• 조명전기설비학회논문지
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• 제28권7호
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• pp.19-25
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• 2014

In the LED lighting applications, because LED packages are the origin of heat generation, there are thermal design problem on heat sinks. In the thermal design, it is important to consider the total volume and the total weight of heat sink simultaneously. In this study, an Al 6063 heat sink was optimized using Computational Fluid Dynamics(CFD) simulation tool for the cooling of 30W LED module, and then the cooling performance and the total weight of heat sinks with Al 6063 and Thermal Conductive Polycarbonate(TCP) were compared under the same conditions. As the result of simulation, an Al 6063 heat sink was optimized with 22 ea. of fins and 1.6 mm of fin thickness. LED Junction Temperature of the TCP Heat Sink was $5.6^{\circ}C$ higher, but total weight of it was 47 % less than the Al 6063.

• Transactions on Electrical and Electronic Materials
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• 제13권6호
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• pp.292-296
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• 2012

An optimum heat sink for a 30 W chip on board (COB) LED down-light is designed, fabricated, and characterized. By using the SolidWorks Flow simulator and thermal analysis software, the thermal characteristics of the optimum heat sink is analyzed. Four different types of heat sink are simulated and an optimum structure of the heat sink is found. The simulated temperature of the heat sink when operating the LED down-light is $55.9^{\circ}C$, which is only a difference of $2^{\circ}C$ from the measured temperature. In order to reduce the temperature further, a copper spreader is introduced to the heat sink. The temperature of the heat sink with the copper spreader is $3^{\circ}C$ lower than without the copper spreader.

• 한국기계가공학회지
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• 제16권2호
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• pp.142-148
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• 2017

The objective of this study is to investigate the cooling characteristics of a heat sink for an LED headlight used in passenger cars. To this end, this study conducts the experimental and numerical analysis of the heat sink heated at constant heat fluxes without air flow applied. In the experiments, heat was transferred at a constant heat flux through the bottom of a heat sink. The measured temperature on pre-selected locations of the heat sink was in good agreement with the numerically predicted one. The experimental and numerical results indicate that the convective heat transfer coefficient for the natural convection mode was decreased by increasing the heat flux applied to the bottom of heat sink, lowering the cooling capabilities.

• 한국기계가공학회지
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• 제17권6호
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• pp.117-123
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• 2018

Automotive headlamps have been continuously developed as one of the most important devices for securing the driver's view, and the LED lamps are getting popular in recent years. However, in case of the LED lamps, because the heat generated by the LED lamps are too high, it shorten the product life and lower the LED efficiency. Therefore, this study was investigated the cooling characteristics of the LED lamp heat sink for automobile by forced convection for LED heat generation control. In order to analyze the cooling characteristics of the heat sink, the temperature distribution results were investigated through the experiment and computational analysis under the increase of the air flow velocity, and the convective heat transfer coefficient was obtained. Also, convective heat transfer coefficient was calculated by the theoretical formula under the same condition and compared with experimental and computational results. From the result of this study, as the air flow velocity around the heat sink fins increased, the convective heat transfer coefficient significantly increased, confirming the improvement in the cooling effect.

• 한국기계가공학회지
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• 제12권4호
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• pp.61-68
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• 2013

As an advance study for the development of a heat sink for special purpose high power illumination, an investigation was made to find feasibility for the application of copper plated EP to a heat sink of small LED light of less than 10W installed in commercial product. In this study, the plated heat sink with EP copper was fabricated for the conventional LED light. It was used actually for finding heat radiation property and effectiveness of the heat sink accompanied with measurement of luminous intensity. The heat is radiated by transfer and dissipation only through the copper plated surface due to extremely low heat conductivity of EP in case of EP heat sink; however the total area of the plate plays the function of heat transfer as well as heat radiation in case of the aluminum heat sink. It seems that the volume difference of heat radiating material is so big that the temperature $P_1$ is 9.0~12.3% higher in 3W and 42.7~54.0% higher in case of 6W volume difference of heat radiating material is so big that the temperature $P_1$ is 9.0~12.3% higher in 3W and 42.7~54.0% higher in case of 6W even though heat transfer rate of copper is approximately 1.9 times higher than that of aluminum. It was thought that this is useful to utilize for heat sink for low power LED light with the low heating rate. Also, the illumination could be greatly influenced by the surrounding temperature of the place where it is installed. Therefore, it seems that the illumination installation environment must be taken into consideration when selecting illumination. Further study was expected on order to aims at development of an exterior surface itself made into heat radiation plate by application of this technology in future.

• International journal of advanced smart convergence
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• 제2권2호
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• pp.19-22
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• 2013

As the demand of the LED for lighting that emits light by p-n junction is increasing, studies on heatproof plate technology is being conducted to minimize the temperature of the LED lighting. As for the temperature of the LED devices, their light emitting efficiency decreases and the maximum lifespan drops down to 1/5. Therefore there are heat dissipation studies going on to minimize the heat. For LED heat dissipation, aluminum heat sink plates are mostly used. For this paper, we designed heat sink that fits residential 20W COB LED Down Light; packaged the heat sink and 20W COB and analyzed and evaluated the thermal properties through a Solidworks flow simulation. We are planning to design the optimal heat sink plate to solve the thermal agglomeration considering TIM(Thermal Interface material).

• 한국정보전자통신기술학회논문지
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• 제7권1호
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• pp.20-25
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• 2014

차세대 친환경 조명인 LED소자는 온도가 올라갈수록 LED의 발광효율이 떨어지고 $80^{\circ}C$이상 올라갈수록 수명이 감소하고 스펙트럼선의 파장이 본래의 파장보다 장파장 쪽으로 이동하는 Red Shift현상 및 $T_j$ 상승에 따라 광 출력이 감소되는 큰 문제점이 대두되고 있어 열을 최소화 할 수 있는 방열설계 연구가 진행 중이다. COB Type LED의 경우 보드에 LED 칩을 직접 결합시켜 열 저항을 낮췄지만 주거용 13.5W의 경우 방열판을 통해 발열 문제를 해결해야한다. 본 논문에서는 주거용 13.5W COB LED 다운라이트에 맞게 Heat Sink를 설계하고, 그 설계한 Heat Sink와 13.5W COB를 패키징하여 Solidworks flow simulation을 통해 최적의 Fin두께를 선정하여 접촉식 온도계를 사용한 열적 특성을 분석 하고 평가 하였다.

• 한국전기전자재료학회논문지
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• 제28권3호
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• pp.208-212
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• 2015

This study will design the structural optimization of 21 W LED heat sink using the thermal conductive plastic materials. The thermal conductive plastic heat sink is inferior to aluminum heat sinks in thermal properties. This study will solve this problem using formability of thermal conductive plastic heat sink. A heat sink was optimized in terms of the number, and the thickness of fins and the base thickness of the heat sink, using the Heatsinkdesigner software. Also by using SolidWorks Flow simulation and thermal analysis software, the thermal characteristics of the heat sink were analyzed. As the result, the optimized heat sink has 17 fins, which are 1.5 mm thick and a 3.7 mm-thick base. The highest and the lowest temperature were $51.65^{\circ}C$ and $46.24^{\circ}C$ respectively. Based on these results, The thermal conductive plastic heat sink is considered possible to overcome heating problem when designing in complex structure.

• 대한설비공학회:학술대회논문집
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• 대한설비공학회 2008년도 하계학술발표대회 논문집
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• pp.1167-1171
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• 2008

The flow and thermal performance of the skiving and louver fin type heat sinks for the cooling system of the small LED projector were experimentally evaluated. A small fan tester based on AMCA standards was used to control and measure the air flow rate into the heat sink. Three heat blocks were used to simulate the heat and light sources(red, green and blue) of the small LED projector. We measured the pressure drop, temperatures and input power at the specific air flow rate and discussed those results. As a result, it is found that the louver fin type heat sink has higher pressure drop and lower thermal resistance than the skiving type. From the comparison of the temperature of the heat block between skiving and louver fin type, the louver fin type heat sink was found to be more suitable for cooling the high power heat source than skiving type. The thermal performance of the fan-sink(louver fin type) system was discussed with the picture taken by a thermal video.

• 한국산학기술학회논문지
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• 제10권7호
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• pp.1484-1488
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• 2009

본 논문은 LED조명기구의 상용화에 가장 큰 문제로 제기되는 방열설계에 관한 논문으로서, COMSOL을 이용한 방열해석을 통하여 문제해결의 방법을 제시한다. COMSOL Multiphysics에 있는 Heat Transfer Module의 Transient Analysis를 활용하여 해석한 결과, 시뮬레이션 값과 시작품 제작 후 측정 온도와의 차이가 10[$^{\circ}C$]이하로 도출되었으며, Led Lamp가 설치되는 실내.외의 환경조건의 온도변화에 따른 제 요소들을 잘 활용하면 실제 작품의 목표치에 근접하는 결과를 얻을 수 있음을 확인할 수 있었다.