• Title/Summary/Keyword: LED Heat-sink

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Heat Conduction Analysis of Metal Hybrid Die Adhesive Structure for High Power LED Package (고출력 LED 패키지의 열 전달 개선을 위한 금속-실리콘 병렬 접합 구조의 특성 분석)

  • Yim, Hae-Dong;Choi, Bong-Man;Lee, Dong-Jin;Lee, Seung-Gol;Park, Se-Geun;O, Beom-Hoan
    • Korean Journal of Optics and Photonics
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    • v.24 no.6
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    • pp.342-346
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    • 2013
  • We present the thermal analysis result of die bonding for a high power LED package using a metal hybrid silicone adhesive structure. The simulation structure consists of an LED chip, silicone die adhesive, package substrate, silicone-phosphor encapsulation, Al PCB and a heat-sink. As a result, we demonstrate that the heat generated from the chip is easily dissipated through the metal structure. The thermal resistance of the metal hybrid structure was 1.662 K/W. And the thermal resistance of the total package was 5.91 K/W. This result is comparable to the thermal resistance of a eutectic bonded LED package.

A Comparative Analysis of Thermal Properties of COB LED based on Thermoelectric Device Structure (열전소자 구조에 따른 COB LED의 방열 성능 비교 분석)

  • Kim, Hyo-Jun;Kang, Eun-Yeong;Im, Seong-Bin;Hoang, Geun-Chang;Kim, Yong-Kab
    • The Journal of the Institute of Internet, Broadcasting and Communication
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    • v.15 no.2
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    • pp.189-194
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    • 2015
  • In this study, the heat radiation performance of COB LED according to the structure of thermoelectric device were compared. Thermoelectric device of the sheet copper structure and ceramic structure were used for bonding with the heating part of the COB LED. The temperature distribution in the bonding part of the thermoelectric device of COB LED was measured with a contact-type thermometer. The temperature variation of the thermoelectric device was measured by inputting the currents of 0.1A, 0.3A, 0.5A, and 0.7A. When 0.7A was applied, the temperature of the bonding part where there was a heat aggregation phenomenon of the COB LED was $59^{\circ}C$ for thermoelectric device of the sheet copper structure and $67^{\circ}C$ for the thermoelectric device of the ceramic structure. Therefore, the sheet copper thermoelectric device whose temperature was lower by $9^{\circ}C$ showed better heat radiation performance than those of the ceramic structure.

LED Module Temperature Analysis for LED Chip Thermal Resistance Measurement (LED Chip 열저항측정을 통한 LED Module 온도분석)

  • Jeong, Hee-Suk;Yoo, Hyoung-Yul;Kim, Jeong-Su;Lee, Young-Joo
    • Proceedings of the Korean Institute of IIIuminating and Electrical Installation Engineers Conference
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    • 2009.05a
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    • pp.164-167
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    • 2009
  • It is difficult to measure junction temperature in the LED Module. According to the arrangement control unit and heat sink, temperature distribution is changed in the LED Module. A method of forecasting LED Module thermal resistance is suggested with measuring LED and PCB board temperature.

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Thermal Flow Analysis for Development of LED Fog Lamp for Vehicle (차량 LED 안개등 개발을 위한 열유동 해석)

  • Lee, Suk Young
    • Journal of Energy Engineering
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    • v.28 no.4
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    • pp.35-41
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    • 2019
  • In order to overcome these disadvantages, the halogen light source, which was previously used as a vehicle fog light, has increased power consumption and a short lifetime, and thus, an automobile light source is gradually being replaced with an LED. However, when the vehicle LED fog light is turned on, there is a disadvantage in reducing the life of the fog lamp due to the high heat generated from the LED. The heat generated by the LED inside the fog lamp is mainly emitted by the heatsink, but most of the remaining heat is released to the outside through convection. When cooling efficiency decreases due to convection, thermal energy generates heat to lenses, reflectors, and bezels, which are the main parts of lamps, or generates high temperatures in LED, thereby shortening the life of LED fog lights. In this study, we tried to improve the heat dissipation performance by convection in addition to the heat dissipation method by heat sink, and to determine the installation location of vents that can discharge the internal air or intake the external air of LED fog lamp for vehicle. Thermal fluid analysis was performed to ensure that the optimal data were reflected in the design. The average velocity of air increased in the order of Case3 and Case2 compared to Case1, which is the existing prototype, and the increase rate of Case3 was relatively higher than that of other cases. This is because the vents installed above and below the fog lamps induce the convective phenomena generated according to the temperature difference, and the heat is efficiently discharged with the increase of the air speed.

Heat Analysis of According to The Heat Sink Material Using COMSOL (COMSOL을 이용한 방열판 재질에 따른 열해석)

  • Ha, Kang-Nam;Go, Ha-Eun;Eo, Ik-Soo
    • Proceedings of the KIEE Conference
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    • 2011.07a
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    • pp.125-126
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    • 2011
  • 본 논문은 방열판 재질에 따른 열 해석에 관한 것으로서 구리와 알루미늄 재질의 방열판에 LED를 배치하여 COMSOL Multi physics를 사용한다. 시뮬레이션 결과 구리 재질의 방열판이 알루미늄 재질의 방열판보다 Min. 온도가 약 $20^{\circ}C$ 높게 측정되었다. 실험결과 실제 제작을 하지 않고 시뮬레이션을 통해 열해석이 가능함을 확인하였다.

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Study on the Development of High-efficiency, Long-life LED Fog Lamps for the Used Car Market

  • Park, Sang Jun;Lee, Young Lim
    • Transactions on Electrical and Electronic Materials
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    • v.15 no.4
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    • pp.201-206
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    • 2014
  • LED lighting,considered to be a new growth industry, has attracted a great deal of attention due to its higher illumination and longer life time than existing light sources. In this study, high-efficiency and long-life LED fog lamps for automobiles were developed, which can substitute the existing 27 W halogen fog lamps for a used car market. For this purpose, the number of LED modules, the body, heat sink, and the output of the fog lamp were first optimized through a numerical analysis. Then, a 10 W-class LED fog lamp was prototyped based on the optimized numerical model, and the performance of the fog lamp was successfully verified through the experiments.

Development of 15W LED Downlight (15W급 LED 다운라이트 개발)

  • Park, Chil-Keun;Choi, Moon-Goo;Yoon, Hyoung-Kil;Kwon, Seong-Hun;Kim, Sang-Cheon;Ahn, Jin-Ho;Han, Sung-Su
    • Proceedings of the Korean Institute of IIIuminating and Electrical Installation Engineers Conference
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    • 2009.10a
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    • pp.99-102
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    • 2009
  • Fixture 일체형 LED 다운라이트(Downlight)의 광 효율 향상을 위하여 LED 장착위치 및 Reflector 길이, 히트싱크(Heat sink) 형태에 따른 광도(luminous intensity)와 기구효율(luminaire efficiency)을 시뮬레이션을 통하여 비교분석 하였다. 또한 히트싱크의 방열 설계를 시뮬레이션 하고 상용 LED 패키지 (Cree, XP-E P4)를 사용하여 시제품을 제작 하여 그 성능을 평가하였다. 그 결과 광속 9661m, 상관 색온도(CCT) 3,060K, 연색지수(CRI) 82의 광 특성을 갖는 LED 다운라이트를 개발하였다.

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Development of Wireless Control System for High Power LED Luminaire Using Bluetooth Wireless Communication and Current Control System (Bluetooth 무선 통신과 전류제어 시스템을 이용한 고전력 LED 등기구의 무선제어 시스템 개발)

  • Lee, Wan-Bum
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.17 no.3
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    • pp.66-72
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    • 2016
  • An LED lighting control system was developed to combine information technology and LED lights for efficient management and energy savings. The system can monitor and control the status of an LED luminaire using Bluetooth wireless communication, sensor technology, and smart phones. An LED lighting control circuit was designed using a temperature sensor, illumination sensor, and Bluetooth module with a fuzzy constant-current control circuit. We extended the lifetime and prevented damage to the LED by optimizing the supply current of the LED luminaire based on the heat-generation temperature of $70^{\circ}C$ of an LED heat sink. We also automatically adjusted the ON/OFF time depending on the ambient illumination of the LED luminaire. By allowing easy control of the LED luminaires on a smartphone, we improved the efficiency and achieved energy savings. The control system was validated through experiments for normal operation.

Improvement of PWM Driving Control Characteristics for Low Power LED Security Light (저전력형 LED 보안등의 PWM형 구동제어 특성 개선)

  • Park, Hyung-Jun;Kim, Nag-Cheol;Kim, In-Su
    • Journal of IKEEE
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    • v.21 no.4
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    • pp.368-374
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    • 2017
  • In this Paper, we developed a low power type LED security light using LED lighting that substitutes a 220[V] commercial power source for a solar cell module instead of a halogen or a sodium lamp. in addition, a PWM type drive control circuit is designed to minimize the heat generation problem and the drive current of the LED drive controller. in developed system, The light efficiency measurement value is 93.6[lm/W], and a high precision temperature sensor is used inside the controller to control the heat generation of the LED lamp. In order to eliminate the high heat generated from the LED lamp, it is designed to disperse quickly into the atmosphere through the metal insertion type heat sink. The heat control range of LED lighting was $50-55[^{\circ}C]$. The luminous flux and the lighting speed of the LED security lamp were 0.5[s], and the beam diffusion angle of the LED lamp was about $110[^{\circ}C]$ by the light distribution curve based on the height of 6[m].

Temperature and Sound Noise Control for LED lamp (LED조명의 온도 및 소음 제어)

  • Yoon, Jong-Su;Choi, Hyeung-Sik;Shin, Hee-Young;Lim, Tae-Woo
    • Journal of Advanced Marine Engineering and Technology
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    • v.35 no.8
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    • pp.1078-1084
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    • 2011
  • In this paper, a temperature control for LED(Light Emitting Diode) lamp using a cooling fan is studied. An efficient temperature control scheme for the LED lamp using the fan wind at the lowest sound noise is studied. Also, for minimization study of sound noise and temperature control of an LED lamp, a sequential control algorithm using the cooling fan at the lowest sound noise is presented. For the study, after measurement of the minimum sound noise of the fan and related temperature of the LED lamp through tests, experiments on temperature control of the LED lamp using the fan was performed.