• Korean Journal of Optics and Photonics
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• v.22 no.3
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• pp.141-150
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• 2011

Although significant amount of research has been done to develop LED lamp packages for improved performance, no standard theories or guidelines have been established yet for designing LED lamp packages. In this paper, the photon extraction efficiency depending on both the InGaN/Sapphire LED chip structure and its attachment schemes for chip mounting has been analyzed by using the Monte Carlo photon simulation method. Based on the results of the analysis, we have derived guidelines for LED lamp package design, which can be utilized in industries or research institutes for designing new LED lamp packages optimized for particular applications.

• Journal of the Optical Society of Korea
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• v.17 no.6
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• pp.506-512
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• 2013

Recently, the color separation issue of wide-spreading white LEDs has attracted attention due to their wide applicability as light sources in direct-lit LCD backlights. These wide-spreading LED packages usually consist of LED chips, a color-conversion phosphor layer, and a light-shaping lens. The technical aspect of this color issue was related to a method for balancing the yellow spectral component emitting from phosphors with respect to the blue one from the LED chip as a function of viewing angle. In this study, we suggested an approach for carrying out quantitative analysis for the color separation problem occurring in wide-spreading LED packages by optical simulation. In addition, the effect of an internal scattering layer on the color uniformity was investigated, which may be considered as a potential solution for this problem.

• Journal of the Semiconductor & Display Technology
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• v.10 no.1
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• pp.17-22
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• 2011

LEDs(Light Emitting Diodes) are becoming widely used and increasingly in demand. Quality inspection of the LEDs has become more important. Two-dimensional inspection systems are limited in inspection capability, so threedimensional(3-D) inspection systems are needed. In this paper, a cost-effective and simple 3-D measurement system of LED packages using phase measuring profilometry(PMP) is proposed. The proposed system uses a pico projector to project sinusoidal fringe patterns and to shift phases instead of piezocrystal. It was evaluated using extremely accurate gauge blocks, yielding excellent repeatability of about 12 um(3-sigma). 3-D measurements of various LED packages were performed to demonstrate the applicability and efficiency of the proposed system.

• Korean Journal of Metals and Materials
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• v.50 no.1
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• pp.71-77
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• 2012

We studied the effect of heat treatment on the microstructures and mechanical strength of the solder joints in the Light Emitting Diode (LED) packages. The commercial LED packages were mounted on the a flame resistance-4 (FR4) Printed Circuit Board (PCB) in the reflow process, and then the joints were aged at $125^{\circ}C$ for 100, 200, 300, 500 and 1000 hours, respectively. After the heat treatment, we measured the shear strength of the solder joints between the PCB and the LED packages to evaluate their mechanical property. We used Pb-free Sn-3.0Ag-0.5Cu solder to bond between the LED packages and the PCBs using two different surface finishes, Electroless Nickel-Immersion Gold (ENIG) and Electroless Nickel-Electroless Palladium-Immersion Gold (ENEPIG). The microstructure of the solder joints was observed by a scanning electron microscope (SEM). (Cu,Ni)6Sn5 intermetallic compounds (IMCs) formed between the solder and the PCB, and the thickness of the IMCs was increased with increasing aging time. The shear strength for the ENIG finished LED package increased until aging for 300 h and then decreased with increasing aging time. On the other hand, in the case of an ENEPIG finished LED package, the shear strength decreased after aging for 500 h.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.35 no.6
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• pp.569-575
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• 2011

Since the high heat generation of LED chips can cause a reduction in lifetime, degradation of luminous efficiency, and variation of color temperature, studies have been carried out on the optimization of LED packaging and heat sinks. Recently, LED packages have been applied to high-power lights such as car headlamps or street lights, and it is known that cooling using only free convection is not at all efficient. Thus, in this study, a heat pipe with forced convection was examined for the optimization of the cooling performance in high-power LED lights. In addition, optimal on-off control of a fan was adopted to increase the fan lifetime, since the lifetime of the fan is generally shorter than that of the LEDs.

• Journal of Korean Society for Quality Management
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• v.50 no.3
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• pp.425-440
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• 2022

Purpose: The purpose of this paper is to improve the chromaticity coordinate quality of white LED packages for automobiles that require high quality and reliability. Methods: The project follows the structured methodology of the Six Sigma DMAIC Roadmap, which consists of Define, Measure, Analyze, Improve and Control phases. Results: A CTQ is determined based on COPQ analysis, and a process map and a XY matrix are utilized for selecting process input variables. Three vital Few Xs are identified through data analysis; amount to mix at one time, deviation by head pumps, and deviation by production magazines, and process improvements are performed for each of the three vital Few Xs. Conclusion: The improved process conditions for the three vital Few Xs are applied to the production line, and the results show that the percent defective of chromaticity coordinate has improved from 1.59% to 0.63% and a financial effect of about 50 million won per year is obtained.

• Proceedings of the KWS Conference
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• 2005.06a
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• pp.19-21
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• 2005

The ball shea. tests for ball grid array (BGA) and flip chip packages were carried out with different displacement rates to find out the optimum condition of the displacement rate for this test. The BGA packages consisted of two different kinds of solder balls (eutectic Sn-37wt.%Pb and Sn-3.5wt.%Ag) and electroplated Au/Ni/Cu substrate, whereas the flip chip package consisted of electroplated Sn-37Pb solder and Cu UBM. The packages were reflowed up to 10 times, or aged at 443 K up to 21 days. The variation of the displacement rate resulted in the variations of the shear properties such as shear force, displacement rate at break, fracture mode and strain rate sensitivity. The increase in the displacement rate led to the increase of the shear force and brittleness of solder joints.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.4 s.37
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• pp.331-338
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• 2005

The rapid advances in high power light sources and arrays as encountered in incandescent lamps have induced dramatic increases in die heat flux and power consumption at all levels of high power LED packaging. The lifetime of such devices and device arrays is determined by their temperature and thermal transients controlled by the powering and cooling, because they are usually operated under rough environmental conditions. The reliability of packaged electronics strongly depends on the die attach quality, because any void or a small delamination may cause instant temperature increase in the die, leading sooner or later to failure in the operation. Die attach materials have a key role in the thermal management of high power LED packages by providing the low thermal resistance between the heat generating LED chips and the heat dissipating heat slug. In this paper, thermal transient characteristics of die attach in high power LED package have been studied based on the thermal transient analysis using the evaluation of the structure function of the heat flow path. With high power LED packages fabricated by die attach materials such as Ag paste, solder paste and Au/Sn eutectic bonding, we have demonstrated characteristics such as cross-section analysis, shear test and visual inspection after shear test of die attach and how to detect die attach failures and to measure thermal resistance values of die attach in high power LED package. From the structure function oi the thermal transient characteristics, we could know the result that die attach quality of Au/Sn eutectic bonding presented the thermal resistance of about 3.5K/W. It was much better than those of Ag paste and solder paste presented the thermal resistance of about 11.5${\~}$14.2K/W and 4.4${\~}$4.6K/W, respectively.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.25 no.12
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• pp.34-41
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• 2011

In order to understand the thermal performance of each LED chips in multi-chip LED package, a quantitative parametric analysis of the temperature evolution was investigated by thermal transient analysis. TSP (Temperature Sensitive Parameter) value was measured and the junction temperature was predicted. Thermal resistance between the p-n junction and the ambient was obtained from the structure function with the junction temperature evolution during the cooling period of LED. The results showed that, the thermal resistance of the each LED chips in 4 chip-LED package was higher than that of single chip- LED package.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.05a
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• pp.1117-1118
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• 2010