• Title/Summary/Keyword: Laser Brazing

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Laser Hybrid Welding and Laser Brazing Technology (레이저 하이브리드 용접과 레이저 브레이징 기술)

  • 김종도;김유찬
    • Journal of Advanced Marine Engineering and Technology
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    • v.28 no.5
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    • pp.691-698
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    • 2004
  • 레이저빔과 아크를 하나의 용접 프로세스로 병합하는 기술에 관해서는 이미 70년대부터 알려져 왔으나 별다른 개발로 이어지지 못하다가 최근에서야 다시 눈을 돌리게 되었다. 이 기술의 핵심과제는 아크의 장점과 레이저의 장점을 어떻게 단일 혼합 프로세스로 조합하느냐 하는 것이다. 과거 레이저빔을 처음 사용할 때 만해도 산업용으로서 적합성을 증명해야 했으나 지금은 이미 자동차 산업에서 재래기술로 치부되고 있다.(중략)

Experiments on Welding of Ceramics by Use of High Power Laser (고출력 레이저를 이용한 세라믹 재료의 용접 실험)

  • 변철웅
    • Journal of Welding and Joining
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    • v.12 no.2
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    • pp.39-48
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    • 1994
  • In comparison to the conventional brazing, laser welding of ceramics has advantages of direct bonding without filler material, which causes the thermal stress due to the differences of thermal expansion coefficients. In pulse-mode, laser welding of dispersion ceramic having high thermal resistance is possible at relatively low preheating temperature of $1300^{\circ}C$ In CW-mode, alumina can be welded at high preheating temperature $1500^{\circ}C$ under the condition of low feed rate of 500 mm/min, respectively. Further studies on developing mechanism of pores in the bead during laser welding of ceramics is required.

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Laser Hybrid Welding and Laser Brazing -State of the Art and Applications in Audi A8 and VW-Phaeton- (레이저 하이브리드 용접과 레이저 브레이징 -최신 기술 및 Audi A8과 VW-Phaeton의 실제 적용 사례-)

  • ;;Herbert Staufer
    • Journal of Welding and Joining
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    • v.22 no.2
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    • pp.13-18
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    • 2004
  • 레이저 빔과 아크를 하나의 용접 프로세스로 병합하는 기술에 관해서는 이미 70년대부터 알려져 왔으나 별다른 개발로 이어지지 못하다가 최근에서야 다시 눈을 돌리게 되었다. 이 기술의 핵심 과제는 아크의 장점과 레이저의 장점을 어떻게 단일 혼합 프로세스로 조합하느냐 하는 것이다.(중략)

Fabrication of Composite Filler Metal by Melt Infiltration (용탕 침투법을 이용한 복합 삽입 금속의 제조)

  • Park, Heung-Il;Kim, Ji-Tae;Kim, Woo-Yeol
    • Journal of Korea Foundry Society
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    • v.23 no.5
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    • pp.244-250
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    • 2003
  • The aim of this study is fabricating of composite filler metal (CFM) by a combination of selective laser sintering (SLS) of stainless steel powders (RapidSteel $2.0^{TM}$ and liquid phase infiltration of Ag-28 wt.%Cu alloy. Porous stainless steel body with inter-connected pore channels was fabricated by SLS, binder decomposing and densification processes. By the direct contact infiltration, the narrow inter-particle channels of the porous body were completely filled with the Ag-28 wt.%Cu alloy infiltrant. During infiltration, the dissolved elements of Fe, Ni and Cr from the porous body were solved into copper solid solution phases, which consist of eutectic structure of composite metal matrix. The S10C/CFM/S10C joints, which have narrow clearance gaps between them up to 10 micrometers, were joined successfully by self-feeding of filler metal from the matrix of CFM. The CFM kept its original thickness and microstructure after brazing. The tensile strength of brazed specimen was higher than 30 kgf/$mm^2$ and showed a typical ductile fracture mode in the CFM.

Fabrication and Characterization of Window Metallization Pattern for Optical Module Package (광모듈 패키지용 Window 의 Metallization Pattern 제작 및 특성 평가)

  • Jo Hyeon Min;Dan Seong Baek;Ryu Heon Wi;Gang Nam Gi
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2003.11a
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    • pp.239-242
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    • 2003
  • Optical module package is a hermetic metal-ceramic package for carrying optical IC. In case of LD(laser diode) module, window is used for both the path of optical signal and hermetic sealing of package. So, window has the metallization pattern on the surface for brazing process with package wall. In this study, several method were investigated for metallization. Thin film, thick film and mixed method were used for fabrication of metallization pattern. After brazing process, hermeticity and adhesion strength were tested for characterization of metallization pattern.

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Butterfly type 광패키지의 제작 및 특성 평가

  • 조현민;유찬세;강남기;이승익;한기우;유명기
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2001.11a
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    • pp.111-114
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    • 2001
  • Optical transmitter and receiver are the essential components for optical communication. For these components, butterfly type packages are used which are comprised of metal housing, multilayer ceramic inserts, lead and window. In this study, 2.5 Gbps DFB(Distributed -Feedback) LD(Laser Diode) package was fabricated and characterized. Metal housing showed good thermal conductivity (200W/mK) and well matched TCE(6.7ppm/K) with GaAs chip. Ceramic inserts also showed good VSWR(Voltage Standing Wave Ratio) characteristics(<2.0). By brazing technology, all the elements were combined and sealed. RF characteristics of the package mounted on the PWB was also tested.

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레이저 절단 판재의 브레이징을 이용한 적층 사출금형

  • 조용무;김재도
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1993.04b
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    • pp.323-327
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    • 1993
  • Mold-making industry demands currently to reduce the tooling costs and time in mold making, and to improve the productivity and quality in injection molding process. These problems can be easily removed by laminated injection mold which is made with metal sheets prepared by laser cutting and bonded by brazing. Comparing withthe conventional mold making technology which mainly depends on the machining, this new technologyenables an arbitary design of cooling circuit without anyrestrictions of geometry. So it brings about high production rates of the injection molding processes. This paper estimate the conventional and laminated injection mold making process with a simple molding, and also the cooling efficiencyof thoes two kinds of mold with the filling and cooling analysis. The results show that the laminated injectionmold has much shorter tooling time, uniform mold temperature, and shorter cooling time in injection molding process.