• 한국광학회지
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• 제22권3호
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• pp.141-150
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• 2011

현재까지 더 좋은 성능의 LED 램프 패키지 구조의 개발을 위해 많은 연구가 진행되어 왔음에도 불구하고 아직 LED 램프 패키지 설계에 관한 표준화된 이론이나 지침 같은 것들이 마련되지 못한 것으로 판단된다. 이에 본 논문에서는 먼저 Monte Carlo photon simulation 기법을 이용하여 InGaN/Sapphire LED의 칩 구조 및 Epi-up 혹은 Epi-down 칩 부착 방식을 광추출효율 관점에서 분석하였다. 그리고 분석결과를 바탕으로 LED 램프 패키지 설계에 관한 기본 지침을 마련하였다. 이와 같이 마련된 설계지침은 관련 기업이나 연구기관에서, LED 램프의 구체적 응용분야에 따라 최적화된 패키지 구조를 설계하는 데에 중요하게 활용될 수 있을 것으로 기대된다.

• Journal of the Optical Society of Korea
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• 제17권6호
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• pp.506-512
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• 2013

Recently, the color separation issue of wide-spreading white LEDs has attracted attention due to their wide applicability as light sources in direct-lit LCD backlights. These wide-spreading LED packages usually consist of LED chips, a color-conversion phosphor layer, and a light-shaping lens. The technical aspect of this color issue was related to a method for balancing the yellow spectral component emitting from phosphors with respect to the blue one from the LED chip as a function of viewing angle. In this study, we suggested an approach for carrying out quantitative analysis for the color separation problem occurring in wide-spreading LED packages by optical simulation. In addition, the effect of an internal scattering layer on the color uniformity was investigated, which may be considered as a potential solution for this problem.

• 반도체디스플레이기술학회지
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• 제10권1호
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• pp.17-22
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• 2011

LEDs(Light Emitting Diodes) are becoming widely used and increasingly in demand. Quality inspection of the LEDs has become more important. Two-dimensional inspection systems are limited in inspection capability, so threedimensional(3-D) inspection systems are needed. In this paper, a cost-effective and simple 3-D measurement system of LED packages using phase measuring profilometry(PMP) is proposed. The proposed system uses a pico projector to project sinusoidal fringe patterns and to shift phases instead of piezocrystal. It was evaluated using extremely accurate gauge blocks, yielding excellent repeatability of about 12 um(3-sigma). 3-D measurements of various LED packages were performed to demonstrate the applicability and efficiency of the proposed system.

• 대한금속재료학회지
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• 제50권1호
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• pp.71-77
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• 2012

We studied the effect of heat treatment on the microstructures and mechanical strength of the solder joints in the Light Emitting Diode (LED) packages. The commercial LED packages were mounted on the a flame resistance-4 (FR4) Printed Circuit Board (PCB) in the reflow process, and then the joints were aged at $125^{\circ}C$ for 100, 200, 300, 500 and 1000 hours, respectively. After the heat treatment, we measured the shear strength of the solder joints between the PCB and the LED packages to evaluate their mechanical property. We used Pb-free Sn-3.0Ag-0.5Cu solder to bond between the LED packages and the PCBs using two different surface finishes, Electroless Nickel-Immersion Gold (ENIG) and Electroless Nickel-Electroless Palladium-Immersion Gold (ENEPIG). The microstructure of the solder joints was observed by a scanning electron microscope (SEM). (Cu,Ni)6Sn5 intermetallic compounds (IMCs) formed between the solder and the PCB, and the thickness of the IMCs was increased with increasing aging time. The shear strength for the ENIG finished LED package increased until aging for 300 h and then decreased with increasing aging time. On the other hand, in the case of an ENEPIG finished LED package, the shear strength decreased after aging for 500 h.

• 대한기계학회논문집B
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• 제35권6호
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• pp.569-575
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• 2011

LED 조명기기의 경우 칩의 고밀도 발열로 인한 심각한 수명감소 및 광효율 저하, 색온도 변이의 문제점 등이 야기되므로 이를 해결하기 위해 주로 LED 패키지나 방열케이스를 최적화하는 연구가 이루어져 왔다. 최근들어 고출력 자동차 헤드램프나 가로등도 LED로 대체되어 가고 있는데 자연대류식 방열로는 그다지 효과적이지 않다. 따라서 본 연구에서는 고출력 조명기기 방열 성능 최적화에 강제대류를 이용한 히트파이프 사용의 타당성을 알아보았다. 또한, 팬의 수명이 LED 수명에 비해 일반적으로 낮으므로 이를 보완하기 위한 최적화된 팬의 정지-작동 제어가 팬 수명 증가에 미치는 영향도 고찰하였다.

• 품질경영학회지
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• 제50권3호
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• pp.425-440
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• 2022

Purpose: The purpose of this paper is to improve the chromaticity coordinate quality of white LED packages for automobiles that require high quality and reliability. Methods: The project follows the structured methodology of the Six Sigma DMAIC Roadmap, which consists of Define, Measure, Analyze, Improve and Control phases. Results: A CTQ is determined based on COPQ analysis, and a process map and a XY matrix are utilized for selecting process input variables. Three vital Few Xs are identified through data analysis; amount to mix at one time, deviation by head pumps, and deviation by production magazines, and process improvements are performed for each of the three vital Few Xs. Conclusion: The improved process conditions for the three vital Few Xs are applied to the production line, and the results show that the percent defective of chromaticity coordinate has improved from 1.59% to 0.63% and a financial effect of about 50 million won per year is obtained.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2005년도 춘계학술발표대회 개요집
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• pp.19-21
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• 2005

The ball shea. tests for ball grid array (BGA) and flip chip packages were carried out with different displacement rates to find out the optimum condition of the displacement rate for this test. The BGA packages consisted of two different kinds of solder balls (eutectic Sn-37wt.%Pb and Sn-3.5wt.%Ag) and electroplated Au/Ni/Cu substrate, whereas the flip chip package consisted of electroplated Sn-37Pb solder and Cu UBM. The packages were reflowed up to 10 times, or aged at 443 K up to 21 days. The variation of the displacement rate resulted in the variations of the shear properties such as shear force, displacement rate at break, fracture mode and strain rate sensitivity. The increase in the displacement rate led to the increase of the shear force and brittleness of solder joints.

• 마이크로전자및패키징학회지
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• 제12권4호통권37호
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• pp.331-338
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• 2005

The rapid advances in high power light sources and arrays as encountered in incandescent lamps have induced dramatic increases in die heat flux and power consumption at all levels of high power LED packaging. The lifetime of such devices and device arrays is determined by their temperature and thermal transients controlled by the powering and cooling, because they are usually operated under rough environmental conditions. The reliability of packaged electronics strongly depends on the die attach quality, because any void or a small delamination may cause instant temperature increase in the die, leading sooner or later to failure in the operation. Die attach materials have a key role in the thermal management of high power LED packages by providing the low thermal resistance between the heat generating LED chips and the heat dissipating heat slug. In this paper, thermal transient characteristics of die attach in high power LED package have been studied based on the thermal transient analysis using the evaluation of the structure function of the heat flow path. With high power LED packages fabricated by die attach materials such as Ag paste, solder paste and Au/Sn eutectic bonding, we have demonstrated characteristics such as cross-section analysis, shear test and visual inspection after shear test of die attach and how to detect die attach failures and to measure thermal resistance values of die attach in high power LED package. From the structure function oi the thermal transient characteristics, we could know the result that die attach quality of Au/Sn eutectic bonding presented the thermal resistance of about 3.5K/W. It was much better than those of Ag paste and solder paste presented the thermal resistance of about 11.5${\~}$14.2K/W and 4.4${\~}$4.6K/W, respectively.

• 조명전기설비학회논문지
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• 제25권12호
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• pp.34-41
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• 2011

In order to understand the thermal performance of each LED chips in multi-chip LED package, a quantitative parametric analysis of the temperature evolution was investigated by thermal transient analysis. TSP (Temperature Sensitive Parameter) value was measured and the junction temperature was predicted. Thermal resistance between the p-n junction and the ambient was obtained from the structure function with the junction temperature evolution during the cooling period of LED. The results showed that, the thermal resistance of the each LED chips in 4 chip-LED package was higher than that of single chip- LED package.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2010년도 춘계학술대회 논문집
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• pp.1117-1118
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• 2010