• 한국생산제조학회지
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• 제21권3호
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• pp.382-386
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• 2012

A femtosecond laser with 775nm central wavelength and 150 fs of temporal pulse width was used for multi layered glass cutting applications. Ultrashort pulse was effectively used for clean glass cutting with $50{\mu}m$ depth and minimum cutting width. Laser beam was split to two stages and focused on the top surfaces of each layer. Ablation threshold of used glass was measured to be $2.59J/cm^2$. In experiments, 200mW laser power and 1mm/s scanning speed was used for preliminary experiment. Air gap was the major defect occurring parameter and laser power was less sensitive to glass cutting in the experiment. The maximum cutting speed was measured to be 60mm/min with 2kHz, however, Maximum 3m/min cutting speed can be achievable with a commercially available laser with 100kHz.

• 한국정밀공학회지
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• 제30권4호
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• pp.403-408
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• 2013

In this paper, the characteristics of ablation processing of the eagle glass by pico-second laser are investigated. The laser ablation is used to process micro forms on materials. The ablation causes little thermal effect and little burr on the surface of eagle glass. In order to examine the characteristics of panic cracks, experiments are conducted under various cutting conditions such as a frequency of 600 kHz, laser powers, scan speeds and number of scan(NS). To minimize the panic cracks, the specimens are heated at $30^{\circ}C$, $45^{\circ}C$, and $60^{\circ}C$ for ten minutes respectively and then they are broken by hands. Laser powers, NS and scan speeds have an effect on glass cutting results. The ablation depths increase with an increase in the laser power and NS whereas the panic cracks decrease with an increase in scan speed. The high temperature on processed specimens reduces the panic cracks and makes good results of laser cutting. The optimal condition for eagle glass laser cutting is found to be at 30 W of laser power, 3 mm/s of scan speed and 500 of NS, respectively.

• 한국재료학회지
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• 제18권5호
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• pp.247-252
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• 2008

A laser glass cutting system using a femto-second laser was evaluated for Flat Panel Display (FPD) glass. A theoretical analysis of the ablation threshold and depth is described using an explicit analytic form. Experiments for clean and deep grooves were performed using a 3W femto-second laser, and the relationships between the input energy and the scribing depth as well as the threshold energy are presented. Mechanical breaking after the scribing process was carried out and the results are compared with a theoretical method. It was found that a two-sided LCD panel glass can be cut clearly using the laser cutting method. The methodology was found to be very effective as a mass-production cutting system.

• 한국생산제조학회지
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• 제24권4호
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• pp.428-433
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• 2015

A non-symmetric laser beam was used for cutting a thin glass substrate and its effect was investigated. In laser cutting of brittle materials, controlling crack initiation on the surface is crucial; however, it is difficult to ensure that crack propagation occurs according to a designed laser path. A lot of deviation in crack propagation, especially at the edge of the substrate, is usually observed. A non-symmetric laser beam generates a non-uniform energy distribution, which enhances directional crack propagation. A 20-W pulsed YAG laser was used for cutting a thin glass substrate. Parametric analysis was carried out and the crack control of the non-symmetric laser beam was improved. A theoretical model was presented and the limitations of the proposed process were also discussed.

• 한국레이저가공학회지
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• 제18권3호
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• pp.9-13
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• 2015

The development of a reliable, high-power source of mind-IR laser light gives process develop important tool with unique characteristics that will significantly impact a diverse range of applications.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2013년도 춘계학술대회 논문집
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• pp.497-498
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• 2013

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2009년도 춘계학술대회 논문집
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• pp.117-118
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• 2009

• 한국정밀공학회지
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• 제27권6호
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• pp.32-38
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• 2010

Laser material processing technology is adopted in several industry as alternative process which could overcome weakness and problems of present adopted process, especially semiconductor and display industry. In semiconductor industry, laser photo lithography is doing at front-end level, and cutting, drilling, and marking technology for both wafer and EMC mold package is adopted. Laser cleaning and de-flashing are new rising technology. There are 3 kinds of main display industry which use laser technology - TFT LCD, AMOLED, Touch screen. Laser glass cutting, laser marking, laser direct patterning, laser annealing, laser repairing, laser frit sealing are major application in display industry.

• 한국반도체및디스플레이장비학회:학술대회논문집
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• 한국반도체및디스플레이장비학회 2005년도 춘계 학술대회
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• pp.219-223
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• 2005

Nowadays laser cutting is the most promising method of cutting FPD(Flat Panel Display) glass in mass-production line. And this method can also be used to cut other brittle materials such as quartz, sapphire, ceramic and semiconductor The concept of this method is shown in picture 1. Laser beam heats glass up to strain point, not to melting point and cooling system chills glass to induce maximun thermal stress in glass surface and then the thermal stress generates micro thermal crack, in other words blind depth of crack, along laser beam and cooling line.

• 한국방사성폐기물학회:학술대회논문집
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• 한국방사성폐기물학회 2005년도 추계 학술대회 논문집
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• pp.87-95
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• 2005

삼중수소를 사용하는 자발광유리관의 제조에 필요한 4가지 핵심 기술 중 레이저를 이용한 밀봉/절단기술을 개발하였다. 상용 제품을 분석한 결과 유리관의 재질은 pyrex 이었고 레이저는 유리가공에 적절한 펄스형 이산화탄소 레이저를 사용하였다 유리관의 밀봉/절단에 영향을 미치는 인자들로는 레이저빔의 강도 지속시간 조사 방법, 유리관 내부의 압력 등이었다. 전 공정은 2단계로 이루어져 1단계에서는 삼중수소를 주입하고 유리관의 양단을 밀봉하였으며 2단계에서는 삼중수소가 봉입된 유리관을 원하는 길이로 밀봉/절단하였다. 각 공정에서 유리관의 밀봉은 defocusing된 레이저빔을 사용하였으며 절단은 focusing된 빔을 사용하였다. 밀봉/절단 후에는 잔여 열응력에 의한 파열을 방지하기 위하여 열처리를 하였다.