• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2005.05a
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• pp.219-223
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• 2005

Nowadays laser cutting is the most promising method of cutting FPD(Flat Panel Display) glass in mass-production line. And this method can also be used to cut other brittle materials such as quartz, sapphire, ceramic and semiconductor The concept of this method is shown in picture 1. Laser beam heats glass up to strain point, not to melting point and cooling system chills glass to induce maximun thermal stress in glass surface and then the thermal stress generates micro thermal crack, in other words blind depth of crack, along laser beam and cooling line.

• Proceedings of the Korean Society of Laser Processing Conference
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• 2004.10a
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• pp.50-61
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• 2004

Nowadays Laser Controllable Thermo-cleaving is the most promising method of cutting FPD(Flat Panel Display) glass in mass-production line. And this method can be used to cut other brittle materials such as quartz, sapphire, ceramic and semiconductor. The concept of this method is shown in Picture 1. Laser beam heats glass up to strain point not to melting point and cooling system chills glass to make maximum thermal stress in glass and then the thermal stress generates micro thermal crack in other words blind crack. Laser Controllable Thermo-cleaving controls the thermal stress to optimize the blind crack up to level of mass-production line.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.22 no.6
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• pp.913-920
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• 2013

This paper presents an applicable basic design that can configure non-contact levitation table for conveying a large sheet of glass. The suggested air levitation table consists of a series of air chambers with porous pads and fans as the conveyor system. The air supply chambers are arrayed to supply an adequately strong upward airflow for supporting the glass. Levitation is controlled by the size and discharge velocity, of the chamber arrays, as well as the glass supporting height. After pre-evaluation of the glass rigidity and the filer functional performance, a one-way fluid structure interface (FSI) analysis is performed for predicting pressure and deflection working of the 8G glass in the transverse and longitudinal directions, respectively. After comparing calculated levels of flatness of the glass, it determines the chamber array for the linear non-contact conveying motion.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.09a
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• pp.21-30
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• 2002

According the difference of flex substrate, (reel tape), there are three kind assembly types of LCD driver IC is COG, TCP and COF, respectively. The TCP is the maturest in these types for stability of raw material supply and other specification. And TCP is the major assembly type of LCD driver IC and the huge demand from Taiwan's large TFT LCD panel house since this spring. But due to its package structure and the raw material applied in this package, there is some limitation in fine pitch application of this package type, (TCP). So, COF will be very potential in compact and portable application comparison with TCP in the future. There are three kinds assembly methods in COF, one is ACF by using the anisotropic conductive film to connect the copper lead of tape and gold bump of IC, another is eutectic bonding by using the thermo-pressure to joint the copper lead of tape and gold bump of IC, and last is NCP by using non-conductive paste to adhere the copper lead of tape and gold bump of IC. To have a global realization, this paper will briefly review the status of Taiwan's large TFT panel house, the internal driver IC design house, and the back-end assembly house in the beginning. The different material property of raw material, PI tape is also compared in the paper. The more detail of three kinds of COF assembly method will be described and compared in this paper.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.36 no.7
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• pp.813-822
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• 2012

Abnormal operating sounds radiated from a moving transfer robot in LCD (liquid crystal display) product lines have been used for the fault detection line of a robot instead of other source signals such as vibrations, acoustic emissions, and electrical signals. Its advantage as a source signal makes it possible to monitor the status of multiple faults by using only a microphone, despite a relatively low sensitivity. The wavelet packet transform for feature extraction and the artificial neural network for fault classification are employed. It can be observed that the abnormal operating sound is sufficiently useful as a source signal for the fault diagnosis of mechanical components as well as other source signals.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.1330-1333
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• 2006

The channel shape of FFL(Flat Fluorescent Lamp) was designed by optical simulation. It was possible to design and manufacture the channel in any shape using glass forming. The best suitable brightness uniformity of 83.7% was achieved.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.06a
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• pp.1049-1050
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• 2009

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2007.06a
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• pp.475-476
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• 2007

• Korean Journal of Materials Research
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• v.17 no.1
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• pp.25-30
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• 2007

The in-situ scanning electron microscopy observation of real-time hillock evolution in pure hi thin films on glass substrate during Isothermal annealing was analyzed quantitatively to understand the compressive stress relaxation mechanism by focusing on the effect of Mo interlayer between Al film and glass substrate. There is a good correlation between the hillock-induced stress relaxation by in-situ scanning electron microscopy observation ana the measured stress relaxation by wafer curvature method. It is also clearly shown that the existence of Mo interlayer plays an important role in hillock formation probably due to the large difference in interfacial diffusivity of Al films.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.1
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• pp.26-32
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• 2003

Then-channel poly-Si thin-film transistors (poly-Si TFT's) formed by solid phase crystallization (SPC) method on glass were measured to obtain the electrical parameters such as of I-V characteristics, mobility, leakage current, threshold voltage, and subthreshold slope. Then, devices were analyzed to obtain the reliability and appliability on TFT-LCD with large-size and high density. In n-channel poly-Si TFT with 5$\mu\textrm{m}$/2$\mu\textrm{m}$, 8$\mu\textrm{m}$, 30$\mu\textrm{m}$ devices of channel width/length, the field effect mobilities are 111, 116, 125 $\textrm{cm}^2$/V-s and leakage currents are 0.6, 0.1, and 0.02 pA/$\mu\textrm{m}$, respectively. Low threshold voltage and subthreshold slope, and good ON-OFF ratio are shown, as well. Thus. the poly-Si TFT's used by SPC are expected to be applied on TFT-LCD with large-size and high density, which can integrate the display panel and peripheral circuit on a targe glass substrate.