• Journal of the Microelectronics and Packaging Society
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• v.21 no.1
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• pp.1-6
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• 2014

Flip chip bonded LED packages possess lower thermal resistance than wire bonded LED packages because of short thermal path. In this study, thermal and bonding properties of flip chip bonded high brightness LED were evaluated for Au-Sn thermo-compression bonded LEDs and Sn-Ag-Cu reflow bonded LEDs. For the Au-Sn thermo-compression bonding, bonding pressure and bonding temperature were 50 N and 300oC, respectively. For the SAC solder reflow bonding, peak temperature was $255^{\circ}C$ for 30 sec. The shear strength of the Au-Sn thermo-compression joint was $3508.5gf/mm^2$ and that of the SAC reflow joint was 5798.5 gf/mm. After the shear test, the fracture occurred at the isolation layer in the LED chip for both Au-Sn and SAC joints. Thermal resistance of Au-Sn sample was lower than that of SAC bonded sample due to the void formation in the SAC solder.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.30 no.7
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• pp.463-468
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• 2017

Eight types of LED packages were manufactured according to the type and composition ratio of phosphors by using commercially available white LED phosphors. CRI (Ra), a conventional color quality evaluation method was evaluated by using manufactured white LED; the Rf, Rg, color vector graphic, and color distortion graphic were evaluated with a new method, IES TM-30-15. The results of the evaluation confirmed that the new method compensated for the disadvantages of CRI, which was found to be inadequate when the color was saturated. The added evaluation index identified the chroma variation and color change. Furthermore, the study showed that the changes of Rf and Rg are small when controlling phosphors based on CRI, questioningthe necessity of identifyingchroma variation and color change.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.29 no.4
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• pp.1-10
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• 2015

The light emitting diodes(LED) package of new structure is proposed to promote the reliability and lifespan by maximize heat dissipation occurred on the chip. We designed and fabricated the LED packages mixing the advantages of chip on board(COB) based on conventional metal printed circuit board(PCB) and the merits of Si sub-mount using base as a substrate. The proposed LED package samples were selected for the superior efficiency of the material through the sealant properties, chip characteristics, and phosphor properties evaluations. Reliability test was conducted the thermal shock test and flux rate according to the usage time at room temperature, high-temperature operation, high-temperature operation, high-temperature storage, low-temperature storage, high-temperature and high-humidity storage. Reliability test result, the average flux rate was maintained at 97.04% for each items. Thus, the Si sub-mount based LED package is expected to be applicable to high power down-light type LED light sources.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.15 no.6
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• pp.70-76
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• 2016

Commercialization of surface lighting using Light Emitting Diodes (LED) has embraced the advance to Organic Light Emitting Diode (OLED) technology. This is necessary to achieve light-efficiency-improvement and longer component life. The range of application of LED lighting for both interior and outdoor lights has been gradually expanding. Automobiles and home appliances are now included. In the case of LED surface lighting in a domestic refrigerator, achieving high efficiency requires optimization of the number of LEDs in a pack. Optimization is also required in the design stage of development with regard to the conversion of the light source type from point light sources to the surface light type. This paper addresses these design problems. It presents a study of brightness variations for design solutions that differ from the existing technology in both the number of LED packages and use of Light Gathering Power (LGP) information. The intention is to facilitate production of high brightness LED surface lighting for domestic refrigerators.

• Journal of the Korean Society of Fisheries and Ocean Technology
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• v.51 no.2
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• pp.163-170
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• 2015

Recently LED fish-attracting lamps have been more widely used in fisheries as low-cost and high-efficiency fishing gear, and development of long-life high-efficiency lamps is required through the design of LED packages to optimize heat resistance. This study developed an improved LED fish-attracting lamp with excellent heat performance, which was verified using a numerical model. Heat-resistance design factors such as the heat-radiation fin shape, PCB type, and LED chip count were investigated and optimized. Comparison with a commercial 180-W LED fishing lamp showed that the increase in initial temperature was 40% higher than that of the surrounding LED chip because of design errors in contact thermal resistance. The 250-W LED lamp developed in this study has a characteristic with thermal rising in linearly stable according to the heat source. In addition, luminance efficiency was improved by 20-65% by using flow-visualization simulation. A decrease of 45% in total power consumption with a fuel-cost reduction of over 55% can be expected when using these optimized heat release design factors.

• Journal of Fashion Business
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• v.27 no.2
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• pp.108-123
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• 2023

Recent increase of eco-conscious trends and pleasure from Do It Yourself (DIY) activities have led to a surge in sales of package products bundling together clothing patterns and raw materials. However, a well-structured market system is yet to be established. We surveyed 460 women with sewing as a hobby who had purchased these DIY clothing pattern packages. The survey revealed that majority of respondents had their hobby for over five years. Choosing the right fabric to match clothing patterns presented a common challenge. Most participants owned a sewing machine and an overlocker, with price being the primary concern when purchasing a package. For guidance during the sewing process, participants preferred print materials featuring real-life images. Those with less sewing experience leaned towards video tutorials. Items of interest or those commonly created included blouses, shirts, and dresses. Desire for further learning in sewing and pattern-making was prominent, with a clear preference for online classes. Several strategies are recommended to enhance the appeal of DIY clothing package products, including broadening range of packages that incorporate fabric, offering supplementary educational resources to improve users' skills, implementing affordable pricing structures, supplying comprehensive creation guidelines, and making available design modification guides. These considerations could significantly boost customer satisfaction. This research intends to lay groundwork for understanding DIY clothing creation market, ultimately fostering production of highly desirable products. Insights of this study will prove instrumental in refining product development and devising effective marketing tactics, leading to a more rewarding consumer experience.

• International Journal of Internet, Broadcasting and Communication
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• v.7 no.2
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• pp.161-167
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• 2015

The performance of high power LEDs highly depends on the junction temperature. Operating at high junction temperature causes elevation of the overall thermal resistance which causes degradation of light intensity and lifetime. Thus, appropriate thermal management is critical for LED packaging. The main goal of this research is to improve thermal resistance by optimizing and comparing nano-pore silicon-based thermal substrate to insulated metal substrate and direct bonded copper thermal substrate. The thermal resistance of the packages are evaluated using computation fluid dynamic approach for 1 W single chip LED module.

• Journal of the Optical Society of Korea
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• v.18 no.4
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• pp.370-376
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• 2014

We optimized the design of the flat encapsulant of a light-emitting diode (LED) package to obtain higher light output power (LOP), both by experiment and simulation using three-dimensional ray-tracing software. In the experiment, the refractive index of the encapsulant was varied (1.41 and 1.53). In addition, double-layer structures with these refractive indices (1.41/1.53) were investigated by varying the shape of the interface between the two among flat, concave, and convex. The experiments showed that the LOP of the double-layer encapsulant with convex interface increased by 13.4% compared to the single-layer encapsulant with a refractive index 1.41, which was explained by the increase of the light extraction efficiency (LEE) in connection with the increase of the critical angle (${\theta}_c$) and the decrease of the Fresnel reflection.

• Advances in aircraft and spacecraft science
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• v.10 no.6
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• pp.545-554
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• 2023

The widespread introduction of unmanned aircrafts has led to the understanding of the need to organize a common information space for manned and unmanned aircrafts, which is reflected in the Russian Unmanned aircraft system Traffic Management (RUTM) project. The present article deals with the issues of spatial information database (DB) organization, which is the core of RUTM and provides storage of various data types (spatial, aeronautical, topographical, meteorological, vector, etc.) required for flight safety management. Based on the analysis of functional capabilities and types of work which it needs to ensure, the architecture of spatial information DB, including the base of source information, base of display settings, base of vector objects, base of tile packages and also a number of special software packages was proposed. The issues of organization of these DB, types and formats of data and ways of their display are considered in detail. Based on the analysis it was concluded that the optimal construction of the spatial DB for RUTM system requires a combination of different model variants and ways of organizing data structures.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.29 no.6
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• pp.27-34
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• 2015

There has been a critical issue in optical simulation of phosphors in LEDs due to their light-reabsorption properties. To improve the accuracy of optical modeling for a white LED package, we utilized the spectrum data of the phosphor-dispersed encapsulant film instead of the phosphor powder. By measuring white LED packages with green and red phosphors, the maximum difference between simulation and experimental results of a color temperature, a color rendition index number and a color coordinate corresponds to ${\Delta}T=95K$, ${\Delta}Ra=1.7$ and ${\Delta}xy=0.007$, respectively. Based on those results, the proposed method can well explain the change of emission spectra of white LEDs with more than two phosphors which introduce the complex optical phenomena such as absorption, reabsorption, light emission, reflection and scattering, etc.