• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.489-493
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• 2005

TFT-LCD(Thin Film Transistor Liquid Crystal Display) module is representative commercial product of FPD(Flat Panel Display). Thickness of TFT-LCD module is very thin. It is adopted for major display unit for IT devices such as Cellular Phone, Camcorder, Digital camera and etc. Due to the harsh user environment of mobile IT devices, it requires complicated structure and tight assembly. And user requirements for the mechanical functionalities of TFT-LCD module become more strict. However, TFT-LCD module is normally weak to high level transient mechanical shock. Since it uses thin crystallized panel. Therefore, anti-shock performance is classified as one of the most important design specifications. Traditionally, the product reliability against mechanical shock is confirmed by empirical method in the design-prototype-drop/impact testredesign paradigm. The method is time-consuming and expensive process. It lacks scientific insight and quantitative evaluation. In this article, a systematic design evaluation of TFT-LCD module for mobile IT devices is presented with combinations of FEA and testing to support the optimal shock proof display design procedure.

• Resources Recycling
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• v.24 no.1
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• pp.66-72
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• 2015

Various waste PCBs arose during disassembly of LCD TVs and monitors in which they originally functioned for transmission of imaging signal, power supply, and imaging control. In those functional PCBs, gold and copper are contained at far more acceptable level, exceeding mining grade ores. Those valuable metals and their contents widely vary with functionality and end use of PCBs. Therefore, compositional analysis of individual waste PCBs from disassembled LCD TVs and monitors were performed in the present study to classify them into three categories: high gold yield and low gold yield PCBs and those without gold contents. Besides, additional chemical analysis was made to reveal gold and copper contents in the waste PCBs arising from actual disassembly/separation of end-of-life LCD TVs and monitors.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.11 no.5
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• pp.76-81
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• 2012

The continuing demand for increasingly slimmer and brighter liquid crystal display(LCD) panels has led to an increased focus on the role of the light guide panels(LGPs) or optical films that are used to obtain diffuse, uniform light from the backlight unit(BLU). And the most basic process in the production of such BLU components is the micromachining. LCD BLUs comprise various optical elements such as a LGP, diffuser sheet, prism sheet, and protector sheet with micro patterns. High aspect ratio patterns are required to reduce the number of sheets and enhance light efficiency, but there is a limit to the aspect ratio achievable for a given material and cutting tool. Therefore, this study comprised a series of experimental evaluations conducted to determine the machining feasibility in microcutting various aspect ratio patterns on electroless nickel plated die materials when using single-crystal diamond tools. Cutting performance was evaluated at various cutting speeds and depths of cut using different machining methods and machine tools.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2004.10a
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• pp.280-283
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• 2004

Micro-lens patterned micro-mold fabrication method for Light Guiding Plate(LGP), kernel part of LCD-BLU(Back Light Unit), was presented. Instead of erosion dot pattern for LGP optical design, micro-lens pattern, fabricated by LIGA-reflow process, was applied. Optical pattern design method was also developed not only for negative pattern LGP, but also positive pattern LGP. During injection molding process, experimental study was conducted to improve replication quality and brightness of ${\sim}50um$ micro-lens pattern mold. The effect of mold temperature for the replication quality of micro-lens array was studied.

• Journal of the Korean Society for Precision Engineering
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• v.18 no.10
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• pp.178-183
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• 2001

Abrasive jet machining(AJM) process is similar to the sand blasting and effectively removes hard and brittle materials. AJM has applied to rough working such as debarring and rough finishing. As the need for machining of ceramics, semiconductor, electronic devices and LCD are increasing, micro AJM is developed, and has become the inevitable technique to micromachining. This paper describes the performance of the micro AJM in micro grooving of glass. Diameter of hole and width of line in grooving is 80${\mu}{\textrm}{m}$. Experimental results showed good performance in micro grooving of glass, but the size of machined groove increased about 2~4${\mu}{\textrm}{m}$. With the fine tuning of masking process and compensation of film wear. this micro AJM could be effectively applied to the micro machining of semiconductor, electronic devices and LCD.

• Transactions of Materials Processing
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• v.17 no.6
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• pp.436-442
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• 2008

As the structure of a mobile phone becomes thin to catch up with a slim product trend, the structural strength and resistance to shock of TFT-LCD module are getting to be reduced. Hence, TFT-LCD module is the strength reinforced by bezel frame. The bezel frame was produced by the multi hemming processes with several folding parts. The determination of the optimal number of hemming part and structure of bezel frame are very important process parameter to obtain the strength of that. The effect of process parameters on strength of bezel frame was investigated by FEA. Based on the result of FEA, the experiment was performed using manufactured hemming die, the result of the experiment was compared with FEA and verified. Also, three point bending tests were performed to check the strength of bezel frame.

• Korea-Australia Rheology Journal
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• v.19 no.3
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• pp.171-176
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• 2007

LCD-BLU (Liquid Crystal Display-Back Light Unit) of medium size is usually manufactured by forming numerous dots with $50{\sim}300\;{\mu}m$ in diameter by etching process and V-grove shape with $50\;{\mu}m$ in height by mechanical cutting process. However, the surface of the etched dots is very rough due to the characteristics of the etching process and V-cutting needs rather high cost. Instead of existing optical pattern made by etching and mechanical cutting, 3-dimensional continuous micro-lens of $200\;{\mu}m$ in diameter was applied in the present study. The continuous micro-lens pattern fabricated by modified LIGA with thermal reflow process was tested to this new optical design of LGP. The manufacturing process using LIGA-reflow is made up of three stages as follows: (i) the stage of lithography, (ii) the stage of thermal reflow process and (iii) the stage of electroplating. The continuous micro-lens patterned LGP was fabricated with injection molding and its test results showed the possibility of commercial use in the future.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2007.11a
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• pp.499-500
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• 2007

• Analytical Science and Technology
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• v.19 no.6
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• pp.535-543
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• 2006

Being used widely in semiconductor and display manufacturing, $NF_3$ is internationally considered as one of the regulated compounds in emission. Numerous companies have been continuously trying to reduce the emissions of $NF_3$ to comply with the global environmental regulation. This work is made to report the destruction and removal efficiency (DRE) of electrically heated scrubbers and the use rate in process chambers installed in three main LCD manufacturing companies in Korea. As the measurement techniques for $NF_3$ emission, mass flow controlled helium gas was continuously supplied into the equipment by which scrubber efficiency is being measured. The partial pressures of $NF_3$ and helium were accurately measured for each sample using a mass spectrometer, as it is emitted from inlet and outlet of the scrubber system. The results show that the DRE value for electrically heated scrubbers installed before 2004 is less than 52 %, while that for the new scrubbers modified based on measurement by scrubber manufacturer has been sigificentely improved upto more than 95 %. In additon, we have confirmed the efficiency depends on such variables as the inlet gas flow rate, water content, heater temperature, and preventative management period. The use rates of $NF_3$ in process chambers were also affected by the process type. The use rate of radio frequency source chambers, built in the $1^{st}$ and $2^{nd}$ generation process lines, was determined to be less than 75 %. In addition, that of remote plasma source chambers for the $3^{rd}$ generation was measured to be aboove 95 %. Therefore, the combined application of improved scrubber and the RPSC process chamber to the semiconductor and display process can reduce $NF_3$ emmision by 99.95 %. It is optimistic that the mission for the reduction of greenhouse gas emission can be realized in these LCD manufacturing companies in Korea.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.05a
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• pp.457-458
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• 2012