Transactions of the Korean Society of Mechanical Engineers B (대한기계학회논문집B)

The Korean Society of Mechanical Engineers (대한기계학회)
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Study on Thermal Performance of Multiple LED Packages with Heat Pipes

히트 파이프를 이용한 다중 LED 패키지의 방열 성능 연구

  • Hwang, Soon-Ho (Dept. of Mechanical and Automotive Engineering, Kongju National Univ.) ;
  • Lee, Young-Lim (Dept. of Mechanical and Automotive Engineering, Kongju National Univ.)
  • 황순호 (공주대학교 기계자동차공학부) ;
  • 이영림 (공주대학교 기계자동차공학부)
  • Received : 2010.11.30
  • Accepted : 2011.03.25
  • Published : 2011.06.01
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Abstract

Since the high heat generation of LED chips can cause a reduction in lifetime, degradation of luminous efficiency, and variation of color temperature, studies have been carried out on the optimization of LED packaging and heat sinks. Recently, LED packages have been applied to high-power lights such as car headlamps or street lights, and it is known that cooling using only free convection is not at all efficient. Thus, in this study, a heat pipe with forced convection was examined for the optimization of the cooling performance in high-power LED lights. In addition, optimal on-off control of a fan was adopted to increase the fan lifetime, since the lifetime of the fan is generally shorter than that of the LEDs.

LED 조명기기의 경우 칩의 고밀도 발열로 인한 심각한 수명감소 및 광효율 저하, 색온도 변이의 문제점 등이 야기되므로 이를 해결하기 위해 주로 LED 패키지나 방열케이스를 최적화하는 연구가 이루어져 왔다. 최근들어 고출력 자동차 헤드램프나 가로등도 LED로 대체되어 가고 있는데 자연대류식 방열로는 그다지 효과적이지 않다. 따라서 본 연구에서는 고출력 조명기기 방열 성능 최적화에 강제대류를 이용한 히트파이프 사용의 타당성을 알아보았다. 또한, 팬의 수명이 LED 수명에 비해 일반적으로 낮으므로 이를 보완하기 위한 최적화된 팬의 정지-작동 제어가 팬 수명 증가에 미치는 영향도 고찰하였다.

Keywords

References

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