• Journal of Sensor Science and Technology
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• v.9 no.5
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• pp.380-388
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• 2000

The finite element analysis of a micro turbine was made to investigate safety margin of its operating condition for the high aspect ratio nickel micro turbine blades fabricated by conventional LIGA-like method. From our study, we found that the fabricated turbine could not exceed its yield strength even if the pressure difference between inlet and outlet of turbine blade was about 44kPa, and the correlation of friction coefficient and the maximum stress, caused by contact friction between outer diameter of shaft and inner diameter of turbine blade, was somewhat reciprocal. The maximum stress was decreased with the increasing contact friction, when turbine blade was in its state of rotation. By the results of our study, we conclude that it is possible to fabricate metal micro turbine more easily han surface micromachining technology and to operate with no risk of metal structure's damage, which is caused by yield strength, if the operating condition with the design of micro turbine itself are optimized. It is useful to adopt other applications which have the contact problems between a moving part and the fixed one in micro structures.

• Korean Journal of Materials Research
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• v.13 no.1
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• pp.6-10
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• 2003

Electroplated Ni and Ni-W micro-molds using LIGA-like process for replication of micro-components such as microfluidic parts and micro optical parts have been investigated. In general, it is hard to produce micro-parts using conventional mechanical processes. Micro-mold formed by LIGA-like process could fabricate micro-parts with high aspect ratio. In this paper, fabrication and properties of electroplated Ni molds with varying applied current types as well as those of Ni-W molds were investigated. Ni molds fabricated under pulse-reverse current showed the highest hardness value of about 160 Hv. Ni-W molds showed the hardness of about 500 Hv which was much harder than that of Ni electroplated molds. The above results suggested that high quality micro-molds could be fabricated by using Ni electroplating of pulse-reverse type for core molds and sequential Ni-W alloys coating.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.14 no.4
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• pp.1-7
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• 2015

In the present study, copper micromolds with a microhole array were precisely manufactured by a synchrotron LIGA process. Like in the traditional LIGA process, a deep X-ray lithography based on a synchrotron radiation was employed as the first manufacturing step. Due to the excellent optical performance of the synchrotron X-ray used, cylindrical micropillar arrays with high aspect ratio could be efficiently obtained. The fabricated microfeatures were then used as a master of the subsequent copper electroforming process, thereby resulting in copper micromolds with a microhole array. Thermoplastic hot embossing experiments with the copper micromolds were carried out for imprinting cylindrical microfeatures onto a polystyrene sheet. Through the hot embossing, the effect of embossing temperature and usefulness of the present manufacturing method could be verified.

• Journal of the Korean Society for Precision Engineering
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• v.17 no.8
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• pp.172-179
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• 2000

In this paper a technology for the fabrication of the oblique structure using the LIGA process will be presented. The fabricated microstructure is a tetrahedral 3- facet mirror. The mirror has an equilateral triangular base of hundreds ${\mu}m$ length mirror-like three side-facets inclined to the base at 45$^{\circ}$ and knife edges. Two regular triangles of 45$^{\circ}$ and tan-12. After development the shaded part of the PMMA the tetrahedral mirror remains, The completed mirror shows excellent aspects of mirror-like facets and knife-edges. By controlling the gap between the mask and the substrate the size of mirror easily can be changed. This mirror would be used as a laser beam splitter for the feedback control of the HDD slider.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.13 no.2
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• pp.68-72
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• 2003

In this paper, we developed a new thick photoresist fabrication technology for 3-dimensional microstructures. In general, like as AZ photoresist was coated with thin film thickness about 1 $\mu\textrm{m}$ to 30 $\mu\textrm{m}$, but photoresist like SU-8 has thickness of several tens $\mu\textrm{m}$ or more and high aspect ratio. When we fabricate a microstructure using the thick photoresist like SU-8, cracks on the SU-8 thick photoresist are appeared by stress which was caused by sudden cooling down during bake of the thick photoresist spun on wafer. Thus, it was hard to fabricate the microstructure using the thick photoresist for electroplating. In this paper, we developed a new process to produce a 3-dimensional microstructure without the crack by stress through a suitable thick photoresist coating, time control of cool down and time control of PEB (Post Expose Bake).

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.10a
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• pp.1061-1064
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• 1997

Micro injection molding technology is very important fiw mass product of micro structures or micro parts. And, it is so difficult that the molding technology of micro pole or thin wall(barrier rib) structures with high aspect ratio. In this stud). \vc intend to research on the basic technology of micro wall structure part:< with high aspect ratio by the inject~on moldins method. The mold for esperimenrs with micro multi-square structures was made by L, I(;A process. One square polc's size is 157 157pm. height 50011111. And the distance of each poles is 5011n1. 7'hus. molding products will be for~nctl like as the net structure with thin wall of about 50pn thickness.(aspect ratio 10) Ihrough the e~lxriment. \be obtained the prociuctr of micro multi-square slructure with bout 37.000 cell per a piece. 'Ihe micro injection molding process technolog for thin wall by multi-square structure mold was analy~cd.

• Proceedings of the KIEE Conference
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• 1994.11a
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• pp.422-424
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• 1994

A comb drive electrostatic micro gripper was designed and fabricated. We designed it analytically using electrostatic force and cantilever deflection equation. In fabrication, we used LIGA-like technology consisted of Ni electroplating through polyimide patterned by $O_2$ Plasma RIE and Al sacrificial layer. This micro gripper was designed to handle an optical fiber which is $125{\mu}m$ in diameter.

• Proceedings of the KIEE Conference
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• 1995.11a
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• pp.600-602
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• 1995

Using the $O_2$ RIE process, 20{\mu}m$-height polyimide microstructures are fabricated. In LIGA-like process, metal microstructure can be formed by the electroplating using these polyimide microstructures as a plating mould. Reactive ion Etching technique using oxygen gas is used for the patterning of polyimide. The etching rate of the polyimide is increased with increased pressure and RF power. The anisotropic vertical sidewall can be obtained at low pressure, but the etched surface state is not so good yet. "Micrograss", which is formed during the RIE and disturbs uniform electroplating, can be removed effectively by the wet itching of the chromium sacrificial layer. More studies about the improvement of an etched surface state and the removal of microsgrass are needed.

• Proceedings of the KIEE Conference
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• 2000.11c
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• pp.581-582
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• 2000

본 논문에서는 적외선과 같이 주파수가 Tera Hz 영역인 극초고주파에서 사용할 수 있는 Horn형 안테나의 제조를 위한 독창적인 방법을 제시하고 실험적인 검증을 하였다. 파장이 $10{\mu}m$ 부근인 전자기파에 대응될 수 있는 안테나의 구조에 대한 시뮬레이션을 하였으며 이를 기준으로 안테나 어레이를 제조하기 위한 기초실험을 하였다. 기존에 사용되던 LIGA-like 공정과는 대조적으로 Columnar illumination 방법을 사용하였으며 $300{\mu}m$ 두께의 SU-8에 대하여 수직벽을 제조할 수 있었고 기판 위치에 일정한 각도를 줌으로서 경사면을 갖는 구조를 제조하였으며 기판을 회전시킴으로서 원뿔형의 Horn형 안테나 어레이를 제조할 수 있는 방안을 제시하였다.

• Design & Manufacturing
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• v.2 no.2
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• pp.25-28
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• 2008

Micro fabrication of biochip such like lab-on-a-chip becomes increasingly important. In this study, we designed and manufactured of new molds which were main factors for forming process in order to mass produce of biochip using forming process. Forming analysis of biochip was performed by Moldflow software. Results of this study are able to design and manufacture the mold which can be easy to eject the workpiece by using the slide mechanism for biochip.