• Proceedings of the KIEE Conference
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• 2011.07a
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• pp.1722-1723
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• 2011

LED는 광학적 특성을 유지하기 위해서는 방열설계가 매우 중요한 문제로 요구된다. 대부분의 반도체 소자의 고장 원인은 85%정도가 열로 인한 것이며 고출력 LED의 인가된 에너지는 20%정도가 광으로 출력되며 나머지 80%정도가 열로 전환된다. 이러한 이유 때문에 LED소자의 신뢰성과 효율 향상을 위한 방열성능의 극대화가 필요하다. 본 연구에서는 AI MCPCB 기판에 기반을 둔 COB Type의 고출력 LED모듈의 구조를 제안 하였으며, LED Chip과 금속base 사이의 절연층 유무의 관점에서의 비교 열 시뮬레이션을 통해 결과를 분석하여 고출력 COB LED모듈의 방열 특성을 최적화 하였다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.315-316
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• 2009

본 논문에서는 1W 급 이상의 고출력 LED 용 패키지로서 세라믹 LTCC 적층 패키지의 방열 특성을 평가하고 열해석 결과와의 차이에 대해 고찰하였다. 특히, 세라믹 패키지의 방열 특성을 향상시키기 위해 Thermal Via와 Heat slug를 LED Chip 하단부에 위치시켰을 때 방열 특성을 평가하기 위해 Transient Thermal Test를 이용하여 각각의 경우에 대한 열저항을 평가하여 방열 특성의 항상 정도를 확인하였으며, 열해석 시뮬레이션을 통해 얻은 결과와 비교하였다. 평가 결과 Heat slug를 배치한 패키지가 열저항이 $8^{\circ}C/W$로서 가장 우수한 특성을 보여주었으며, 열해석 결과와의 차이에 대해서는 광출력으로 방출된 전력을 계산하여 보정함으로써 $1^{\circ}C$ 이하의 편차를 보여주는 결과를 얻을 수 있었다.

• Journal of the Korea Convergence Society
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• v.8 no.3
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• pp.199-204
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• 2017

The Nowadays, LED head lamp has been used instead of halogen lamp at automotive head lamp. Inside this LED head lamp, there is a radiant heat panel which has the role to have the considerable influence upon LED life. As the radiant heat panel absorbs the heat from medium, the overheat of diode can prevented. in this study, the heat transfer and thermal stress are investigated according to the configuration of radiant heat panel. As the result of this study, the heat at model 1 decreases in comparison with model 2 and model 1 in design has the durability more than model 2. As the convergence technique is grafted on the design of radiant heat panel, the esthetic sense can be shown at the automotive head lamp.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.11 no.9
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• pp.3141-3147
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• 2010

The most important cause for shortening LED lighting efficiency and life is the junction temperature rises and, to solve this problem, various studies such as thermally efficient packaging, highly conductive material development, contact resistance improvement or heat sink optimization have been studied. However, most studies so far assumed that the LED lights are in the atmosphere, and thermal performance has not been therefore reported when the LED lights are mounted on the ceiling with ceiling unit. Thus, this study investigates the variation of junction temperature of the MR16 LED light under actual installation conditions and more accurate thermal design for the efficiency and life of LED lights is therefore achieved.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.35 no.6
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• pp.569-575
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• 2011

Since the high heat generation of LED chips can cause a reduction in lifetime, degradation of luminous efficiency, and variation of color temperature, studies have been carried out on the optimization of LED packaging and heat sinks. Recently, LED packages have been applied to high-power lights such as car headlamps or street lights, and it is known that cooling using only free convection is not at all efficient. Thus, in this study, a heat pipe with forced convection was examined for the optimization of the cooling performance in high-power LED lights. In addition, optimal on-off control of a fan was adopted to increase the fan lifetime, since the lifetime of the fan is generally shorter than that of the LEDs.

• Journal of Advanced Marine Engineering and Technology
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• v.34 no.8
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• pp.1100-1106
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• 2010

LED(Light Emitting Diode) has the defects of low efficiency and reducement of life cycle as its temperature increases. This research is about an efficient temperature control of the LED. For LED temperature control, it is shown that a heat sink, fan, a one-chip microprocessor and the PID control algorithm are a good cooling system through experiments. Finally. by using the fan as a cooling device and controlling it appropriately, it is proved that the intensity of illumination and the desired temperature can be achieved with consumption of only 2% of the driving power of the LED system through control experiments.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.20 no.1
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• pp.170-178
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• 2019

Recently, as the interest in energy savings has increased, there has been increasing use of LED lighting, which is an eco-friendly device that replaces high energy consuming fluorescent lamps and incandescent lamps. In the case of a high output LED, however, the life time is shortened due to deterioration caused by heat generation. As a solution to this problem, this paper evaluated the LED life extension effect by increasing the convective heat transfer coefficient of the heat sink surface for LED packaging. A roughing process was carried out using sandpaper and sand blasting. The changes in surface roughness and surface area after each surface treatment process were evaluated quantitatively and the convective heat transfer coefficient was measured. When sandblasting and sandpaper were used to roughen the aluminum surface, a higher convection heat transfer coefficient was obtained compared to the untreated case, and a high heat dissipation efficiency of 82.76% was obtained in the sandblast treatment. Therefore, it is expected that the application of heat dissipation to the heat sink will extend the lifetime of the LED significantly and economically by increasing the heat efficiency.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2013.10a
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• pp.854-855
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• 2013

최근 국내 전력공급 문제에 따라 다양한 에너지절감형 기술과 제품이 연구되고 있다. 특히 국내 기준 전체 전력 소비량의 약 20%를 차지하는 조명분야에서는 기존 조명을 대체할 친환경, 고효율 LED 조명에 대한 기술이 대두되고 있다. LED 조명은 원리의 특성상 광효율과 비례하여 LED 접합부 온도가 상승하며 이는 광효율과 수명을 저하시킨다. 이에 다양한 방열기술이 LED 조명기술의 핵심이라 할 수 있다. 본 논문에서는 LED 모듈 접합부의 발열을 열전소자를 활용하여 열전발전 함으로써 에너지를 절감하고, 열회수를 통한 방열효과를 제공 하는 LED 조명을 제안한다.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.21 no.1
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• pp.46-50
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• 2012

This paper amis at improving the heat radiation performance of thermoelectric module (TEM) for a commercialization of high-powered LED light with using a multichip LED module. In addition, a 10W multichip LED light was prepared for the heat performance on radiating of which LED light was made for a use of testing by the driving of the thermoelectric module. So, it was found that about 30% in the effect of temperature reduction was confirmed if compared with the radiation heat by heat sink only.

• Proceedings of the KIEE Conference
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• 2009.07a
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• pp.2243_2244
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• 2009

본 논문에서는 알루미늄 재질로 된 방열판과 PCB에 1[W]급 LED 14개를 모듈 방열 설계 하여 COMSOL Multiphysics로 시뮬레이션을 통한 결과, 경계면 온도는 약 $80^{\circ}C$, Max.온도$141^{\circ}C$, Min.온도$20^{\circ}C$까지 변화로 실 제작에 근접한 온도 확인이 가능함을 확인 할 수 있었다.