• 설비공학논문집
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• 제16권12호
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• pp.1107-1116
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• 2004

In this paper, the effects of diverse parameters on the operation of loop heat pipe (LHP), such as particle diameter of sintered porous wick, wick porosity, vapor line diameter, thickness of wick and heating capacity were investigated by a theoretical analysis. A LHP has a wick only in its evaporator for the circulation of working fluid, and utilizes a porous wick structure of which pore size is very small to obtain a large capillary force. The working fluid is water and the material of sintered porous wick is copper. For these different parameters, capillary pressure, pressure drop in wick, pressure drops and temperature distribution were analyzed by a theoretical design method of LHP.

• 대한설비공학회:학술대회논문집
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• 대한설비공학회 2006년도 동계학술발표대회 논문집
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• pp.43-43
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• 2006

• 대한기계학회논문집B
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• 제31권10호
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• pp.823-831
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• 2007

This paper presents the experimental and simulation study of a loop heat pipe (LHP) that can be applied to present electronics, space missions and thermal control systems. The present experimental study was carried out employing sintered alumina ceramic wick ($d=2.96\;{\mu}m$, ${\phi}=0.61$). High purity R-134a, R-22 and water were also used as alternative working fluids in addition to ammonia. The experimental study showed that the maximum heat transfer performance for the test LHP in the vertical top heating mode was over 100 Watts when ammonia was used as the working fluid. The simulation results have been compared with the experimental results to validate a simulation model based on the thermal resistance network that was developed to evaluate the performance of LHPs, focusing on their prospective applications in electronics. The simulation model is based on the loop overall energy, mass, and momentum balance. The simulation program can predict the effects of various parameters which affect the performance of LHP within 5% compared with the experimental results.

• 대한설비공학회:학술대회논문집
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• 대한설비공학회 2008년도 동계학술발표대회 논문집
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• pp.175-180
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• 2008

This paper is dedicated to the development of cooling devices such as mLHP with Fan-Fin system limited by noise and vibration. As we know, Heat pipe has the limitation of cooling capability to cool down the electronics. It is bounded by capillary and thermal limitation but heat load that it has to deal with is increasing. Especially Today's electronic technology has a tendency to integrate lots of function into the small piece of a processor like Dual core having 35W heat load for mobile and desktop computer respectively. There is an optimum operating condition of temperature, below $70^{\circ}C$, during the maximum heat load, 35W. There is the motivation needed to develop the new type of cooling devices and we can discuss about the new challenge beyond heat pipe.

• 전자공학회논문지S
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• 제34S권6호
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• pp.85-93
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• 1997

This paper analyzes the steady-state and dynamic characteristics of the watkings-johnson converter. the major contributions of this paper includ identification of the following characteristics unique to the watkins-johnson converter: (1) The output voltage of the converter is nearly constant at the continous conduction mode (CCM), and at discontinousou conduction mode (DCM) it decreses linerly as the output curretn increases. (2) The control-to-output transfer function is a second-order one with a left-half-plane (LHP) zero determined by the combination of the output capacitor and equivalent series resistor of the converter. This LHP zero signinificantly improves the stability of the converter. (3) The control-to-output transfer function reduces to a first-order one, as the converter moves from CCM to DCM. (4) The parastic resistance of the inductor does not cause any significant influence on poles and zeros of the transfer function.

• Transactions on Control, Automation and Systems Engineering
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• 제4권4호
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• pp.283-288
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• 2002

This paper has shown that the impulse and the unit step responses of 2nd-order systems can be computed by an analytic method. Three different 2nd-order systems are investigated: the prototype system, the system with one LHP(left half plane) real zero and the system with one RHP(right half plane) real zero. It has also shown that the effects of the LHP or the RHP zero are very serious when the zero is getting closer to the origin on the complex plane. Based on these analytic results, this paper has presented two sufficient and necessary conditions for 2nd-order linear SISO(single-input/single-output) stable systems to have the nonovershooting and the monotone nondecreasing step response, respectively. The latter condition can be extended to the sufficient conditions for the monotone nondecreasing step response of high-order systems.

• Safety and Health at Work
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• 제2권2호
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• pp.122-134
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• 2011

Objectives: Seven cases of malignant lymphohematopoietic (LHP) disorder were claimed to have developed from occupational exposure at two plants of a semiconductor company from 2007 to 2010. This study evaluated the possibility of exposure to carcinogenic agents for the cases. Methods: Clinical courses were reviewed with assessing possible exposure to carcinogenic agents related to LHP cancers. Chemicals used at six major semiconductor companies in Korea were reviewed. Airborne monitoring for chemicals, including benzene, was conducted and the ionizing radiation dose was measured from 2008 to 2010. Results: The latency of seven cases (five leukemiae, a Non-Hodgkin's lymphoma, and an aplastic anemia) ranged from 16 months to 15 years and 5 months. Most chemical measurements were at levels of less than 10% of the Korean Occupational Exposure Limit value. No carcinogens related to LHP cancers were used or detected. Complete-shielded radiation-generating devices were used, but the ionizing radiation doses were 0.20-0.22 uSv/hr (background level: 0.21 ${\mu}Sv/hr$). Airborne benzene was detected at 0.31 ppb when the detection limit was lowered as low as possible. Ethylene oxide and formaldehyde were not found in the cases' processes, while these two were determined to be among the 263 chemicals in the list that was used at the six semiconductor companies at levels lower than 0.1%. Exposures occurring before 2002 could not be assessed because of the lack of information. Conclusion: Considering the possibility of exposure to carcinogenic agents, we could not find any convincing evidence for occupational exposure in all investigated cases. However, further study is needed because the semiconductor industry is a newly developing one.

• Safety and Health at Work
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• 제10권3호
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• pp.347-354
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• 2019

Background: The aim of this study was to describe the types of diseases that developed in semiconductor workers who have registered with the Korea Workers' Compensation and Welfare Service (KWCWS) and to identify potential common occupational characteristics by the type of claimed disease. Methods: A total of 55 semiconductor workers with cancer or rare diseases who claimed to the KWCWS were compared based on their work characteristics and types of claimed diseases. Leukemia, non-Hodgkin lymphoma, and aplastic anemia were grouped into lymphohematopoietic (LHP) disorder. Results: Leukemia (n = 14) and breast cancer (n = 10) were the most common complaints, followed by brain cancer (n = 6), aplastic anemia (n = 6), and non-Hodgkin lymphoma (n = 4). LHP disorders (n = 24) accounted for 43%. Sixty percent (n = 33) of registered workers (n = 55) were found to have been employed before 2000. Seventy-six percent (n = 42) of registered workers and 79% (n = 19) among the registered workers with LHP (n = 24) were found to be diagnosed at a relatively young age, ${\leq}40years$. A total of 18 workers among the registered semiconductor workers were finally determined to deserve compensation for occupational disease by either the KWCWS (n = 10) or the administrative court (n = 8). Eleven fabrication workers who were compensated responded as having handled wafers smaller than eight inches in size. Eight among the 18 workers compensated (44 %) were found to have ever worked at etching operations. Conclusion: The distribution of cancer and rare diseases among registered semiconductor workers was closely related to the manufacturing era before 2005, ${\leq}8$ inches of wafer size handled, exposure to clean rooms of fabrication and chip assembly operations, and etching operations.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2004년도 추계학술대회
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• pp.1052-1057
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• 2004

A small-scale loop heat pipe with polypropylene wick was fabricated and tested for its thermal performance. The container and tubing of the system was made of stainless steel and several working fluids were used to see the difference in performance including methanol, ethanol, acetone, R134a, and water. The heating area was 35 mm ${\times}$ 35 mm and there were nine axial grooves in the evaporator to provide a vapor passage. The pore size of the polypropylene wick inside the evaporator was varied from 0.5 m to 25 m. The size of condenser was 40 mm (W) ${\times}$ 50 mm (L) in which ten coolant paths were provided. The inner diameter of liquid and vapor transport lines were 2.0 mm and 4.0 mm, respectively and the length of which were 0.5 m. The PP wick LHP was operated with methanol, acetone, and ethanol normally. R134a was not compatible with PP wick and water was unsuitable within operating limit of $100^{\circ}C$. The minimum thermal load of 10 W (0.8 W/cm2) and maximum thermal load of 80 W (6.5 W/cm2) were achieved using methanol as working fluid with the condenser temperature of $20^{\circ}C$ with horizontal position.

• 한국철도학회:학술대회논문집
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• 한국철도학회 2008년도 추계학술대회 논문집
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• pp.422-429
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• 2008

The objective of the present study is to develope a propultion unit cooling system for the next-generation High-speed EMU. The propulsion power control unit consists of some IGBT semiconductors. In general, those power semiconductors are very sensitive to temperatures and need a cooling system to keep them at a proper operational conditions in the range of $50{\sim}100^{\circ}C$. In this first year of study, we tried to focuss on the understanding of fundamental technologies for each of the two different cooling systems and collecting basic data for design and manufacturing for both cases. For the water cooling system, a heat sink with multi channels of liquid flow was considered and a model unit was designed and performance test was conducted. For the heat pipe cooling system, a Loop Heat Pipe(LHP) was considered as an element to transport heat from IGBT to environment air flow and a model unit was designed and performance test was conducted. The analysis using SINDA/FLUINT showed that those design parameters are good enough for the LHP to properly operate under a heat load up to around 360W.