• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2009년도 추계학술대회 논문집
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• pp.323-327
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• 2009

Silicone is recently used for LED chip encapsulment due to its good thermal stability and optical transmittance. In order to predict residual stress which causes optical briefringence and mechanical warpage of silicone, finite element analysis was conducted for both curing and cooling process during silicone molding. For analysis of curing process, a cure kinetics model was derived based on the differential scanning calorimetry(DSC) test and applied to the material properties for finite element analysis. Finite element simulation result showed that the curing as well as the cooling process should be designed carefully so as to reduce the residual stress although the cooling process plays the bigger role than curing process in determining the final residual stress state.

• 대한설비공학회:학술대회논문집
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• 대한설비공학회 2008년도 하계학술발표대회 논문집
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• pp.1167-1171
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• 2008

The flow and thermal performance of the skiving and louver fin type heat sinks for the cooling system of the small LED projector were experimentally evaluated. A small fan tester based on AMCA standards was used to control and measure the air flow rate into the heat sink. Three heat blocks were used to simulate the heat and light sources(red, green and blue) of the small LED projector. We measured the pressure drop, temperatures and input power at the specific air flow rate and discussed those results. As a result, it is found that the louver fin type heat sink has higher pressure drop and lower thermal resistance than the skiving type. From the comparison of the temperature of the heat block between skiving and louver fin type, the louver fin type heat sink was found to be more suitable for cooling the high power heat source than skiving type. The thermal performance of the fan-sink(louver fin type) system was discussed with the picture taken by a thermal video.

• 한국전기전자재료학회논문지
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• 제25권10호
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• pp.830-836
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• 2012

An efficient cooling system is essential for the electronic packaging such as a high-luminance LED lighting. A special heat transport technology, Pulsating Heat Pipe (PHP), can be applied to the cooling of LED lighting. In this paper, the operational characteristics of the PHP in the imposed thermal boundary conditions of LED lighting were experimentally investigated. The experimental PHP was made of copper tubes of internal diameter of 2.1 mm. The working fluids of ethanol, FC-72, water, acetone and R-123 were chosen for comparison. The results showed that an optimum range of charging ratio exists for high cooling performance; 50% for most of the fluids. Among the five working fluids, water showed the highest heat transfer rate of 260 W. Two distinguished characteristics of pulsating direction were identified. It is also identified that high vapor pressure gradient is one of key parameters for better heat transfer performance.

• 대한기계학회논문집B
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• 제35권6호
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• pp.569-575
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• 2011

LED 조명기기의 경우 칩의 고밀도 발열로 인한 심각한 수명감소 및 광효율 저하, 색온도 변이의 문제점 등이 야기되므로 이를 해결하기 위해 주로 LED 패키지나 방열케이스를 최적화하는 연구가 이루어져 왔다. 최근들어 고출력 자동차 헤드램프나 가로등도 LED로 대체되어 가고 있는데 자연대류식 방열로는 그다지 효과적이지 않다. 따라서 본 연구에서는 고출력 조명기기 방열 성능 최적화에 강제대류를 이용한 히트파이프 사용의 타당성을 알아보았다. 또한, 팬의 수명이 LED 수명에 비해 일반적으로 낮으므로 이를 보완하기 위한 최적화된 팬의 정지-작동 제어가 팬 수명 증가에 미치는 영향도 고찰하였다.

• 조명전기설비학회논문지
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• 제24권5호
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• pp.77-85
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• 2010

본 논문은 LED 램프를 사무소 건물에 효과적으로 사용하기 위하여 새로운 통합적 에너지 시뮬레이션을 수행한 연구 결과이다. 일반적으로 LED 램프는 다른 램프에 비하여 에너지 절감효과가 매우 우수하지만 현재 형광램프보다 낮은 광속과 좁은 광분포 등 아직 사무소 건물에 적용하기는 다각적인 검토가 필요하다. 연구결과 냉난방에너지가 20[%] 증가하고 현재 형광등을 대체하기 위해서는 90[lm/$m^2$] 이상으로 설계해야 한다. 따라서 LED램프를 사무소 건물에 적용하기 위해서 광에너지, 냉난방에 미치는 영향 및 사무실환경에 미치는 광분포를 통합적으로 해석하였으며 앞으로 이 결과는 LED 램프를 통한 효과적인 에너지절약 환경을 구축하는 데 중요한 자료를 제공할 것으로 확신한다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2010년도 춘계학술대회 논문집
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• pp.421-422
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• 2010

• 반도체디스플레이기술학회지
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• 제8권4호
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• pp.25-29
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• 2009

In this study, a thin plate-type heat pipe, instead of a solid aluminium heat sink, is used to eliminate heat released from LED components for lighting. Effects of the heat pipe size and installation angle are studied both in numerically and experimentally. According to the results, temperature on LED chip, when a heat pipe is used, is $1.2^{\circ}C$ lower than using the conventional metal PCB. The overall temperature drop is $32^{\circ}C$ if the heat pipe is properly used. The highest cooling performance is obtained in the case when the angle of a heat pipe installation is $90^{\circ}$.

• 한국조명전기설비학회:학술대회논문집
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• 한국조명전기설비학회 2009년도 춘계학술대회 논문집
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• pp.466-471
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• 2009

Generally LED lamp has many advantages to compare with a general lamp, long life and no pollution matter like the mercury. Also it is excellence for color rendering and need to small consumption electric rower. However LED lamp has some disadvantages to compare to general fluorescent lamp and That is small light flux about 50% and narrow light distribution than fluorescent lamp. Therefore, to apply LED lamp in an office building, after analyze a illuminance distribution with an environment analysis and cooling, heating and light energy. The purpose of this study is to analyze light environment. light, cooling and heating energy simulation in Office building.

• 조명전기설비학회논문지
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• 제28권7호
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• pp.19-25
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• 2014

In the LED lighting applications, because LED packages are the origin of heat generation, there are thermal design problem on heat sinks. In the thermal design, it is important to consider the total volume and the total weight of heat sink simultaneously. In this study, an Al 6063 heat sink was optimized using Computational Fluid Dynamics(CFD) simulation tool for the cooling of 30W LED module, and then the cooling performance and the total weight of heat sinks with Al 6063 and Thermal Conductive Polycarbonate(TCP) were compared under the same conditions. As the result of simulation, an Al 6063 heat sink was optimized with 22 ea. of fins and 1.6 mm of fin thickness. LED Junction Temperature of the TCP Heat Sink was $5.6^{\circ}C$ higher, but total weight of it was 47 % less than the Al 6063.

• Design & Manufacturing
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• 제6권1호
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• pp.84-89
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• 2012

Silicone is recently used for LED chip encapsulment due to its good thermal stability and optical transmittance. In order to predict residual stress which causes optical briefringence and mechanical warpage of silicone, finite element analysis was conducted for both curing and cooling process during silicone molding. For analysis of curing process, a cure kinetics model was derived based on the differential scanning calorimetry(DSC) test and applied to the material properties for finite element analysis. Finite element simulation result showed that the curing as well as the cooling process should be designed carefully so as to reduce the residual stress although the cooling process plays the bigger role than curing process in determining the final residual stress state. In addition, birefringence experiment was carried out in order to observe residual stress distribution. Experimental results showed that cooling-induced birefringence was larger than curing-induced birefringence.