• Title/Summary/Keyword: Kissinger equation

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Application of Crystallization Kinetics on Differential Thermal Analysis (열시차 분석에 대한 결정화 Kinetics의 응용)

  • 이선우;심광보;오근호
    • Journal of the Korean Ceramic Society
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    • v.35 no.11
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    • pp.1162-1170
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    • 1998
  • Applicability of crystallization kinetics on thermal analysis was investigated for PbO-TiO2-B2O3-BaO glass systems together with theoretical background of kinetics and electron microscopic observations on nu-cleation and crystallization. Kissinger equation can be used on DTA under the assumption that the nucleus density is fixed during DTA runs. Crystallization mechanism affected on the activation energy Ek obtained from powder samples which is used for domination of surface crystallization. Avrami parameter n that was obtained from Ozawa equation represented closely the crystallization mechanisms observed by an electron microscope. The modified Kissinger equation takes into account crystallization mechanism thereby pro-ducing the true activation energy of crystallization.

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Cure Kinetics of DGEBA/MBA/MN and DGEBA/MDA/MN/HQ Systems by Kissinger Equation and Fractional Life Method (Kissinger Equation과 Fractional Life법에 의한 DGEBA/MDA/MN계와 DGEBA/MDA/MN/HQ계의 경화반응 속도론)

  • Lee, Jae-Young;Shim, Mi-Ja;Kim, Sang-Wook
    • Applied Chemistry for Engineering
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    • v.5 no.4
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    • pp.731-736
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    • 1994
  • Cure kinetics of DGEBA/MDA/MN system with and without HQ were studied by Fractional life method and Kissinger equation. And the effect of HQ as a catalyst was studied. As cure temperature increased, the reaction rate increased and reaction order was almost constant. The activation energy of the system with HQ was lower about 13% and the reaction rate was higher than that of the system without HQ. It was because hydroxyl group of HQ formed a transition state with epoxide group and amine group and opened the epoxide ring easily and rapidly.

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Thermal Aging Predictions of Polymeric Materials from Arrhenius Plot Using TGA

  • Sim, Dae-Seop;Park, Seong-Gyun;Lee, Cheol-Ho
    • The Transactions of the Korean Institute of Electrical Engineers C
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    • v.51 no.10
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    • pp.473-478
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    • 2002
  • Accelerated thermal aging conditions of polymeric materials were studied by Kissinger equation with TGA analysis. The activation energy was obtained from the slope of straight line of each specimen at the different TGA heating rate. Estimating activation energy from Kissinger equation was acquired, and the resulting calculation showed that 3.59, 3.0, 3.86, 3.73 for the PEEK, polyimide, polysulfone and Viton, respectively. The studied polymeric specimens are used for electrical penetration assembly in nuclear power plant. Accelerated aging time and temperature were also determined corresponding to actual service temperature and 41 years.

Cure and Thermal Degradation Kinetics of Epoxy/Organoclay Nanocomposite

  • Park, Jae-Jun
    • Transactions on Electrical and Electronic Materials
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    • v.13 no.4
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    • pp.204-207
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    • 2012
  • Epoxy nanocomposite was synthesized through the exfoliation of organoclay in an epoxy matrix, which was composed of diglycidyl ether of bisphenol A (DGEBA), 4,4'-methylene dianiline (MDA) and malononitrile (MN). Organoclay was prepared by treating the montmorillonite with octadecyl trimethyl ammonium bromide (ODTMA). The exfoliation of the organoclay was estimated by wide angle X-ray diffraction (WAXD) analysis. In order to measure the cure rate of DGEBA/MDA (30 phr)/MN (5 phr)/organoclay (3 phr), differential scanning calorimetry (DSC) analysis was performed at various heating rates, and the data were interpreted by Kissinger equation. Thermal degradation kinetics of the epoxy nanocomposite were studied by thermogravimetric analysis (TGA), and the data were introduced to the Ozawa equation. The activation energy for cure reaction was 45.8 kJ/mol, and the activation energy for thermal degradation was 143 kJ/mol.

Press Molding Conditions for the Preparation of Bipolar Plate in Epoxy/Carbon System (에폭시/탄소계 Bipolar Plate 제조를 위한 Press Molding 조건 연구)

  • Choi, Bumchoul;Lee, Jaeyoung;Lee, Jijung;Lee, Hongki
    • 한국신재생에너지학회:학술대회논문집
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    • 2010.06a
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    • pp.144.2-144.2
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    • 2010
  • Bipolar plate는 고분자 전해질 연료전지(PEMFC)에서 핵심 부품 중의 하나이고, 전해질 막이나 촉매 등에 비해서는 상대적으로 쉽게 접근할 수 있기 때문에 많은 연구가 수행되고 있다. Bipolar plate를 제조하는 기술은 크게 금속을 프레스 가공하는 방법, graphite 판을 직접 밀링하는 방법 및 고분자/카본계의 press molding 법 등 3가지로 분류되며, 본 연구에서는 3번째 방법에 의해서 bipolar plate를 대량 생산하는 방법에 대해 연구하였다. 고분자 매트릭스는 에폭시계 수지를 사용하였고, 카본계 재료는 graphite 분말과 carbon nanotube를 사용하였다. 이들 재료들을 일정한 비율로 혼합한 후 differential scanning calorimetry(DSC)를 사용하여 열분석 하였고, 그 결과를 Kissinger equation에 대입하여 경화반응 속도론을 연구하였다. 또한, 경화된 에폭시/탄소 복합재료의 전기전도도, 유리전이온도, 표면에너지 특성 등을 분석하였다.

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Cure Kinetcs of DGEBA/MDA/GN/HQ System by DSC Analysis (DSC 분석에 의한 DGEBA/MDA/GN/HQ계의 경화반응 속도론)

  • Lee, J.Y.;Shim, M.J.;Kim, S.W.
    • Applied Chemistry for Engineering
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    • v.5 no.5
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    • pp.904-909
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    • 1994
  • Cure kinetics of DGEBA(diglycidyl ether of bisphenol A)/MDA(4,4'-methylene dianiline)/GN(glutaronitrile) system with and without HQ(hydroquinone) as a catalyst was studied by Kissinger equation and Fractional life method. The activation energy of the system with HQ was somewhat lower and the pre-exponential factor of that was higher by about 30% than those of the system without HQ. As 1.25phr of HQ was added, reaction rates increased about 1.8 times.

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Cure Kinetics of DGEBA/MDA/HQ-PGE System (DGEBA/MDA/HQ-PGE계의 경화 반응 속도론)

  • Song, Young-Wook;Shim, Mi-Ja;Kim, Sang-Wook
    • Applied Chemistry for Engineering
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    • v.7 no.2
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    • pp.356-361
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    • 1996
  • Cure kinetics of diglycidyl ether of bisphenol A(DGEBA)/4,4'-methylene dianiline(MDA) with hydroquinone-phenyl glycidyl ether(HQ-PGE) as a reactive additive, which was preliminarily synthesized, was investigated by DSC and FT-IR analyses. Kissinger equation and Arrhenius' equation were used to calculate activation energy and pre-exponential factor. When HQ-PGE was added to DGEBA/MDA system, it reduced activation energy of system. When the 5 phr of HQ-PGE was added to DGEBA/MDA system, activation energy was 7.8 kcal/mol by FT-IR analysis and 11.3 kcal/mol by DSC, in comparison with the system without HQ-PGE, activation energy decreased about 30% and 9%, respectively. According to these results, HQ-PGE, introducing agent of this system, acted as a catalyst.

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Evaluation of Thermal Aging on PVC Using Thermo Gravimetry Analysis and Accelerated Thermal Aging Test (TGA와 가속열화를 이용한 전선 피복용 PVC의 열적 열화평가)

  • 박형주;김기환;김홍
    • Fire Science and Engineering
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    • v.18 no.3
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    • pp.45-50
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    • 2004
  • Thermal degradation of PVC which used for insulator of 600V vinyl insulated wire has been studied by thermo gravimetry analysis and accelerated thermal aging test. The activation energy using thermo gravimetry analysis was determined by the kinetic methods, such as Kissinger and Flynn-Wall-Ozawa. The activation energy was determined to from 89.29 kJ/mol to 111.39 kJ/mol in 600V PVC insulated wire and from 97.80 kJ/mol to 119.25 kJ/mol in 600v heat-resistant PVC insulated wire. And also, the activation energy through a long-term thermal aging test was calculated by using Arrhenius equation In the low temperature of 8$0^{\circ}C$, 9$0^{\circ}C$, 10$0^{\circ}C$. The results showed that 600V PVC insulated wire was 92.16 kJ/mol, and 600v heat-resistant PVC insulated wire was 97.52 kJ/mol. Consequently, the activation energy of 600V heat-resistant PVC insulated wire is larger than 600V PVC insulated wire. Therefore, it can be predicted that 600V heat-resistant PVC insulated wire has a long-term stability relatively.

Cure Kinetics of Cycloaliphatic Epoxy/Silica System for Electrical Insulation Materials in Outdoor Applications

  • Lee, Jae-Young;Park, Jae-Jun;Kim, Jae-Seol;Shin, Seong-Sik;Yoon, Chan-Young;Cheong, Jong-Hoon;Kim, Young-Woo;Kang, Geun-Bae
    • Transactions on Electrical and Electronic Materials
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    • v.16 no.2
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    • pp.74-77
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    • 2015
  • The cure kinetics of a neat epoxy system and epoxy/silica composite were investigated by DSC analysis. A cycloaliphatic type epoxy resin was diglycidyl 1,2-cyclohexanedicarboxylate and curing agent was anhydride type. To estimate kinetic parameters, the Kissinger equation was used. The activation energy of the neat epoxy system was 88.9 kJ/mol and pre-exponential factor was 2.64×1012 min−1, while the activation energy and pre-exponential factor for epoxy/silica composite were 97.4 kJ/mol and 9.21×1012 min−1, respectively. These values showed that the silica particles have effects on the cure kinetics of the neat epoxy matrix.

Cure Kinetics of DGEBA/MDA/SN/HQ Thermosetting Matrix (열경화성 DGEBA/MDA/SN/HQ 매트릭스의 경화반응 속도)

  • Lee, Jae-Yeong;Sim, Mi-Ja;Kim, Sang-Uk
    • Korean Journal of Materials Research
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    • v.5 no.6
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    • pp.667-672
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    • 1995
  • Cure kinetics of DGEBA(diglycidyl ether of bisphenol A)/MDA(4, 4'-methylene dianiline)/SN(succinonitrile) system and DGEBA/MDA/SN/HQ(hydroquinone) system was studied by Kissinger equation and Fractional life method through DSC in the temperature range of 85∼150$^{\circ}C$. As cure temperature was increased, reaction rate increased and reaction order was almost constant. The reaction rate of the system with HQ as a catalyst was more higher and activation energy of that was lower about 20% than those of the system without HQ. Starting temperature of cure reaction for DGEBA/MDA/SN/HQ system decreased about 30$^{\circ}C$ than that of DGEBA/MDA/SN system.

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