• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.816-819
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• 2008

A negative photoresist formulation was developed utilizing synthesized UV monomers containing imide linkage, photoinitiator, UV oligomer, and alkali developable polymer matrix. It was found that via-holes with good resolution, high transmittance and thermal resistance could be obtained by photolithographic process utilizing the negative-type photoresist formulations.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.1005-1008
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• 2008

Electronic Paper Displays (EPDs) incorporating electrophoretic foils have made digital reading as pleasant as reading normal print. We will report on progress to replace glass-based displays with light and robust plastic EPDs using only a few extra process steps in a standard TFT-LCD factory.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.903-906
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• 2008

We developed the advanced LTPS (A-LTPS) manufacturing process. The a-Si TFT process was combined with selectively enlarging laser crystallization (SELAX) technology to improve the carrier mobility in the region where the peripheral circuits are to be fabricated. A 2.4-inch IPS-pro LCD panel for personal digital assistant use was successfully fabricated using the developed technology.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.665-668
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• 2006

Sodium is a serious contamination in LTPS TFT process. It causes the abnormal characteristics of TFT in operation. Contaminated areas can be seen in SEM images, but EDX measurements do not have adequate sensitivity to confirm the presence of superficial sodium residues. We employed SIMS as a fast analysis method to map the non-uniform distribution of sodium on the surface. SIMS can also indicate the thickness of the contamination.

• Journal of the Korean Data and Information Science Society
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• v.18 no.3
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• pp.773-782
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• 2007

The statistical process control charts are very extensively used for monitoring of process mean, deviation, defect rate or reject rate. In this paper we consider a control chart to monitor the process reject rate in the high yield process, which is based on the observed cumulative probability of the number of items inspected until r defective items are observed. We first propose selection of the optimal value of r in the CPC-r charts, and also consider the usefulness of the chart in high yield process such as semiconductor or TFT-LCD manufacturing process.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.1005-1006
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• 2011

• Journal of the Semiconductor & Display Technology
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• v.14 no.1
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• pp.45-49
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• 2015

Process gases with vapor or liquid phase as well as gas phase may experience alteration in itself or be contaminated in the fluid pipe to the process chamber. And thus it result in as particles or defects on the substrates in semiconductor, LCD, LED manufacturing. Purifiers and filters are used for control of contamination. However, none of detection device is available in the delivery line. In this paper, we propose simple device with lighting and sensing in order to predict contamination of the fluid or the tube wall. For some general purpose gases, it showed constant voltage output regardless of the flow rates. But, the smoke and the moisture in the air lowered the figure due to its concentration. Numerical values for several solid and liquid media were obtained. And, the operating temperature tendency was investigated.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.851-854
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• 2008

In order to reduce the manufacturing cost of TFT LCDs and cut down an amount facilities invested, there are many LCD panel makers contributes to convert the current Five-mask manufacturing process into the noble Four-mask fabrication process. We optimized the slit mask to improve the poor process reliability.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.1673-1675
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• 2006

As the manufacturing capacity needs for large size LCD TV shifts very fast into next generation, processing and test equipment makers face more difficult challenges in accommodating productivity, reliability and lead time of panel makers as well as the prerequisite of high process quality. In this paper, AKT will discuss its new innovative productivity solutions in PECVD (Plasma Enhanced Chemical Vapor Deposition), as the key thin film process system, and EBT (Electron Beam Test), as the key array test system, for the huge glass size with surface dimension larger than 2 meter by 2 meter.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.15 no.6
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• pp.44-49
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• 2006

The use of snap-fit features is highly recommended to reduce overall product cost and manufacturing time by reducing the number of parts and eliminating assembly with conventional fasteners. Application to particular product for integral attachment using snap-fit features is needed. Alternative attachment concept for specific application has been introduced. In this study, the optimal attachment design based on the given design objectives is identified using newly developed alternative attachment concept for the specific application to LCD monitor case assembly. Integral attachment using snap-fit features applies the systematic procedure and the intensity analysis.