• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 추계학술대회 논문집
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• pp.40-40
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• 2009

The electrical characteristic of the conventional self-aligned polycrystalline silicon (poly-Si) TFTs are known to present several undesired effects such as large leakage current, kink effect and hot-carrier effects. In this paper, LTPS TFTs with different GOLDD length were fabricated and investigated the effect of the GOLDD. GOLDD length of 1, 1.5 and $2{\mu}m$ were used, while the thickness of the gate dielectrics($SiN_x/SiO_2$) was fixed at 65nm(40nm/25nm). The electrical characteristics show that the kink effect is reduced at the LTPS TFTs, and degradation from the hot-carrier effect was also decreased by increasing GOLDD length.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2008년도 International Meeting on Information Display
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• pp.903-906
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• 2008

We developed the advanced LTPS (A-LTPS) manufacturing process. The a-Si TFT process was combined with selectively enlarging laser crystallization (SELAX) technology to improve the carrier mobility in the region where the peripheral circuits are to be fabricated. A 2.4-inch IPS-pro LCD panel for personal digital assistant use was successfully fabricated using the developed technology.

• Journal of Information Display
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• 제6권4호
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• pp.6-10
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• 2005

The dependence of hysteresis characteristics in low temperature poly-Si (LTPS) thin film transistors (TFTs) on the gate-source voltage (Vgs) or the drain-source voltage (Vds) bias is investigated and discussed. The hysteresis levels in both p-type and n-type LTPS TFTs are independent of Vds bias but increase as the sweep range of Vgs increases. It has been found that the hysteresis in both p-type and n-type LTPS TFTs originated from charge trapping and de-trapping in the channel region rather than at the source/drain edges.

• Journal of Information Display
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• 제10권1호
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• pp.33-36
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• 2009

A new hybrid silicon thin-film transistor (TFT) fabrication process using the DPSS laser crystallization technique was developed in this study to realize low-temperature poly-Si (LTPS) and a-Si:H TFTs on the same substrate as a backplane of the active-matrix liquid crystal flat-panel display (AMLCD). LTPS TFTs were integrated into the peripheral area of the activematrix LCD panel for the gate driver circuit, and a-Si:H TFTs were used as a switching device of the pixel electrode in the active area. The technology was developed based on the current a-Si:H TFT fabrication process in the bottom-gate, back-channel etch-type configuration. The ion-doping and activation processes, which are required in the conventional LTPS technology, were thus not introduced, and the field effect mobility values of $4\sim5cm^2/V{\cdot}s$ and $0.5cm^2/V{\cdot}s$ for the LTPS and a-Si:H TFTs, respectively, were obtained. The application of this technology was demonstrated on the 14.1" WXGA+(1440$\times$900) AMLCD panel, and a smaller area, lower power consumption, higher reliability, and lower photosensitivity were realized in the gate driver circuit that was fabricated in this process compared with the a-Si:H TFT gate driver integration circuit

• Journal of Information Display
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• 제4권4호
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• pp.1-3
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• 2003

For excimer laser annealing (ELA), energy density, number of pulses, beam uniformity, and condition of initial amorphous Si (a-Si) films are significant factors contributing to the final microstructure and the performance of low-temperature polycrystalline Si (LTPS) TFTs. Although the process and equipment have been significantly improved, the environmental factors associated with initial amorphous Si (a-Si) films and process conditions are yet to be optimized.

• Journal of Information Display
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• 제8권1호
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• pp.1-5
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• 2007

We have developed a CMOS LTPS process which requires only five photolithographic masks and only one ion doping step. Drain/Source areas of NMOS TFTs were formed by PECVD deposition of a highly doped precursor layer while PMOS contact areas were defined by ion implantation. Single TFTs, inverters, ring oscillators and shift registers were fabricated. N and p-channel devices reached field effect mobilities of $173cm^2$/Vs and $47cm^2$/Vs, respectively.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2004년도 Asia Display / IMID 04
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• pp.309-314
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• 2004

Static and transient behaviour of Low Temperature Poly-Si TFTs (LTPS-TFTs) and Single Grain TFTs (SG- TFTs) are compared 3-D simulation is applied here for the first time to TFTs to account for the structure and twin boundaries in SG-TFTs.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2004년도 Asia Display / IMID 04
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• pp.85-88
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• 2004

2-inch qVGA (240${\times}$320) TFT-LCD with integrated 6-bit source driver is reported. The pixel density is over than 200ppi and the operation frequency is about 2.8MHz. In order to improve TFT characteristics, TS-SLS (Two-Shot Sequential Lateral Solidification) technology has been employed. A 1:6 demultiplexing scheme has been successfully implemented in the source driver owing to the superb characteristics of the TS-SLS TFTs, which resulted in small driver circuit area.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2007년도 7th International Meeting on Information Display 제7권2호
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• pp.1277-1280
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• 2007

Isothermal activation annealing was carried out using boron doped SLS poly-using an RTA system. We observed different behavior of reverse annealing depending on the implantation conditions.

• 대한전자공학회논문지SD
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• 제46권4호
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• pp.45-52
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• 2009

본 연구를 통해서 대 면적, 고 휘도 AMOLED 응용에 적합한 화소 회로와 이에 대한 구동 방식을 제안하였다. 균일도는 다소 떨어지지만 안정성이 뛰어난 저온 다결정 실리론(LTPS) 박막 트랜지스터(TFT)를 기반으로 설계했다. 영상 화소의 균일도를 향상시키기 위해, 화소 TFT의 $V_{TH}$와 이동도 편차를 함께 보상할 수 있도록 했다. 기존의 이동도 보상 회로가 갖는 문제점을 극복하여 대 면적 패널에 적합하도록 했고, 동영상 특성을 개선하기 위해 black data insertion 방식을 도입하였다. 이동도 보상 시 휘도가 떨어지는 문제를 개선하기 위해, 패널이 두 가지 보상 모드에서 동작할 수 있도록 하였다. 화소 회로를 제어하기 위한 스캔 구동 회로를 최적화하여, 이를 통해서 보정 모드를 쉽게 제어할 수 있었다. 최종 구동 타이밍은 여유 있는 마진으로 안정적인 동작이 가능하다. 14.1" WXGA top emission AMOLED 패널에 대해 설계했으며, 이동도 보상 시간을 1us로 했을 때 패널의 불균일도는 5% 이하로 예측되었다.