이크로 구조물을 활용한 금속 표면 기능성 제어 (Controlled Surface Functionalities of metals using Femtosecond Laser-induced Nano- and Micro-scale Surface Structures)

  • 박태훈;이효수;이해중;황택용
    • Design & Manufacturing
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    • 제17권2호
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    • pp.55-61
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    • 2023
  • With femtosecond (fs) laser pulse irradiation on metals, various types of nano- and micro-scale structures can be naturally induced at the surface through laser-matter interaction. Two notable structures are laser-induced periodic surface structures (LIPSSs) and cone/spike structures, which are known to significantly modify the optical and physical properties of metal surfaces. In this work, we irradiate fs laser pulses onto various types of metals, cold-rolled steel, pickled & oiled steel, Fe-18Cr-8Ni alloy, Zn-Mg-Al alloy coated steel, and pure Cu which can be useful for precise molding and imprinting processes, and adjust the morphological profiles of LIPSSs and cone/spike structures for clear structural coloration and a larger range of surface wettability control, respectively, by changing the fluence of laser and the speed of raster scan. The periods of LIPSSs on metals used in our experiments are nearly independent of laser fluence. Accordingly, the structural coloration of the surface with LIPSSs can be optimized with the morphological profile of LIPSSs, controlled only by the speed of the raster scan once the laser fluence is determined for each metal sample. However, different from LIPSSs, we demonstrate that the morphological profiles of the cone/spike structures, including their size, shape, and density, can be manipulated with both the laser fluence and the raster scan speed to increase a change in the contact angle. By injection molding and imprinting processes, it is expected that fs laser-induced surface structures on metals can be replicated to the plastic surfaces and potentially beneficial to control the optical and wetting properties of the surface of injection molded and imprinted products.

355nm UV 레이저를 이용한 마이크로 렌즈 어레이 쾌속 제작에 관한 연구 (A Study on Rapid Fabrication of Micro Lens Array using 355nm UV Laser Irradiation)

  • 제순규;박상후;최춘기;신보성
    • 소성∙가공
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    • 제18권4호
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    • pp.310-316
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    • 2009
  • Micro lens array(MLA) is widely used in information technology(IT) industry fields for various applications such as a projection display, an optical power regulator, a micro mass spectrometer and for medical appliances. Recently, MLA have been fabricated and developed by using a reflow method having the processes of micro etching, electroplating, micro machining and laser local heating. Laser thermal relaxation method is introduced in marking of microdots on the surface of densified glass. In this paper, we have proposed a new direct fabrication process using UV laser local thermal-expansion(UV-LLTE) and investigated the optimal processing conditions of MLA on the surface of negative photo-resist material. We have also studied the 3D shape of the micro lens obtained by UV laser irradiation and the optimal process conditions. And then, we made chrome mold by electroplating. After that, we made MLA using chrome mold by hot embossing processing. Finally, we have measured the opto-physical properties of micro lens and then have also tested the possibility of MLA applications.

지상레이저스캐닝 데이터를 활용한 3차원 지반지형 분석 플랫폼 개발 (Development of 3D Terrain Processing Platform Using Terrestrial Laser Scanning Data)

  • 김석;김태영
    • 한국건축시공학회:학술대회논문집
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    • 한국건축시공학회 2016년도 춘계 학술논문 발표대회
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    • pp.227-228
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    • 2016
  • Terrestrial laser scanning (TLS) technology is being applied to various fields such as the soil volume calculation and the displacement measurement of terrain, tunnels and dams. This study develops a 3D terrain processing platform for automated earth work using a terrestrial laser scanning data as the software prototype. The developed software provides cells with geo-technical information for planning work to an integrated system.

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DLM 공정시 공정변수에 따른 내부공극률과 표면조도 변화 (Effect of Process Parameters on Surface Roughness and Porosity of Direct Laser Melted Bead)

  • 김태현;장정환;전찬후;문영훈
    • 소성∙가공
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    • 제20권8호
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    • pp.575-580
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    • 2011
  • Direct laser melting(DLM) is promising as a joining method for producing parts for automobiles, aerospace, marine and medical applications. An advantageous characteristic of DLM is that it affects the parent metal very little. The mechanical properties of parts made by DLM are strongly affected by the porosity and surface roughness of the laser melted beads. This is a systematic study of the effects of the porosity and surface roughness of laser melted beads using various processing parameters, such as laser power, scan rate and overlapping ratio of the fill spacing. The specimens were fabricated with 316L and 304L austenitic stainless steel powder. Dense parts with low porosity were obtained at low laser scan speed, as it increased the aspect ratio of the parental material and the depth of penetration. The variations of surface roughness were examined at various processing parameters such as overlapping ratio and laser power.