• International Journal of Aerospace System Engineering
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• v.1 no.1
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• pp.44-47
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• 2014

This study proposes a development for the nano silver adhesive, which is applicable to high efficiency LED(light-emitting diode) light. The important issue of LED light is heat exhaust from LED. Generally, the middle area of LED light is increased up to 380K. Therefore, the bottleneck between LED chip and heat sink are caused by high temperature. In this work, the adhesive material between LED Chip and heat sink was newly developed for improvement of bottleneck. The nano silver was adopted to solve heat problem of chip on board package for LED light. In order to evaluate the performance of the nano silver adhesive, the thermal analysis was performed. Moreover both adhesive performance and heat exhaust were verified through the prototype test. From the experimental test results, it is found that the developed nano silver adhesive has the high performance.

• Journal of Information Display
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• v.10 no.2
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• pp.49-53
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• 2009

In this study, a very small LED packaging lead frame with a low thermal resistance was developed. The cost of the package process was reduced by the use of many small LED lamps, which increased the light emission efficiency. Compared to the large lead frame lamp, however, the optical property of the small LED packaging lead frame lamp was not sufficiently improved because its reflection structure was changed and its reflection area was reduced. The luminous efficiency of the LED lamp reaches 58 lm/W at the current density of 0.16 A/$cm^2$. Using the LED lamps, 46-inch LCD BLU was manufactured. The BLU-made LED lamps have a low power consumption of 146 W and have a slim (10-mm-thick) BLU, keeping good uniformity in terms of brightness, and maintaining good thermal properties.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.23 no.8
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• pp.8-13
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• 2009

LED BLU(Back Light Unit), based on MCPCB(Metal Core Printed Circuit Board) with anodizing oxide dielectric layer and improved thermal dissipation property, are presented. Reflecting cups were also formed on the surface of the MCPCB such that optical coupling between neighboring chips were minimized for improving the photon extraction efficiency. LED chips were directly attached on the MCPCB by using the COB (Chip On Board) scheme.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.1163-1164
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• 2011

• Proceedings of the Korean Institute of IIIuminating and Electrical Installation Engineers Conference
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• 2007.11a
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• pp.71-76
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• 2007

본 논문에서는 고 연색성의 실시간으로 색온도 제어 가능한 승강기용 조명제품 개발을 위하여 제품에 사용될 LED Package를 제작하고 고연색성 실현을 위한 색온도 제어 기초실험을 행하였다. 그리고 20W 급의 LED 광원모듈 구동회로와 색온도 제어를 위한 제어회로를 설계하였다. 또한 음영 제거 및 글레어 차단, 효과적인 광색혼합을 위하여 확산배광을 달성하기 위한 R, G, B, A, W LED의 최적 배치 및 렌즈의 광학설계를 수행하였고 LED에서 발생하는 열을 효과적으로 발산하여 LED 조명모듈의 온도를 낮추기 위한 방열설계를 실시하였다.

• The Journal of Information Systems
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• v.20 no.3
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• pp.111-127
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• 2011

This study is intended for international cooperation in the field of LED were analyzed. The results, LED wide coverage areas, and a promising future is expected to grow fast enough to occupancy for a major national technology is a competitive situation. Chip Scale Package, including our country, such as LED manufacturing technology that might be competitive in parts, but new technologies such as renal substrate R&D and technology development still active preemption is not the situation. Renal substrate, particularly, large-diameter sapphire, large size/large LED manufacturers, such as a promising area for future research and development support will be needed. To do this, previous research in this area and the U.S., Japan cooperation in such studies also will need to expand. Bibliometrics way through this study, analytical techniques and analytical tools used in the integrated analysis of the usefulness and necessity of the system development were found.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.29 no.11
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• pp.1-5
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• 2015

In this paper, we propose the optical system design for a medium sized LED marine lanterns which simplifies the multi-layer structure into a single structure. In order to satisfy the target fixed intensity(35,000cd) and vertical divergence($-2.5^{\circ}{\sim}-4.0^{\circ}$, $+2.5^{\circ}{\sim}+4.0^{\circ}$), we use the total internal reflection collimator lens. And a Monte Carlo simulation has been utilized to optimize a condition of a LED package, TIR lens and outside lens. The computer simulation results indicated that this LED marine lanterns can produce of a fixed intensity(35,382cd) and vertical divergence($-3.1^{\circ}{\sim}+2.5^{\circ}$). Using the this optical system, we achieve the target value of LED lanterns.

• Composites Research
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• v.28 no.5
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• pp.322-326
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• 2015

We developed the high-power LED beacon and investigated the applicability of composite materials for the light-weight design of LED beacon. By means of the application of composite materials, the vertical deformation could be reduced by 17% and the total weight of LED beacon 8.9 kg comparable to 20% light-weighting against aluminum beacon. In thermal radiation test, the maximum temperature of LED package was measured to $63.5^{\circ}C$ under ambient temperature ($20^{\circ}C$), which is acceptable considering both performance and lifespan of LED packages. In this study, the applicability of composite materials was demonstrated for light-weight design of high-power LED beacon.

• Korean Journal of Optics and Photonics
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• v.22 no.3
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• pp.141-150
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• 2011

Although significant amount of research has been done to develop LED lamp packages for improved performance, no standard theories or guidelines have been established yet for designing LED lamp packages. In this paper, the photon extraction efficiency depending on both the InGaN/Sapphire LED chip structure and its attachment schemes for chip mounting has been analyzed by using the Monte Carlo photon simulation method. Based on the results of the analysis, we have derived guidelines for LED lamp package design, which can be utilized in industries or research institutes for designing new LED lamp packages optimized for particular applications.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.191-191
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• 2009

In this paper, we have confirmed the temperature of LED chip and McPCB with thermal simulation program which is CFDedign V10 for analysis the thermal flow of HP LED package. we have known that the heat from LED chip is transferred through heat slug to copper layer of McPCB. the temperature of LED chip shows 85.11 [$^{\circ}C$], which shows the temperature gap of 7.52 [$^{\circ}C$] against McPCB. the gap of temperature affect reliability of the wire bonding and die attachment. therefore, copper layer of heat slug on the McPCB should designed with the largest dimension.