• 한국약용작물학회지
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• 제26권5호
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• pp.354-361
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• 2018

Background: This study was conducted to investigate the growth characteristics, root yield and curcuminoid content of turmeric (Curcuma longa L.), cultivated using mother seed rhizomes (MR) and finger seed rhizome (FR) of different sizes. MR are attached to the stem, and FR are connected to the MR, and are used as a general seed rhizome. Methods and Results: Seed rhizomes of different types and sizes were used: large, medium and small for FR, and large, half-sized, and small for MR. These were assigned to the experimental groups and cultivated under greenhouse conditions. The growth characteristics, root yield, and curcuminoid content did not show clear difference between MR and FR, but suggest that the larger seed rhizomes (above 30 g) could have higher root yields. On average, harvested mother rhizomes (HMR) contained more curcuminoid than harvested finger rhizomes (HFR), while the yield of HFR was higher than that of HMR. The higher weight of harvested roots correlated significantly with elevated curcuminoid content. Conclusions: The two seed rhizomes, MR and FR, did not differ in root yield and curcuminoid contents, but larger seed rhizomes may produce better root yields. This suggest that the optimum seed rhizome is larger FR, to produce higher yields and quality in turmeric root production.

• 한국생산제조학회지
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• 제20권5호
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• pp.559-563
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• 2011

Drop impact reliability assessment of solder joints on the flip chip is one of the critical issues for micro system packaging. Our previous researches have been showing that new solder ball compositions of Sn-3.0Ag-0.5Cu has better mechanical reliability than Sn-1.0Ag-0.5Cu. In this paper, dynamic reliability analysis using Finite Element Analysis (FEA) is carried out to assess the factors affecting flip chip in drop simulation. The design parameters are size and thickness of chip, and size, pitch and array of solder ball with composition of Sn1.0Ag0.5Cu. The board systems by JEDEC standard including 15 chips, solder balls and PCB are modeled with various design parameter combinations, and through these simulations, maximum yield stress and strain at each chip are shown at the solder balls. It is found that larger chip size, smaller chip array, smaller ball diameter, larger pitch, and larger chip thickness have bad effect on maximum yield stress and strain at solder ball of each chip.

• 전자공학회논문지A
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• 제30A권8호
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• pp.81-87
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• 1993

The growth thickness uniformity of epitaxial layers deposited using a moiecular beam epitaxy system is calculated from the arrangement of molecular beam source and the substrate and the geometric dimensions of the crucible in order to predict the optimum design conditions of the prototype MBE system. The thickness uniformity better than 5% over a 3-inch wafer can be obtained by keeping the distance between the substrate and the crucible's orifice longer than 20cm, the tapering angle of the crucible larger than 6$^{\circ}$, and the angle between the normal to the substrate at the center and the crucible axis as larger as possible. In addition, the growth yield decreases to below 51% as the distance between the substrate and the orifice becomes longer than 25cm.

• 대한산업공학회지
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• 제23권4호
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• pp.709-717
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• 1997

For an undirected graph G=(V, E), the Rural Postman Problem (RPP) is a problem that finds a minimum cost tour that must pass edges in E'($\subseteq$ E) at least once. RPP, such as Traveling Salesman Problem (TSP), is known as an NP. Complete problem. In the previous study of RPP, he structure of the chromosome is constructed by E' and the direction of the edge. Hence, the larger the size of IE' I is, the larger the size of the chromosome and the size of the solution space are. In this paper, we transform the RPP into a Hamiltonian graph and use a genetic algorithm to solve the transformed problem using restructured chromosomes. In the simulations, we analyze our method and the previous study. From the simulation results, it is found that the results of the proposed method is better than those of the previous method and the proposed method also obtains the near optimal solution in earlier generations than the previous study.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 1998년도 춘계학술대회 논문집
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• pp.19-24
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• 1998

This paper aims to clarify the effects of grinding conditions on the ground surface and bending strength in surface grinding of various ferrites with diamond wheel. The main conclusions obtained were as follows. The surface roughness becomes better at lower wheel speed in the case of v/V=1$\times$10-3, and the condition of v/V=1$\times$10-4shows the best performance for the finish grinding. When the relative contact temperature becomes lower at a constant value of v/V, the ground surface exhibits lower roughness. The ground surface shows that the fracture process during grinding becomes more brittle at the higher value of v/V. The damage depth which affect the bending strength is below 10$\mu$m in the grinding condition of S=10㎣/mm.s with the diamond tool after dressing & truing, however, the depth increases with increasing removal rate(S). When the strength degradation due to grinding is larger, the removal depth for the recovery of strength requires a larger size.

• 산업경영시스템학회지
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• 제21권45호
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• pp.201-213
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• 1998

We address the problem of choosing the most economic mean value for an automatic filling operation on a production line through the sampling inspection. If quality characteristic of a unit is less than inspection specification then the goods is not accepted. Otherwise, it is accepted. The lots that the numbers of non-conforming units in a sample are larger than the allowable number of non-conforming units are rejected. The non-conforming units in the rejected lots are separated by the screening inspection. The non-conforming units separated are sold in discount price. We assume that quality characteristic is larger-the-better characteristic, the distribution of quality characteristic is normal distribution, and the standard deviation of the distribution is known. This paper presents total expected profit function model considering sales revenue, inspection costs, and material costs. The manufacturing process mean value maximizing total expected profit is determined, and the results of the process target value and total expected profit is analyzed as coefficients change.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제48권7호
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• pp.542-549
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• 1999

Corona discharges form at the surface of a transmission line conductor when the electric-field intensity on the conductor surface exceeds the breakdown strength of air. In order to decrease the electric-field intensity on the conductor surface, a new 6 conductor bundle has been studied. This bundle, hybrid conductor bundle, consists of using a larger subconductor at the bottom two conductor positions in the 6-conductor bundles of each phase of the line. The electric field on these two larger subconductors is reduced which in turn reduces the corona noise. It is shown that this is a better solution for decreasing the electric-field intensity than ether the conventional bundle or the asymmetric bundle proposed by EPRI.

• 한국정밀공학회지
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• 제20권10호
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• pp.56-64
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• 2003

The effect of tool geometry on the tool wear in turning the austenitic stainless steel, STS 304 was investigated. The wear of TiN-TiCN-TiC-TiAlN coated tungsten carbide tool was the smallest, showing larger wear in the order of Si-Al-O-N ceramic, TiN coated tungsten carbide, TiN- TiCN- TiN coated tungsten carbide, TiC-TiN cermet and M20 tungsten carbide tools at the same cutting conditions. The S-type tool of M20 with the larger side cutting edge angle showed the smallest tool wear in all tests due to preventing the groove wear of the side cutting edge. The wear of the S-type tool with the rake angle of $15^{\circ}$ became smaller than with that of $-5^{\circ}$, but the tool with the nose radius of 0.8mm did not perform much better with increasing the rake angle.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2000년도 추계종합학술대회 논문집(2)
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• pp.241-244
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• 2000

To investigate the compact effect of the different area of an active layer and the different type of heatsink on the junction to ambient transient thermal impedance, we have characterized the thermal behavior of power MOSFETs that have three different areas of an active layer and two types of heatsink. To do so, the "cooling curve method" has been used in order to measure the junction-to-ambient transient thermal impedance Zthja that represents the thermal behavior of the devices. The measured data depiets that the larger area of an active layer gives the better-in other words. smaller-thermal impedance, and that the larger size of a heatsink improves the thermal impedance.

• 대한산업공학회지
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• 제23권3호
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• pp.515-532
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• 1997

When balancing mixed model assembly lines (MMALs), workload smoothness should be considered on the model-by-model basis as well as on the station-by-station basis. This is because although station-by-station assignments may provide the equality of workload to workers, it causes the utilization of assembly lines to be inefficient due to the model sequences. This paper presents a genetic algorithm to improve the workload smoothness on both the station-by-station and the model-by-model basis in balancing MMALs. Proposed is a function by which the two kinds of workloads smoothness can be evaluated according to the various preferences of line managers. To enhance the capability of searching good solutions, our genetic algorithm puts emphasis on the utilization of problem-specific information and heuristics in the design of representation scheme and genetic operators. Experimental results show that our algorithm can provide better solutions than existing heuristics. In particular, our algorithm is outstanding on the problems with a larger number of stations or a larger number of tasks.