• Title/Summary/Keyword: LED Package

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Design of LED Luminaire for Stage Lighting and Estimation of Lighting Situation (LED 조명기구 설계와 이를 이용한 무대조명 설계)

  • Youn, Jin-Sik;Kim, Kyoung-Onn;Kim, Jin-Hong;Kim, Gi-Hoon;Lim, Young-Cheol
    • Proceedings of the Korean Institute of IIIuminating and Electrical Installation Engineers Conference
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    • 2009.10a
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    • pp.201-203
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    • 2009
  • RGBY LED PKG를 이용하여 무대 사용을 위한 100W 급 LED 조명기구를 설계하고 무대에 적용하였을 때의 조명 환경을 예측, 분석 하였다. 이를 위하여 색온도 및 광색가변에 적합한 4 in 1 LED Package를 선정하고, 이를 이용하여 광원모듈을 구성하였으며, 또한 무대조명에 적용하기 위한 렌즈를 제작하였다. 이러한 LED 조명기구를 또한 무대조명에 적용하여 조명상황을 시뮬레이션 하고 무대 또는 객석에서의 평균조도 및 조도균제도 등을 계산하였다.

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Integrated Management of the Pink Mealybug, Maconellicoccus hirsutus (Green) (Hemiptera : Pseudococcidae) Causing ′Tukra′in Mulberry

  • Katiyar, R.L.;Manjunath, D.;Kumar, Vineet;Datta, R.K.
    • International Journal of Industrial Entomology and Biomaterials
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    • v.3 no.2
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    • pp.117-120
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    • 2001
  • In India, mulberry (Morus spp.), the sole food plant of the silkworm, Bombyx mori (Linn.), is prone to infestation by the pink mealybug, Maconellicoccus hirsutus (Green). Infestation by this pest causes apical shoot malformation, popularly known as 'tukra'. Occurrence of tukra causes an appreciable reduction in leaf yield and quality, leading to low silkworm cocoon productivity. For management of M. hirsutus (Tukra), an IPM package comprising mechanical, chemical and biological measures was demonstrated in the mulberry gardens of five Government Silk Farms in Mysore District (Karnataka, India) during 1995-96. A suppression of 76.0% in tukra incidence and 90.19% in mealybug population was recorded by employ the IPM package which led to an estimated 4,000 kg recovery in leaf yield/ha/year. The impact of IPM package in the management of M. hirsutus, the role of biocontrol agent (Cryptolaemus montrouzieri Muls.) in pest suppression and the cost-benefit analysis of the IPM package are discussed.

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Improvement of Color Temperature Uniformity of Integrated Optic Lens Type LED Packaged using Compression Molding Method (가압성형 방식을 사용한 렌즈 일체형 LED 패키지의 색온도 균일성 향상에 관한 연구)

  • Kim, Wan-Ho;Kang, Young-Rae;Jang, Min-Suk;Joo, Jae-Young;Song, Sang-Bin;Kim, Jae-Pil;Yeo, In-Seon
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.27 no.4
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    • pp.1-7
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    • 2013
  • Optical characteristics including the view angle and color temperature uniformity of LED packages with an integrated lens fabricated by compression molding method are investigated according to lens shape, lens materials, and phosphor coating methods. Four types of lens shape are designed and their optical output power dependence on the refractive index of silicone encapsulant are evaluated. Also, spatial color temperature uniformities of packages fabricated with different phosphor coating methods-direct coating on a chip vs. uniformly mixed with silicone encapsulant- are compared at various view angles. As the result, it is found that phosphor coating method is more effective on color temperature uniformity than lens shape. The maximum color temperature difference of a package with direct coating of phosphor on a chip is 1,340K according to the view angle at the color temperature of 5,000K, and that of a package with uniformly mixed phosphor is 250K, which indicates 1,090K improvement of color uniformity for the latter case.

Analysis of the thermal management of a high power LED package with a heat pipe

  • Kim, Jong-Soo;Kim, Eun-Pil
    • Journal of Advanced Marine Engineering and Technology
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    • v.40 no.2
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    • pp.96-101
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    • 2016
  • The thermal management of high-power LED components in an assembly structure is crucial for the stable operation and proper luminous function. This study employs numerical tools to determine the optimum thermal design in LEDs with a heat sink consisting of a crevice-type vapor-chamber heat pipe. The effects of the MCPCB are investigated in terms of the substrate thicknesses on which the LEDs are mounted. Further, different placement configurations in a system module are considered. This study found that for a confined area, a power of 40 W/LED is applicable to a high-power package. Furthermore, the thermal conductivity of dielectric layer materials should ideally be greater than 0.9 W/m.K. The temperature conditions of the vapor chamber in a heat pipe greatly affect the thermal performance of the system. At an offset distance of 9.0 mm and a $2^{\circ}C$ increase in the temperature of the heat pipe, the resulting maximum temperature increase is approximately $1.9^{\circ}C$ for each heat dissipation temperature. Finally, at a thermal conductivity of 0.3 W/m.K, it was found that the total thermal resistance changes dramatically. Above 1.2 W/m.K, the resistance change reduces exponentially.

A Study on the Optimal Position of Vehicle Side Mirrors according to the Perception of Visual Information (시각정보의 인식도에 의한 자동차 Side Mirror의 최적 위치결정에 관한 연구)

  • 김도회;이근희
    • Journal of Korean Society of Industrial and Systems Engineering
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    • v.14 no.24
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    • pp.123-132
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    • 1991
  • This study deals with the experiment of perceiving visual information according to the positions of vehicle side mirrors. In the design of vehicle, the consideration of safety is very important. Therefore we consider the positions of side mirrors to use visual information effectively which is important factor to driver. This paper presents the position of side mirror to elevate the degree of visual perception for the circumstances of danger by experiments. To exhibit the circumstances of danger. 4 LED(Light Emitted Diode) art located at each side(right. left front. hack) of vehicle. A subject pushes the LED switch to see that if he perceives the circumstance of danger. To record the circumstance of randomly generated danger, computer interface card is used to control 4 LED and swithch on IBM PC/AT Experiments are divided into 2 parts. The 1st experiment present the independence of right & left side mirror. The 2nd experiment present optimal position of right & left side mirror. The vehicle used in experiment is model EL of H Co.. Statistical process of experimental data using SPSS(Statistical Package for Social Sciences)/PC package concludes that 1) the optimal position of right side mirror is 54cm forward of exist position. 2) for the left side mirror, the position of 120cm forward of exist position shows the worst degree of perception. and the optimal position does not exist in statistical meaning.

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Antioxidant Packaging as Additional Measure to Augment CO2-enriched Modified Atmosphere Packaging for Preserving Infant Formula Powder

  • Jo, Min Gyeong;An, Duck Soon;Lee, Dong Sun
    • KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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    • v.26 no.1
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    • pp.19-23
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    • 2020
  • Al-laminated packaging film incorporating ascorbic acid or tocopherol at inner food contact layer was tested in the potential to improve antioxidative preservation of powdered infant formula under CO2-enriched atmosphere. Product of 200 g was packaged with the packaging film containing 0.3% antioxidant in sealant layer of low density polyethylene and stored at 30℃ for 286 days with periodic measurement of package atmosphere and product's quality attributes. The CO2-flushed package resulted in shrinkage of tight contact between the product and the film not allowing gas sampling of package atmosphere after 140 days. Package of tocopherol-incorporated film allowed some ingress of oxygen after 112 days presumably due to its weakening of heat-seal area. The increased oxygen concentration in the tocopherol-added film package led to the concomitant increase of peroxide value, an index of lipid oxidation. On the other hand, packaging of ascorbic acid-added film pouch could suppress lipid oxidation marginally in consistent manner compared to control package without any antioxidant.

Public-Private Cooperation in the Package Deal for Overseas Energy Resources Acquisition (에너지자원획득을 위한 패키지 딜에서의 민관협력방안연구)

  • Park, Dae-Young;Hur, Jin-Huek;Lee, Tae-Gu;Moon, Seung-Jae;Lee, Jae-Heon;Yoo, Ho-Seon
    • Proceedings of the SAREK Conference
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    • 2008.06a
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    • pp.1123-1127
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    • 2008
  • The public-private cooperation in package deal has been studied for the overseas energy resources acquisition. The effectiveness of the package deal has not been successful because the deal has led by the government organizations. It is difficult for the plant EPC companies to join the packaged deal due to the lack of the whole responsibility organization to support the participation of the package deal. The followings are suggested as the ways to strengthen of the public-private cooperation in this study. 1) the relevant public enterprise privatization 2) establishment of the joint model for leading the plant EPC companies to the package deal 3) establishment of the whole responsibility organization for the public-private cooperation.

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Public-Private Cooperation in the Package Deal for Overseas Energy Resources Acquisition (에너지자원획득을 위한 패키지딜 적용시 민관협력 강화 방안)

  • Park, Dae-Young;Hur, Jin-Huek;Lee, Tae-Gu;Moon, Seung-Jae;Lee, Jae-Heon;Yoo, Hoseon
    • Plant Journal
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    • v.4 no.2
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    • pp.73-78
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    • 2008
  • The public-private cooperation in package deal has been studied for the overseas energy resources acquisition. The effectiveness of the package deal has not been successful because the deal has led by the government organizations. It is difficult for the plant EPC companies to join the packaged deal due to the lack of the whole responsibility organization to support the participation of the package deal. The followings are suggested as the ways to strengthen of the public-private cooperation in this study. 1) the relevant public enterprise privatization 2) establishment of the joint model for leading the plant EPC companies to the package deal 3) establishment of the whole responsibility organization for the public-private cooperation.

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The Analysis of Thermal & Optical Properties in LED Package by the PCB structure and via hole formation (PCB 구조와 via hole 구성에 따른 LED 패키지의 열적 광학적 특성 분석)

  • Lee, Se-Il;Lee, Seung-Min;Yang, Jong-Kyung;Park, Hyung-Jun;Park, Dae-Hee
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2009.06a
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    • pp.297-298
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    • 2009
  • 대부분의 반도체 소자의 고장 원인은 85%정도가 열로 인한 것이며, 고출력 LED는 인가된 에너지의 20%정도의 광으로 출력되며 나머지 80%가 열로 전환된다. 본 논문에서는 PMS-50과 KEITHLEY 2430을 이용하여 PCB 구조와 Via hole 구성에 따른 LED 패키지의 열적 광학적 특성을 분석하였다. 0.6mm의 Via hole을 가진 FR4 PCB의 열특성이 가장 우수하였으며, Via hole 0.6mm FR4 PCB의 경우 McPCB에 상응하는 광출력 특성을 보였다.

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