• Journal of Welding and Joining
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• 제12권2호
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• pp.39-48
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• 1994

In comparison to the conventional brazing, laser welding of ceramics has advantages of direct bonding without filler material, which causes the thermal stress due to the differences of thermal expansion coefficients. In pulse-mode, laser welding of dispersion ceramic having high thermal resistance is possible at relatively low preheating temperature of $1300^{\circ}C$ In CW-mode, alumina can be welded at high preheating temperature $1500^{\circ}C$ under the condition of low feed rate of 500 mm/min, respectively. Further studies on developing mechanism of pores in the bead during laser welding of ceramics is required.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2000년도 춘계학술대회 논문집
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• pp.743-746
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• 2000

The removal of contaminants of silicon wafers has been investigated by various methods. Laser cleaning is the new dry cleaning technique to replace wafer wet cleaning in the near future. A dry laser cleaning uses inert gas jet to remove contaminant particles lifted off by the action of a KrF excimer laser. A laser cleaning model is developed to simulate the cleaning process and analyze the influence of contaminant particles and experimental parameters on laser cleaning efficiency. The model demonstrates that various types of submicrometer-sized particles from the front sides of silicon wafer can be efficiently removed by laser cleaning. The laser cleaning is explained by a particle adhesion model. including van der Waals forces and hydrogen bonding, and a particle removal model involving rapid thermal expansion of the substrate due to the thermoelastic effect. In addition, the experiment of wafer laser cleaning using KrF excimer laser was conducted to remove various contaminant particles.

• 한국광학회:학술대회논문집
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• 한국광학회 2009년도 동계학술발표회 논문집
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• pp.483-484
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• 2009

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2005년도 춘계학술발표대회 개요집
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• pp.22-24
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• 2005

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2011년도 춘계학술대회 논문집
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• pp.471-472
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• 2011

• 대한치과기공학회지
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• 제36권4호
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• pp.239-246
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• 2014

Purpose: The purpose of this study was to compare the tensile strength and mechanical properties of orthodontic wire joints made by gas soldering and laser welding, with and without filling material, to identify the effectiveness and potential clinical application of laser welded orthodontic wires. Methods: Three joint configurations of orthodontic wire were used: diameter 0.9 to 0.9 mm wire, diameter 0.9 to 0.5 wire and diameter 0.9 mm wire to band. The joints were made using three different methods: gas soldering, laser welding with and without filling material. For each kind of joint configuration or connecting method 7 specimens were carefully produced. The tensile strengths were measured with a universal testing machine (Zwick/Roell, Instron, USA). The hardness measurements were carried out with a hardness tester(Future-Tech Co. Tokyo, Japan). Data were analyzed by AVOVA(p= .05) and Turkey HD test(p= .05). Results: In all cases, gas soldering joints were ruptured on a low level on tensile bonding strength. Significant differences between laser welding and gas soldering(p< .05) were found in each joint configuration. The highest tensile strength means were observed for laser welding, with filling material, of 0.9 to 0.9 mm wire joint. Conclusion: In conclusion, the elastic modulus and tensile strength means of laser soldering with filling material were the highest, and the tensile strength means of laser soldering were higher than those of gas soldering.

• 대한치과교정학회지
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• 제40권2호
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• pp.87-94
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• 2010

전단결합강도를 강화하기 위해 레이저를 이용한 부식과 산을 이용한 부식의 비교 연구가 많이 진행되어왔다. 본 연구에서는 Er,Cr:YSGG laser와 전통적인 산부식법을 혼합한 방법의 전단결합강도의 변화에 대한 평가를 하고자 한다. 교정적인 목적으로 발치된 64개의 건전한 소구치를 이용하여 16개씩 4개의 군으로 나누었다. 첫 번째 군은 37% 인산을 15초 적용시키는 전통적인 부식 방법을 택하였고, 두 번째 군은 물방울레이저로 1.5 W로 10초간 부식시킨 후 전통적인 산부식 방법을 시행하였다. 세 번째 군은 두 번째 군과 같지만 산부식을 먼저 시행한 후 물방울레이저로 부식시켰다. 네 번째 군은 물방울레이저를 이용하여 1.5 W로 15초간 부식시켰다. 이후 전단결합강도의 측정 및 치아 표면의 특징 관찰, 그리고 접착제잔류지수를 평가하였다. 두 번째, 세 번째 군은 첫 번째, 네 번째 군에 대하여 전단결합강도가 높게 측정되었다. 하지만 두 가지 기법의 복합사용 순서를 달리한 두 번째, 세 번째 군 사이에는 통계적으로 유의한 차이가 나지 않았다. 기존 산부식을 이용한 브라켓 접착법보다 산부식과 Er,Cr:YSGG laser를 복합적으로 사용 시, 향상된 전단결합강도를 얻을 수 있다.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2002년도 Proceedings of the International Welding/Joining Conference-Korea
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• pp.402-407
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• 2002

Laminate tooling process is a fast and simple method to make metal tools directly for various molding processes such as injection molding in rapid prototyping field. Metal sheets are usually cut, stacked, aligned and joined with brazing or soldering. Through the joining process, all of the metal sheet layers should be rigidly joined. When joining process parameters are not appropriate, there would be defects in the layers. Among various types of defects, non-bonded gaps of the tool surface are of great importance, because they directly affect the surface quality and dimensional accuracy of the final products. If a laminate tool with defects has to be abandoned, it could lead to great loss of time and cost. Therefore a repair method for non-bonded gaps of the surface is essential and has important meaning for rapid prototyping. In this study, a rapid laminate tooling system composed of a CO2 laser, a furnace, and a milling machine was developed. Metal sheets were joined by furnace brazing, dip soldering and adhesive bonding. Joined laminate tools were machined by a high-speed milling machine to improve surface quality. Also, repair brazing and soldering methods of the laminates using the $CO_2$ laser system have been investigated. ill laser repair process, the beam duration, beam power and beam profile were of great importance, and their effects were simulated by [mite element methods. The simulation results were compared with the experimental ones, and optimal parameters for laser repair process were investigated.

• Journal of Welding and Joining
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• 제25권2호
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• pp.1-2
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• 2007

• 한국재료학회:학술대회논문집
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• 한국재료학회 1993년도 춘계학술발표회
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• pp.104-106
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• 1993