• 한국정보디스플레이학회:학술대회논문집
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• 2005.07b
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• pp.897-897
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• 2005

We report QLA (Quenching-rate controlled Laser Annealing) system as new concept using pulsed DPSSL and CW lasers. This process can control temperature quenching-rate of poly-Si crystallization by additional CW laser and fabricate high quality poly-Si with faster scanning speed than conventional processes. In this paper, QLA system, the experimental results and theoretical discussion will be introduced.

• Proceedings of the KIEE Conference
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• 1995.11a
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• pp.329-331
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• 1995

Laser ablation was used to fabricate superconducting $YBa_2Cu_3O_{7-x}$ (YBCO) thin films on metallic substrates with an YSZ buffer layer. An ArF excimer laser with an wavelength of 193 nm was used to deposit both YSZ buffer layer and superconducting thin film. The characterizations of thin films were performed and compared. With a 200 nm YSZ buffer layer, c-axis orientation and $T_c$=85 K were obtained for a 200 nm-thick YBCO film.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.05a
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• pp.308-308
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• 2004

쾌속조형기술은 설계형상의 확인, 시작품의 제작, 금속 및 세라믹 부품에의 응용, 동시공학, 의료, 마이크로 머신 둥 제조업 전반에 걸쳐서 많은 응용이 이루어지고 있다 여러 가지의 기술들이 개발되고 이를 응용한 장비들이 생산되어 보급됨으로써 이러한 적용분야들은 점차 확대되고 있다. 본 연구에서는 분말을 소결, 적층하여 원하는 형상을 만들어내는 SLS(Selective Laser Sintering) 장비를 개발하는데 있어서 레이저 경로의 제어를 통한 분말을 소결시키는 부분인 레이저 주사 시스템(laser scanning system)을 개발하고자 한다.(중략)

• Korean Journal of Optics and Photonics
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• v.1 no.2
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• pp.185-190
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• 1990

Balanced CPM ring dye laser was fabricated. Pulses as short as 62 fs were measured using noncollinear second harmonic generation autocorrelator. The optimum conditions were studied by changing the concentration of staturable absorber, pumping power of Ar+ laser and alignments of the intracavity four-prism sequence.

• Computational Structural Engineering
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• v.17 no.3
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• pp.53-56
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• 2004

• Proceedings of the Optical Society of Korea Conference
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• 1999.08a
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• pp.50-51
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• 1999

• Proceedings of the Optical Society of Korea Conference
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• 1999.08a
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• pp.86-87
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• 1999

• Proceedings of the Optical Society of Korea Conference
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• 2002.11a
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• pp.180-181
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• 2002

• Journal of The Korean Digital Architecture Interior Association
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• v.12 no.1
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• pp.25-33
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• 2012

Ever since the local interior and architecture design industry adopted Digital fabrication modeling tool for its design operation in early 1990's, working environment has been changing. The Purpose of study is to analyze the digital Architecture fabrication modeling for digital design education in academy course. Digital Design Tools, Digital Space and Form, Digital Materiality and Digital Production. The Digital fabrication modeling is and important role in a traditional design process and digital design process. It is comprised of digital input devices(3D digitizer, 3D design tools) and digital output devices(cutting plotters, laser cut, CNC machines, 3D printers). Digital input devices can be shift a traditional design process to digital design process. Digital output devices are the principle of digital fabrication by CAD/CAM. Also, the result of this study provide the fundamental data for physical resources and digital design curriculum in KAAB.

• Korean Journal of Materials Research
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• v.30 no.7
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• pp.327-332
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• 2020

Laser induced surface activation (LISA) technology requires refined selection of process variables to fabricate conductive microcircuits on a general polymer material. Among the process variables, laser mode is one of the crucial factors to make a reliable conductor pattern. Here we compare the continuous wave (CW) laser mode with the pulse wave (PW) laser mode through determination of the surface roughness and circuit accuracy. In the CW laser mode, the surface roughness is pronounced during the implementation of the conductive circuit, which results in uneven plating. In the PW laser mode, the surface is relatively smooth and uniform, and the formed conductive circuit layer has few defects with excellent adhesion to the polymer material. As a result of a change of laser mode from CW to PW, the value of Ra of the polymer material decreases from 0.6 ㎛ to 0.2 ㎛; the value of Ra after the plating process decreases from 0.8 ㎛ to 0.4 ㎛, and a tight bonding force between the polymer source material and the conductive copper plating layer is achieved. In conclusion, this study shows that the PW laser process yields an excellent conductive circuit on a polymeric material.